A light bulb (1) is disclosed. The light bulb (1) comprises: a connector (2) for mechanically and electrically connecting the light bulb (1) to a light bulb socket; a light source (4) electrically connected to receive electrical power from the connector (2), wherein the light source (4) is separated from the connector (2) along a central axis (A) of the light bulb (1); and an internal structure (5) arranged along the central axis (A) between the connector (2) and the light source (4), wherein an axial direction is defined along the central axis (A) from the connector (2) towards the internal structure (5). The light bulb (1) further comprises a light-transmissive optical element (7) provided with an internal cavity (8) housing the light source (4) and the internal structure (5), the optical element (7) thereby forming an outer contour of the light bulb (1). The optical element (7) is optically separated from the internal structure (5), such that the optical element (7) acts as a total internal reflection light guide, preventing visibility of the internal structure (5) when the internal structure (5) is viewed at an angle to the axial direction and when said angle is smaller than a predefined threshold angle.

This disclosure relates to optical module. In one implementation, the optical module includes a multi-layer circuit board, a first optical chip, a second optical chip, and a processor, wherein a surface layer on a same side of the circuit board comprises a first row of edge connector pins and a second row of edge connector pins; the first row of edge connector pins comprise a first power pin; the second row of edge connector pins comprise a second power pin; the first power pin is connected to the first optical chip; the second power pin connected to the second optical chip and the processor; the first power pin and the second power pin are aligned along a same direction and are arranged at a same position among the first row of edge connector pins and the second row of edge connector pins; and the first power pin is electrically connected to the second power pin. In another implementation, the first power pin and the second power pin is not electrically connected and wherein the circuit board further comprises a power delay circuit between the second power pin and the processor.

This disclosure relates to optical module. In one implementation, the optical module includes a multi-layer circuit board, a first optical chip, a second optical chip, and a processor, wherein a surface layer on a same side of the circuit board comprises a first row of edge connector pins and a second row of edge connector pins; the first row of edge connector pins comprise a first power pin; the second row of edge connector pins comprise a second power pin; the first power pin is connected to the first optical chip; the second power pin connected to the second optical chip and the processor; the first power pin and the second power pin are aligned along a same direction and are arranged at a same position among the first row of edge connector pins and the second row of edge connector pins; and the first power pin is electrically connected to the second power pin. In another implementation, the first power pin and the second power pin is not electrically connected and wherein the circuit board further comprises a power delay circuit between the second power pin and the processor.

The present disclosure generally relates to optical modules, and in particular, to an optical module comprising a printed circuit board for reducing crosstalk between differential signal lines. In one implementation, the printed circuit board comprises a top layer, a first intermediate signal transmission layer, a second intermediate signal transmission layer, a bottom layer and multiple ground layers between signal transmission layers. Each signal transmission layer comprises one or more differential signal line pairs. The top layer and the bottom layer each comprises an edge connector, and the top layer further comprises a laser driver chip. The signal transmission layers are connected to the edge connectors and laser driver chips via a combination of blind and through connection holes such that the interference between the differential signal line pairs of various signal transmission layers are reduced.

The present disclosure generally relates to optical modules, and in particular, to an optical module comprising a printed circuit board for reducing crosstalk between differential signal lines. In one implementation, the printed circuit board comprises a top layer, a first intermediate signal transmission layer, a second intermediate signal transmission layer, a bottom layer and multiple ground layers between signal transmission layers. Each signal transmission layer comprises one or more differential signal line pairs. The top layer and the bottom layer each comprises an edge connector, and the top layer further comprises a laser driver chip. The signal transmission layers are connected to the edge connectors and laser driver chips via a combination of blind and through connection holes such that the interference between the differential signal line pairs of various signal transmission layers are reduced.

A vehicular lamp includes a projection lens made of resin; a light source that is disposed behind the projection lens, the vehicular lamp being configured such that light from the light source is emitted forward through the projection lens; a wind generator configured to generate wind; and a wind guide path configured to guide wind generated by the wind generator to a position where the wind hits a surface of the projection lens.

A vehicular lamp includes a projection lens made of resin; a light source that is disposed behind the projection lens, the vehicular lamp being configured such that light from the light source is emitted forward through the projection lens; a wind generator configured to generate wind; and a wind guide path configured to guide wind generated by the wind generator to a position where the wind hits a surface of the projection lens.

The disclosed embodiments relate to a lighting device (1) comprising an exit window (2) and a light source substrate (3) arranged to carry at least one solid-state light source (4), the at least one light source (4) being arranged to emit light through the exit window (2). The exit window (2) is shaped to allow a front surface of the light source substrate (3) to be brought into physical contact with a surface of the exit window facing the light source substrate (3), and in that the light source substrate (3) is held in physical contact with the exit window (2), thereby enabling thermal contact between the light source substrate (3) and the exit window (2). Since thermal contact between the exit window and the light source substrate is secured, the heat transfer of the lighting device will be improved.

The disclosed embodiments relate to a lighting device (1) comprising an exit window (2) and a light source substrate (3) arranged to carry at least one solid-state light source (4), the at least one light source (4) being arranged to emit light through the exit window (2). The exit window (2) is shaped to allow a front surface of the light source substrate (3) to be brought into physical contact with a surface of the exit window facing the light source substrate (3), and in that the light source substrate (3) is held in physical contact with the exit window (2), thereby enabling thermal contact between the light source substrate (3) and the exit window (2). Since thermal contact between the exit window and the light source substrate is secured, the heat transfer of the lighting device will be improved.

A light emitting diode (LED) module includes a first end cap, a second end cap and a reflector portion. The reflector portion extends longitudinally between the first end cap and the second end cap. The reflector portion includes a coolant passageway defined longitudinally through the reflector portion and is fluidically coupled to the first end cap and the second end cap. An LED package is disposed adjacent to the reflector portion. An orifice bushing can be disposed within a coolant passage defined in the first end cap to restrict coolant flow through the reflector portion to preclude starvation of coolant flow elsewhere in the LED module.