The invention relates to a flexible printed-circuit strip to whose upper face and/or lower face electronic components can be or are mounted, wherein it is subdivided in the direction of its longitudinal extension (L) into first and second surface zones (F1, F2) and it is subdivided perpendicular to the longitudinal direction (L) into a first edge region (SB1) and a second edge region (SB2), the two strip portions (SB1, SB2) being on both sides of a common longitudinal line (LL), wherein all the first surface zones (F1) are arranged in the first edge region (SB1) and all the second surface zones (F2) are arranged in the second edge region (SB2), and wherein first and second surface zones (F1, F2) that are adjacent in longitudinal direction (L) are respectively connected by a connecting web (V) that crosses the longitudinal line (LL). The invention further relates to a flexible printed-circuit strip that is subdivided in the direction of its longitudinal extension (L) into first and second surface zones (F1, F2) in the direction of its longitudinal extension (L), wherein the first surface zones (F1) are arranged on a first plane and the second surface zones (F2) are arranged on a second plane that is oriented differently from the first, and wherein a connecting web (V) that extends perpendicular to the longitudinal direction (L) is embodied so as to be bent about a bend line (BL) that is parallel to the longitudinal direction (L). The invention also relates to an LED luminaire comprising such a printed-circuit strip.

An LED groove system has a tray having a tray sidewall; a base plate formed as a flat portion on the tray, wherein the base plate is bounded by the tray sidewall; a plurality of grooves formed on the base plate, wherein the grooves increase the rigidity of the base plate; and LED strips mounted in the plurality of grooves. The LED strips have LED chips mounted to them. The plurality of grooves includes column grooves and row grooves. The column grooves intersect the row grooves. A column groove sidewall is formed on the column groove and wherein a row groove sidewall is formed on the row groove.

An LED lamp that can take the place of incandescent lamps. An elevated light source is positioned above a screw-type base. A first plurality of LEDs is connected in a series on one side of a flat substrate and a second plurality of LEDs, equal in number to the first, is connected in series on an opposite side of the substrate. Each LED of the first and second plurality of LEDs is mounted proximate a heat sink and a drive circuit is provided for the LEDs, with the drive circuit being located proximate and electrically connected to the screw base.

A dual-color light string comprising a first insulated electrical wire cord, a second insulated electrical wire, two light-emitting diode devices (LED devices) and transparent glue. The first insulated electrical wire is partially exposed to form a first soldering section. The second insulated electrical wire is partially exposed to form a second soldering section. The two LED devices are respectively electrically connected to the first soldering section and the second soldering section, and the directions of bias of the two LED devices from the first soldering section to the second soldering section are opposite to each other; The transparent glue covers the two LED devices, the first soldering section and the soldering section, extends to partially cover a first insulating layer of the first insulated electrical wire and a second insulating layer of the second insulated electrical wire.

An LED filament light including a bulb, a support bar, at least two electrode wires and at least two LED filament strips. Each LED filament strip including a base, an LED chip is set on the base and an electrode is fixed at both ends of the base. One end of the electrode is electrically connected with an LED chip on the base, the other end of the electrode is electrically connected with an electrode of another LED filament or electrically connected to one end of the electrode wires so that the support bar is fixed to the bulb, and the other end is connected with at least one. As the support bar is set to replace the existing LED filament light core and metal wire, and creatively the LED filament electrodes directly is connected to each other.

An LED filament and lamp, and a manufacturing process of an LED filament the LED filament includes a PCB substrate and multiple LED chips, connecting circuits are provided on the PCB substrate, a positive pin and a negative pin are provided at two ends of the connecting circuit, respectively, and each LED chip is electrically connected to the connecting circuit; and a fluorescent glue layer is provided outside the PCB substrate and the LED chips, and the positive pin and the negative pin are exposed from the fluorescent glue layer. The LED lamp includes the LED filament. The manufacturing process of an LED filament enables manufacturing an LED filament. For the LED filament and lamp, and the manufacturing process of an LED filament, a PCB substrate is used as a base material, connecting circuits are fabricated on the PCB substrate, the connecting circuits are directly used for connecting LED chips.

A light emitting device includes a plurality of oblong flexible substrates, each flexible substrate comprising a sheet-shaped base body and a wiring pattern formed on one face of the base body, and each flexible substrate having a plurality of light emitting sections disposed thereon; a plurality of a reflective layers, each reflective layer being disposed at a periphery of a respective light emitting section above a respective flexible substrate; an insulating reflective sheet made of a light reflecting resin, the reflective sheet having a plurality of through holes located such that the light emitting sections and at least a portion of the reflective layers are exposed via the through holes; and a plurality of adhesive members, each adhesive member adhering a respective flexible substrate to the reflective sheet in regions where the reflective layer is not formed.

A light emission system includes fixture assembly including a chassis and a driver board. The driver board includes a plurality of drivers. The system further includes a plurality of modular emitting devices each configured to removably couple to the fixture assembly. The modular emitting devices including a heat sink, an emitting implement, and an emitter board. The emitter board is bonded to the heat sink.

A method of manufacturing support elements for lighting devices includes: providing an elongated, electrically non-conductive substrate with opposed surfaces, with an electrically-conductive layer extending along one of said opposed surfaces, etching said electrically-conductive layer to provide a set of electrically-conductive tracks extending along the non-conductive substrate with at least one portion of the non-conductive substrate left free by the set of electrically-conductive tracks, forming a network of electrically-conductive lines coupleable with at least one light radiation source at said portion of said non-conductive substrate left free by the electrically-conductive tracks. Said forming operation includes selectively removing e.g. via laser etching a further electrically-conductive layer provided on said non-conductive substrate, or printing electrically-conductive material onto the non-conductive substrate. The electrically-conductive tracks and the network of electrically-conductive lines may be coupled with each other e.g. by means of electrically-conductive vias extending through the non-conductive substrate.

A light source unit disclosed in an embodiment includes a first cover which has an open region; a second cover which is coupled to the first cover; a light source module which is disposed between the first cover and the second cover, and has a light-emitting device disposed on the open region and a circuit board on which the light-emitting device is disposed; a fixing frame which is disposed between the second cover and the circuit board; and a resin member which is filled in an region between the first cover and the second cover and supports the light source module and the fixing frame. The light source module includes a moisture-proof film which covers an upper surface and side surfaces of the light-emitting device and extends to an upper surface of the circuit board.