The present disclosure includes an LED lamp assembly comprising a glass envelope, an LED platform supported by a stem arrangement disposed within the envelope, a base hermetically sealed to the envelope, a gas disposed within the envelope providing thermal conductivity between the LED platform and the envelope, and a getter disposed within the envelope for absorbing volatile organic compounds. The lamp may maintain a ratio of helium to oxygen that achieves both an acceptable thermal conductivity and an acceptable lumen output over the life of the LED lamp.

The LED tube lamp includes a lamp tube, an LED substrate, and a diffusion film. The LED substrate includes a plurality of LED chips disposed on the LED substrate, and a driving circuitry for receiving power to enable the plurality of LED chips. The diffusion film is disposed on a surface of the lamp tube. The diffusion film includes a first region and a second region adjacent to the first region. The first region and the second region of the diffusion film are arranged along a longitudinal axis of the lamp tube. The first region has a first transmittance rate and the second region has a second transmittance rate higher than the first transmission rate.

The LED tube lamp includes a lamp tube, an LED substrate, and a diffusion film. The LED substrate includes a plurality of LED chips disposed on the LED substrate, and a driving circuitry for receiving power to enable the plurality of LED chips. The diffusion film is disposed on a surface of the lamp tube. The diffusion film includes a first region and a second region adjacent to the first region. The first region and the second region of the diffusion film are arranged along a longitudinal axis of the lamp tube. The first region has a first transmittance rate and the second region has a second transmittance rate higher than the first transmission rate.

A lighting device that protects a member related to light emission from heat associated with light emission includes a light source, a first optical member configured to transmit light emitted by the light source, a second optical member, arranged between the light source and the first optical member, configured to transmit light emitted by the light source, and an air-sending mechanism configured to send air suctioned from a first space that is an inner space on a side nearer to the light source than the second optical member and includes the light source to a second space that is a space between the first optical member and the second optical member.

A lighting device that protects a member related to light emission from heat associated with light emission includes a light source, a first optical member configured to transmit light emitted by the light source, a second optical member, arranged between the light source and the first optical member, configured to transmit light emitted by the light source, and an air-sending mechanism configured to send air suctioned from a first space that is an inner space on a side nearer to the light source than the second optical member and includes the light source to a second space that is a space between the first optical member and the second optical member.

Solid state lighting components are provided with improved color rendering, improved color uniformity, and improved directional lighting, and that are suitable for use in high output lighting applications and can be used in place of CDMH bulb lighting. Exemplary solid state lighting components include a substrate comprising a light emitter surface and or more light emitters disposed on and/or over the light emitter surface. Exemplary components include a light directing optic and/or a diffusing optic for mixing light. The light directing optic may be disposed at least partially around a perimeter of the light emitter surface. The diffusing optic may be disposed between portions of the light directing optic and spaced apart from the light emitter surface.

Solid state lighting components are provided with improved color rendering, improved color uniformity, and improved directional lighting, and that are suitable for use in high output lighting applications and can be used in place of CDMH bulb lighting. Exemplary solid state lighting components include a substrate comprising a light emitter surface and or more light emitters disposed on and/or over the light emitter surface. Exemplary components include a light directing optic and/or a diffusing optic for mixing light. The light directing optic may be disposed at least partially around a perimeter of the light emitter surface. The diffusing optic may be disposed between portions of the light directing optic and spaced apart from the light emitter surface.

The present disclosure discloses a lighting device, including: a housing, an optical element connected with the housing, a receiving chamber formed by engaging the housing with the optical element, and a light source component and a driving power supply component both located in the receiving chamber. The lighting device further includes a passage located in the receiving chamber, the passage passes through the housing and the optical element, and an interior of the lighting device is communicated with an exterior of the lighting device by the passage.

The present disclosure discloses a lighting device, including: a housing, an optical element connected with the housing, a receiving chamber formed by engaging the housing with the optical element, and a light source component and a driving power supply component both located in the receiving chamber. The lighting device further includes a passage located in the receiving chamber, the passage passes through the housing and the optical element, and an interior of the lighting device is communicated with an exterior of the lighting device by the passage.

A cabinet light includes a heat dissipation shell; a light emitting component disposed in the heat dissipation shell; a driving component disposed in the heat dissipation shell and electrically connected to the light emitting component; a sealing end cover disposed on an open at a side of the heat dissipation shell by insertion and comprising a cavity; a cover element detachably disposed on an open at a top of the heat dissipation shell and comprising a light transmission area for light to pass through; a fixing structure disposed between the sealing end cover and the cover element; a piercing conductor disposed in the cavity and configured to pierce insulation layers of wires wherein the wires are placed in the cavity; and a press element disposed on a mouth of the cavity and configured to press the piercing conductor.