There is provided a multipurpose bracket including a horizontal portion, a right vertical portion, and a left vertical portion. The horizontal portion has a hook on a front surface of the horizontal portion, and a downward protrusion at a lower edge of the horizontal portion. The right vertical portion is connected at a right end of the horizontal portion, and has a right-upper protrusion and a right-lower protrusion. The left vertical portion is connected at a left end of the horizontal portion, and has a left-upper protrusion and a left-lower protrusion.

A wall pack light fixture including a front cover having a recess with a contact surface and at least one electronic component mounted on the contact surface, a rear enclosure having a forward-facing open front with a forward-facing front edge, and a hinge having a first portion connected to the front cover and a second portion pivotably coupled to the first portion, the second portion connected to the rear enclosure on an exterior side surface of the rear enclosure behind the forward-facing front edge, wherein the front cover is rotatable about the hinge between a closed configuration, in which the contact surface is against the forward-facing front edge, and an open configuration.

A system for mounting pendant lighting fixtures includes an interface component adapted to be at least partially retained in an opening defined by a ceiling. The interface component defines at least one aperture to accommodate a hanging support extending through the opening and configured to support a pendant lighting fixture. The system includes a cover plate defining at least one aperture to accommodate the hanging support. The system also includes at least one magnetic element operable to exert a magnetic bias on the cover plate to secure the cover plate against the interface component and at least partially cover the opening.

A downlight apparatus is designed to be installed in a cavity of a ceiling. The downlight apparatus includes a base part, a major part and a connector. The base part has a shape to be fixed in the cavity of the ceiling. The base part has a base housing for defining a through hole and a light window. The major part includes a major housing, a light source and a driver circuit. The connector connects the major housing and the base housing. The connector provides multiple candidate positions for a user to configure to change a relative position of the base part and the major part so as to change an output light defined determined by the light window and the light source.

Mounting brackets for installing extruded profiles on surfaces, such as walls, ceilings, tile surfaces, etc., may be resilient. The mounting bracket may include a coil spring designed to rotate or pivot with respect to a main body. The spring may apply force to a rear of the surface thus holding or maintaining the mounting bracket in place. The mounting bracket may be a flat spring. The flat spring may apply force to side surfaces of an opening formed in the surface thus holding or maintaining the mounting bracket in place. The mounting bracket may hold an elongated profile designed for recessed LED lighting to the surface.

A LED downlight apparatus includes a light source plate, a heat sink, a reflective cup and a driver container. The reflective cup reflects light of the light source plate and the heat sink is arranged between the driver container and the light source plate.

Disclosed herein is a downlight, which includes an optoelectronic module and a rim module. The optoelectronic module includes a light source driving board, a back housing, and a front housing. The light source driving board is disposed between the back housing and the front housing. The light source driving board includes a light-emitting diode unit and a driving circuit. The rim module has a central opening for accommodating the optoelectronic module. The rim module is not integrally formed with the optoelectronic module.

An integrated ceiling and light system that incorporates a light module into a ceiling tile. The system may include a grid support system suspended from an overhead support structure that includes at least one grid support element and first and second ceiling tiles supported by the grid support element in an adjacent manner A nesting cavity may be formed into the first and second ceiling tiles such that a light module may be disposed within the nesting cavity and coupled to the first and second ceiling tiles. The ceiling tiles may be of the type that conceals the grid support element on which it is supported. In one alternative embodiment, the light module and a nesting region of the ceiling tile may include corresponding edge profiles to facilitate mating therebetween to enable coupling of the light source to the ceiling tile.

A retrofit trim lighting device is provided. In example embodiments, the retrofit trim lighting device comprises a bracket comprising an opening; at least one torsion spring secured to the bracket and configured to mount the retrofit trim lighting device within a recessed housing; a retrofit housing comprising at least one light engine; and an engagement element. The engagement element is secured to the retrofit housing through the opening of the bracket such that, when so secured, the retrofit housing and the bracket are rotatable relative to one another.

An integrated ceiling device (80, 120) includes an electronics assembly (56) and a mechanical arrangement (20). The mechanical arrangement includes a housing (22), a heat dissipating structure (24), and support arms (26). The housing is configured to retain the electronics assembly. The heat dissipating structure includes a lamp seat (50) for receiving a light source (54), and a central opening (34) surrounded by fins (36). The support arms extend between and interconnect the housing with the heat dissipating structure. The housing is positioned within the central opening and is spaced apart from the fins of the heat dissipating structure to enable a free flow of air in an air gap (42) between the housing (22) and the structure (24). The electronics assembly may include a plurality of elements (160, 162, 164, 166) retained in the housing which are spaced apart from the heat dissipating structure.