A system, apparatus, and method for thermal regulation in a tiered rack growth system. A contact heat exchange converter is provided to remove thermal energy of a light fixture for the tiered rack growth system. A contact thermal exchange cavity defined in the contact heat exchange converter is dimensioned to cooperatively receive an arcuate thermal sink of the light fixture. A circulation conduit communicates a dense medium coolant to remove thermal energy carried by a thermal mass of the contact heat exchange converter.

A system, apparatus, and method for thermal regulation in a tiered rack growth system. A contact heat exchange converter is provided to remove thermal energy of a light fixture for the tiered rack growth system. A contact thermal exchange cavity defined in the contact heat exchange converter is dimensioned to cooperatively receive an arcuate thermal sink of the light fixture. A circulation conduit communicates a dense medium coolant to remove thermal energy carried by a thermal mass of the contact heat exchange converter.

A novel heat sinking technology, uniquely adaptive to LED lighting devices in a generally LED array format containing multiple openings on said heat sink's base portions and optionally fin portions providing “short path cooling” technology. The “short path cooling” technology is thoroughly taught with multiple examples. Also taught, are methods of heat sink area maintenance when said openings are placed on said heat sinks. Indeed, even surface area increases are shown to be possible when multiple openings are placed on said heat sinks. Lastly, other non-LED semiconductor cooling is discussed and illustrated in various figures using said “short path cooling” technology.

A novel heat sinking technology, uniquely adaptive to LED lighting devices in a generally LED array format containing multiple openings on said heat sink's base portions and optionally fin portions providing “short path cooling” technology. The “short path cooling” technology is thoroughly taught with multiple examples. Also taught, are methods of heat sink area maintenance when said openings are placed on said heat sinks. Indeed, even surface area increases are shown to be possible when multiple openings are placed on said heat sinks. Lastly, other non-LED semiconductor cooling is discussed and illustrated in various figures using said “short path cooling” technology.

A web based method and system that allows the users such as buyers and sellers to locate, purchase, and sell goods, items and services through instant notification. A method and system can include the steps of requesting at least one of an unlisted product, unlisted item and unlisted service from the online web based system. Next the online web based system can provide for matching the at least one of the unlisted product, unlisted item and the unlisted service when the at least one of the unlisted product, unlisted item and the unlisted service is listed with the online web based system. Next the method and system can provide for notifying by generating an instant notification from the online web based system to a portable wireless device, when at least one of the unlisted product, the unlisted item and the unlisted service, has been matched with the at least one of the unlisted product, unlisted item and the unlisted service on the online web based system. The user can use a portable wireless device such as a laptop computer, a PDA (personal digital assistant) device, a cell phone, and a pager. The instant notification can be generated to the portable wireless device through at least one of an e-mail, a text message a voice message, an image message and a page.

A lighting apparatus includes a printed circuit board. A first light source and a second light source can be mounted on the printed circuit board. A first optical member can receive and redirect light from the first light source, and a second optical member can receive and redirect light from the second light source. A vent aperture can be defined in the printed circuit board, the vent aperture being positioned between the optical members. The apparatus can include first and second thermally conductive sheets thermally coupled to the printed circuit board, the first thermally conductive sheet disposed on a first back side of the first optical member, the second thermally conductive sheet disposed on a second back side of the second optical member. The apparatus can include a housing having a housing vent, the housing vent and the vent aperture defining a first convective path between the optical members.

An LED downlight assembly accommodates square and round trims and its components may be removed irrespective of the presence of mudded in round or square mud plates. The assembly also includes a collar that can be fitted to ceiling of varying thicknesses.

An LED downlight assembly accommodates square and round trims and its components may be removed irrespective of the presence of mudded in round or square mud plates. The assembly also includes a collar that can be fitted to ceiling of varying thicknesses.

Provided is a heat dissipation structure and an illumination device which are capable of dissipating heat readily and efficiently. A heat dissipation structure 1 configured to release heat from a heat source 100 is provided with a plurality of heat reception/dissipation members 10 which have expanded graphite layers containing expanded graphite and which are spaced apart from each other; and a connection member 20 configured to connect the heat reception/dissipation members 10 together. The heat reception/dissipation members 10 each have the expanded graphite layer as the outermost layer and are disposed such that the expanded graphite layers face each other.

Provided is a heat dissipation structure and an illumination device which are capable of dissipating heat readily and efficiently. A heat dissipation structure 1 configured to release heat from a heat source 100 is provided with a plurality of heat reception/dissipation members 10 which have expanded graphite layers containing expanded graphite and which are spaced apart from each other; and a connection member 20 configured to connect the heat reception/dissipation members 10 together. The heat reception/dissipation members 10 each have the expanded graphite layer as the outermost layer and are disposed such that the expanded graphite layers face each other.