Provided are a light board, a method for manufacturing the same, a light-emitting diode (LED) backlight module and an LED backlight device. The light board includes a substrate and a LED device. The substrate includes a first surface and a second surface disposed opposite to each other. The first surface and the second surface are each provided with a wiring area and a non-wiring area. A first heat sink assembly and multiple first reinforcement ribs are disposed in the non-wiring area of the first surface. The multiple first reinforcement ribs intersect to form a first encircled area. The first heat sink assembly is disposed in the first encircled area. The LED device is disposed in the wiring area of the second surface.

A multi-conductor bus with radially arranged conductor wires on which addressable bead devices that may incorporate light-emitting diodes (LEDs) or other surface mount devices (SMDs) can be easily mounted. The radial bus is designed to provide an improved range of flexibility and motion while allowing for easy addition of bead devices along its length that utilize self-addressing bus protocols such as cascading device protocols. The design of the flexible, interruptible radial bus facilitates the use of pass-through and interrupted paths along the bus that simplifies the installation of addressable devices along the bus such as the bus-mounted bead devices disclosed herein.

An illuminating circuit structure includes a film sheet, an illuminant, a printed baseline layer, and a printed pad layer. The printed baseline layer includes a first baseline segment and a second baseline segment printed on the film sheet, while the printed pad layer includes a first bar pad and a second bar pad. For a first baseline head of the first baseline layer and a first pad head of the first bar pad, one of which extends along a first direction and the other of which extends along a second direction not parallel to the first direction. Therefore, the first baseline segment and the first bar pad achieve electrical connection despite of an existed print shifting. Similarly, a second baseline head of the second baseline layer and a second pad head of the second bar pad also can achieve electrical connection despite of an existed print shifting.

An LED panel light includes a flexible base film, a plurality of circuits arranged on the flexible base film and a plurality of LED lamp beads arranged on the flexible base film, each circuit is connected with at least one LED lamp bead and is provided with at least two mutually parallel conductive wires. The conductive wire consists of a plurality of secondary conductive wires, and a plurality of the secondary conductive wires form a mesh. A method of making a LED panel light includes the following specific steps: S1: providing a flexible base film; S2: manufacturing a plurality of mesh-type conductive wires on the flexible base film by using a mould with circuit patterns of LED panel light; conductive wires forming a circuit, and a plurality of the circuits forming an LED panel light circuit; S3: connecting LED lamp beads with the conductive wires in the circuits.

A set including a plug connectable LED and a packaged photocurable composition. It relates also to methods for applying that article. The photocurable composition includes cyanoacrylate monomers and/or acrylate monomers, and a visible light photoinitiator system. The plug connectable LED, when connected to a host mobile device including a rechargeable battery, allows energisation of the LED so that it can be used as a convenient light source to cure the photocurable composition. The set itself does not comprise a battery or, batteries. The set is a versatile consumer product in the field of adhesives, fillers, sealants and coatings.

The present disclosure provides a light strip, including a circuit board. A plurality of LEDs is arranged on the circuit board and spaced apart from each other in an extension direction of the circuit board, a positive connection end and a plurality of negative connection ends are arranged on the circuit board, and a plurality of LEDs is coupled between each negative connection end and the positive connection end. A plurality of LEDs between the first negative connection end and the positive connection end includes a head-end LED and a tail-end LED. The plurality of LEDs between the first negative connection end and the positive connection end includes a first LED and a second LED arranged at opposite sides of a first position in the extension direction of the circuit board. The present disclosure further provides a backlight module and a display module.

An electronic device is provided and includes a bearing member defined with a bearing surface, and at least one electronic element disposed on the bearing member, where the electronic element is disposed on the bearing member in a manner that can be inclined relative to the bearing surface, such that when the electronic element is a light-emitting element, the light presented by the electronic element can effectively illuminate a predetermined area.

Disclosed are RCLED lamp bead packaging process and RCLED lamp bead, which comprises steps of: dispensing a die-bonding glue, mounting a chip, baking, welding a bonding wire, dispensing a first layer of anti-reflection adhesive, baking, dispensing a second layer of anti-reflection adhesive, baking, and testing. Anti-reflection adhesive is dispensed in corresponding area to cover part capable of reflecting light in RCLED lamp bead and eliminate reflection effect effectively. The first layer of anti-reflection adhesive fills in specified area rapidly to achieve high production efficiency. The second layer of anti-reflection adhesive flows slowly after glue dispensing, so that the glue dispensing precision is improved and the light-emitting hole is prevent from being covered. When bonding wire is welded, a bracket is the first welding spot and a PAD of the chip is the second welding spot to achieve a lower radian of the bonding wire.

Methods and devices are described. A device includes an optical carrier part and a heatsink bulk part. The optical carrier part has an LED mounting area configured to receive an LED and an alignment feature configured for aligning with an optical component. The heatsink bulk part is separate from the optical carrier part and joined to the optical carrier part, such that the optical carrier part and the heatsink bulk part in conjunction are configured to perform a thermal management of an LED module, including the LED, and the heatsink bulk part, in operation.

An illumination device (e.g., an electric candle, etc.) generally includes a shell, a housing coupled to the shell, a flame-shaped head disposed at least partially outside of the shell, and a pendulum supporting the flame-shaped head. The pendulum is pivotally coupled to the housing and configured to move the flame-shaped head relative to the housing. The illumination device also includes a first light source configured to illuminate the flame-shaped head, a second light source arranged inside the shell and configured to illuminate the shell, and a printed circuit board assembly operable to control the first light source to illuminate the flame-shaped head and the second light source to illuminate the shell.