A light fixture comprises two cooling elements and a plurality of semiconductor lighting elements, wherein each cooling element has a central portion and a wall portion which extends away from the central portion and at least partially surrounds an interior of a cooling element. The two cooling elements are arranged opposite one another. An annular opening for exchange of air with the environment is present between the two cooling elements. The semiconductor lighting elements are arranged on the outside of the wall portion of the cooling elements. A corresponding cooling element has two or more vanes, wherein all vanes are connected to one another by means of a central connecting element. Each vane extends in an axial direction and in a circumferential direction and has a curvature in the axial direction and preferably a curvature in the circumferential direction.

A light fixture comprises two cooling elements and a plurality of semiconductor lighting elements, wherein each cooling element has a central portion and a wall portion which extends away from the central portion and at least partially surrounds an interior of a cooling element. The two cooling elements are arranged opposite one another. An annular opening for exchange of air with the environment is present between the two cooling elements. The semiconductor lighting elements are arranged on the outside of the wall portion of the cooling elements. A corresponding cooling element has two or more vanes, wherein all vanes are connected to one another by means of a central connecting element. Each vane extends in an axial direction and in a circumferential direction and has a curvature in the axial direction and preferably a curvature in the circumferential direction.

Embodiments of the invention provide lighting systems that employ light-emitting diode (LED) chips as active lighting elements. Heat management components for the LED chips employed in the lighting sources are provided. In embodiments of the invention, LED chips are cooled by one or more heatspreaders and heat sinks attached to a substrate that houses the LED chip and/or the topside of the LED chip.

Embodiments of the invention provide lighting systems that employ light-emitting diode (LED) chips as active lighting elements. Heat management components for the LED chips employed in the lighting sources are provided. In embodiments of the invention, LED chips are cooled by one or more heatspreaders and heat sinks attached to a substrate that houses the LED chip and/or the topside of the LED chip.

An LED filament, including: a strip substrate having two ends, a plurality of LED chips, metal strip electrodes, and a plurality of electronic devices. The plurality of LED chips is disposed on the strip substrate and connected in series to form an LED light source. The metal strip electrodes are disposed on the two ends of the strip substrate. The plurality of electronic devices is disposed on the strip substrate in the vicinity of one end of the strip substrate or in the vicinity of two ends of the strip substrate. The metal strip electrodes are connected to the electronic devices and the LED light source via leads. The strip substrate, the LED light source, the electronic devices, and joints between the strip substrate and the metal strip electrodes are coated with fluorescent glue.

The invention relates to a light emitting device, comprising at least one light source (101) and a closed container, the container comprising a first area (105) and a second area (107) that is arranged opposite to the first area (105), the closed container being filled with a heat conducting fluid (111) that is thermally coupled to an inside surface of the closed container, wherein the at least one light source (101) is arranged on an outside surface (115) of the first area of the closed container and thermally coupled to the inside surface (113) of the closed container.

A lighting device comprises a holder for LED filaments. The holder has a first electrically conductive holding structure and a second electrically conductive holding structure. Each holding structure comprises an essentially longitudinal connection section and an attachment section essentially perpendicular to the connection section.

A novel heat sinking technology, uniquely adaptive to LED lighting devices in a generally LED array format containing multiple openings on said heat sink's base portions and optionally fin portions providing short path cooling technology. The short path cooling technology is thoroughly taught with multiple examples. Also taught, are methods of heat sink area maintenance when said openings are placed on said heat sinks. Indeed, even surface area increases are shown to be possible when multiple openings are placed on said heat sinks. Lastly, other non-LED semiconductor cooling is discussed and illustrated in various figures using said short path cooling technology.

A novel heat sinking technology, uniquely adaptive to LED lighting devices in a generally LED array format containing multiple openings on said heat sink's base portions and optionally fin portions providing short path cooling technology. The short path cooling technology is thoroughly taught with multiple examples. Also taught, are methods of heat sink area maintenance when said openings are placed on said heat sinks. Indeed, even surface area increases are shown to be possible when multiple openings are placed on said heat sinks. Lastly, other non-LED semiconductor cooling is discussed and illustrated in various figures using said short path cooling technology.

A LED filament bulb apparatus includes a bulb shell, one or more LED strips, a core column, two pluggable sockets, a driver board and a cap. The LED strip is electrically connected to two power lead wires. The core column supports the LED strip. The two power lead wires have bottom ends. The two pluggable sockets respectively receives the two bottom ends. The driver board is used for mounting the two pluggable socket and a driver circuit. The two bottom ends of the two power lead wires are electrically connected to the driver circuit for receiving a driving current generated by the driver circuit from converting an external power source. The cap is fixed to the core column and the bulb shell.