A lighting module is disclosed. The lighting module includes a light emitting diode (LED) light source, and a total internal reflection (TIR) optical assembly. The optical assembly includes a refractor configured to be located proximate to the LED light source, and a reflector configured to be attached to the refractor. The refractor is made from a material that is resistant to thermal damage when exposed to heat generated by the LED light source.

A lighting device that protects a member related to light emission from heat associated with light emission includes a light source, a first optical member configured to transmit light emitted by the light source, a second optical member, arranged between the light source and the first optical member, configured to transmit light emitted by the light source, and an air-sending mechanism configured to send air suctioned from a first space that is an inner space on a side nearer to the light source than the second optical member and includes the light source to a second space that is a space between the first optical member and the second optical member.

A lighting device that protects a member related to light emission from heat associated with light emission includes a light source, a first optical member configured to transmit light emitted by the light source, a second optical member, arranged between the light source and the first optical member, configured to transmit light emitted by the light source, and an air-sending mechanism configured to send air suctioned from a first space that is an inner space on a side nearer to the light source than the second optical member and includes the light source to a second space that is a space between the first optical member and the second optical member.

A system includes a heat sink module and a driving circuit module. The heat sink module includes stepped through-holes that each includes a cylindrical upper and lower portions connected by a ring-shaped surface. The bottom surface of the heat sink module includes grooves that respectively pass through the lower portions of respective sequences of the stepped through-holes. The driving circuit module includes conductive connectors and electrical driving surfaces that are disposed external to the heat sink module. Each conductive connector lies within a respective groove in the bottom surface of the heat sink module. The conductive connectors include internal connectors that each link at least two stepped through-holes in a respective sequence of stepped through-holes passed by a respective groove, and include external connectors that each link at least one stepped through-hole in the respective sequence of stepped through-holes to the electrical driving surfaces.

A system includes a heat sink module and a driving circuit module. The heat sink module includes stepped through-holes that each includes a cylindrical upper and lower portions connected by a ring-shaped surface. The bottom surface of the heat sink module includes grooves that respectively pass through the lower portions of respective sequences of the stepped through-holes. The driving circuit module includes conductive connectors and electrical driving surfaces that are disposed external to the heat sink module. Each conductive connector lies within a respective groove in the bottom surface of the heat sink module. The conductive connectors include internal connectors that each link at least two stepped through-holes in a respective sequence of stepped through-holes passed by a respective groove, and include external connectors that each link at least one stepped through-hole in the respective sequence of stepped through-holes to the electrical driving surfaces.

A lighting module is disclosed. The lighting module includes a light emitting diode (LED) light source, and a total internal reflection (TIR) optical assembly. The optical assembly includes a refractor configured to be located proximate to the LED light source, and a reflector configured to be attached to the refractor. The refractor is made from a material that is resistant to thermal damage when exposed to heat generated by the LED light source.

A system includes: a heat sink module with a plurality of first through-holes linking its top and bottom surfaces and a plurality of grooves on the bottom surface, wherein each groove passes through a respective sequence of the first through-holes; and a driving circuit module with a plurality of conductive connectors and electrical driving surfaces that are disposed substantially perpendicular to the top and bottom surfaces of the heat sink module, wherein each conductive connector lies partially within a respective groove in the bottom surface of the heat sink module, the conductive connectors include internal connectors that each links at least two of the first through-holes in a respective sequence of first through-holes, and external connectors that each links at least one of the first through-holes in a respective sequence of first through-holes to an electrical driving surfaces of the driving circuit module.

A system includes: a heat sink module with a plurality of first through-holes linking its top and bottom surfaces and a plurality of grooves on the bottom surface, wherein each groove passes through a respective sequence of the first through-holes; and a driving circuit module with a plurality of conductive connectors and electrical driving surfaces that are disposed substantially perpendicular to the top and bottom surfaces of the heat sink module, wherein each conductive connector lies partially within a respective groove in the bottom surface of the heat sink module, the conductive connectors include internal connectors that each links at least two of the first through-holes in a respective sequence of first through-holes, and external connectors that each links at least one of the first through-holes in a respective sequence of first through-holes to an electrical driving surfaces of the driving circuit module.

This disclosure relate to power control of an optical module. In one implementation, an optical module is disclosed. The optical module comprises a first edge connector pin, a microcontroller unit (MCU), and a power supply control unit disposed on a circuit board, wherein the first edge connector pin is configured to receive a control signal sent by a main-unit device during power up of the optical module; the MCU is electrically connected to the first edge connector pin and the power supply control unit, and is configured to read the control signal using the first edge connector pin, and when the control signal is a first-type control signal, send a corresponding type indication information to the power supply control unit; and the power supply control unit is configured to receive the type indication information sent by the MCU, and stop, according to the type indication information, supplying power.

The present disclosure generally relates to optical modules, and in particular, to an optical module comprising a printed circuit board for reducing crosstalk between differential signal lines. In one implementation, the printed circuit board comprises a top layer, a first intermediate signal transmission layer, a second intermediate signal transmission layer, a bottom layer and multiple ground layers between signal transmission layers. Each signal transmission layer comprises one or more differential signal line pairs. The top layer and the bottom layer each comprises an edge connector, and the top layer further comprises a laser driver chip. The signal transmission layers are connected to the edge connectors and laser driver chips via a combination of blind and through connection holes such that the interference between the differential signal line pairs of various signal transmission layers are reduced.