A high-bay luminaire includes an upper housing having an outer wall with an outer wall having a plurality of first heat fins extending therefrom, and an interior surface defining an interior compartment with an angled wall; a base connected to the upper housing; a light emitter connected to the base; a lens connected to the base and positioned below the light emitter; and a driver connected to the angled wall by a driver bracket and positioned adjacent the interior surface.

The present disclosure provides a power supply device and a high-power illumination system. The power supply device includes: a housing, where the housing includes a first bottom plate having a first surface on which a first heat sink is provided and a second surface on which a thermal conductive potting layer is provided; and a printed circuit board, where the printed circuit board is located in the housing, the printed circuit board includes a circuit board body and multiple electronic components arranged on the circuit board body, at least part of the multiple electronic components is arranged facing the second surface of the first bottom plate, and the electronic component of the at least part of the multiple electronic components is partially immersed in the thermal conductive potting layer to conduct heat dissipated by the electronic component to the first heat sink for natural heat dissipation of the electronic component.

The present disclosure provides a power supply device and a high-power illumination system. The power supply device includes: a housing, where the housing includes a first bottom plate having a first surface on which a first heat sink is provided and a second surface on which a thermal conductive potting layer is provided; and a printed circuit board, where the printed circuit board is located in the housing, the printed circuit board includes a circuit board body and multiple electronic components arranged on the circuit board body, at least part of the multiple electronic components is arranged facing the second surface of the first bottom plate, and the electronic component of the at least part of the multiple electronic components is partially immersed in the thermal conductive potting layer to conduct heat dissipated by the electronic component to the first heat sink for natural heat dissipation of the electronic component.

The present invention provides a lighting system comprising a main power source, a light source driver electrically coupled to the main power source, and a light source unit driven by the light source driver. The light source driver is encased within a dedicated or independent driver housing. The light source driver and the driver housing are physically and electrically connected to the light source unit via a flexible cord. The length of the flexible cord is so configured that the light source unit can be installed at different locations inside a building without moving the light source driver around.

A lighting device system includes a lighting device module having a module housing configured to be selectively inserted through an opening in a panel or a base. Driver electronics are configured to be electrically coupled to the lighting device module. A heat sink member is located adjacent the opening in the panel or the base. A movable biasing device has a first position to apply a bias force on the module housing, pressing the module housing toward the heat sink member to increase thermal transfer. The moveable biasing device has a second position to provide improved access to the driver electronics through the opening in the panel or base relative to the first position. The movable biasing device is selectively moveable from the first position to the second position, or from the second position to the first position.

A lighting device system includes a lighting device module having a module housing configured to be selectively inserted through an opening in a panel or a base. Driver electronics are configured to be electrically coupled to the lighting device module. A heat sink member is located adjacent the opening in the panel or the base. A movable biasing device has a first position to apply a bias force on the module housing, pressing the module housing toward the heat sink member to increase thermal transfer. The moveable biasing device has a second position to provide improved access to the driver electronics through the opening in the panel or base relative to the first position. The movable biasing device is selectively moveable from the first position to the second position, or from the second position to the first position.

An integrated ceiling device includes integrated ceiling device including an electronic device housing, a heat dissipating structure, a light source, and a reflection/refraction assembly. An air gap is defined between the electronics housing and other components allowing ambient air to flow therethrough for cooling.

An integrated ceiling device includes integrated ceiling device including an electronic device housing, a heat dissipating structure, a light source, and a reflection/refraction assembly. An air gap is defined between the electronics housing and other components allowing ambient air to flow therethrough for cooling.

Disclosed embodiments relate to a combination axial fan and LED lighting system configured to fit into the footprint of a standard ceiling tile. Disclosed embodiments further include ceiling tiles with a built-in fan and/or LED lighting. The disclosed systems may include a housing container and an axial fan. The fan has a fan cavity including air diversion mechanism to direct air from the fan cavity toward the lighting and fan components. The inventions include an airflow surface to direct air existing the fan cavity along an LED light fixture. Moreover, disclosed embodiments include one or more UV light sources which irradiate contaminants as air flows through the ceiling tile.

Disclosed embodiments relate to a combination axial fan and LED lighting system configured to fit into the footprint of a standard ceiling tile. Disclosed embodiments further include ceiling tiles with a built-in fan and/or LED lighting. The disclosed systems may include a housing container and an axial fan. The fan has a fan cavity including air diversion mechanism to direct air from the fan cavity toward the lighting and fan components. The inventions include an airflow surface to direct air existing the fan cavity along an LED light fixture. Moreover, disclosed embodiments include one or more UV light sources which irradiate contaminants as air flows through the ceiling tile.