A runway-embedded flash lighting device, including: a body; a ceiling member; a light guide member; and an LED flash light source, wherein the body is configured to be embedded in a runway, the ceiling member is disposed in an upper opening of the body and configured to be exposed to a runway surface when the body is embedded in the runway, the ceiling member includes a flash emission window, the light guide member is disposed in the flash emission window, the LED flash light source is disposed inside the body and configured to emit a flash toward the light guide member, and the light guide member is configured to allow the flash emitted from the LED flash light source to be emitted from the flash emission window to outside the runway-embedded flash lighting device.

A runway-embedded flash lighting device, including: a body; a ceiling member; a light guide member; and an LED flash light source, wherein the body is configured to be embedded in a runway, the ceiling member is disposed in an upper opening of the body and configured to be exposed to a runway surface when the body is embedded in the runway, the ceiling member includes a flash emission window, the light guide member is disposed in the flash emission window, the LED flash light source is disposed inside the body and configured to emit a flash toward the light guide member, and the light guide member is configured to allow the flash emitted from the LED flash light source to be emitted from the flash emission window to outside the runway-embedded flash lighting device.

A wavelength conversion member includes a ceramic fluorescent body for converting a wavelength of incident light, a heat radiation member for radiating heat of the ceramic fluorescent body to an outside atmosphere, and a solder layer for joining together the ceramic fluorescent body and the heat radiation member. The solder layer includes a joining portion disposed between the ceramic fluorescent body and the heat radiation member and a protruding portion protruding outward from an outer circumferential portion of the ceramic fluorescent body. The protruding portion is spaced apart from a side surface formed on the outer circumferential portion of the ceramic fluorescent body. In the solder layer, the maximum value of thickness of the protruding portion is greater than the average value of thickness of the joining portion.

A wavelength conversion member includes a ceramic fluorescent body for converting a wavelength of incident light, a heat radiation member for radiating heat of the ceramic fluorescent body to an outside atmosphere, and a solder layer for joining together the ceramic fluorescent body and the heat radiation member. The solder layer includes a joining portion disposed between the ceramic fluorescent body and the heat radiation member and a protruding portion protruding outward from an outer circumferential portion of the ceramic fluorescent body. The protruding portion is spaced apart from a side surface formed on the outer circumferential portion of the ceramic fluorescent body. In the solder layer, the maximum value of thickness of the protruding portion is greater than the average value of thickness of the joining portion.

Methods and devices are described. A device includes an optical carrier part and a heatsink bulk part. The optical carrier part has an LED mounting area configured to receive an LED and an alignment feature configured for aligning with an optical component. The heatsink bulk part is separate from the optical carrier part and joined to the optical carrier part, such that the optical carrier part and the heatsink bulk part in conjunction are configured to perform a thermal management of an LED module, including the LED, and the heatsink bulk part, in operation.

Methods and devices are described. A device includes an optical carrier part and a heatsink bulk part. The optical carrier part has an LED mounting area configured to receive an LED and an alignment feature configured for aligning with an optical component. The heatsink bulk part is separate from the optical carrier part and joined to the optical carrier part, such that the optical carrier part and the heatsink bulk part in conjunction are configured to perform a thermal management of an LED module, including the LED, and the heatsink bulk part, in operation.

A light assembly includes a base, and a first light source supported by the base. The first light source includes a first light emitting diode configured to emit light in a first direction from the base. The light assembly additionally includes a second light source supported by the base, the second light source including a plurality of second light emitting diodes configured to emit light in a second direction from the base. The second light source is obliquely oriented relative to the base. The light assembly additionally includes a diffuser supported by the base, the diffuser extending upwardly from the base to enclose the first light source. The diffuser diffuses light emitted from the first light source to the surrounding area in an upward and outward direction.

A light assembly includes a base, and a first light source supported by the base. The first light source includes a first light emitting diode configured to emit light in a first direction from the base. The light assembly additionally includes a second light source supported by the base, the second light source including a plurality of second light emitting diodes configured to emit light in a second direction from the base. The second light source is obliquely oriented relative to the base. The light assembly additionally includes a diffuser supported by the base, the diffuser extending upwardly from the base to enclose the first light source. The diffuser diffuses light emitted from the first light source to the surrounding area in an upward and outward direction.

A light emitting device filament includes a substrate, a plurality of light emitting diodes, two electrode pads, and a plurality of connection lines. The substrate includes a first surface and a second surface opposite to the first surface. The substrate extending in a first direction and having a width in a second direction. The plurality of light emitting diodes is disposed on the first surface of the substrate. The two electrode pads are disposed on the substrate. The plurality of connection lines electrically connects the plurality of light emitting diodes and the two electrode pads. The plurality of connection lines includes a first connection line and a second connection line. The first connection line, the second connection line, or both are formed in a direction inclined or curved with respect to the first direction or the second direction.

A runway-embedded flash lighting device, including: a body; a ceiling member; a light guide member; and an LED flash light source, wherein the body is configured to be embedded in a runway, the ceiling member is disposed in an upper opening of the body and configured to be exposed to a runway surface when the body is embedded in the runway, the ceiling member includes a flash emission window, the light guide member is disposed in the flash emission window, the LED flash light source is disposed inside the body and configured to emit a flash toward the light guide member, and the light guide member is configured to allow the flash emitted from the LED flash light source to be emitted from the flash emission window to outside the runway-embedded flash lighting device.