Some embodiments of the present disclosure provide a plant lamp. The plant lamp may include one or more light-emitting units and a lamp holder. Each of the one or more light-emitting units may include a light-emitting side and a non-light-emitting side oppositely disposed. The one or more light-emitting units may be mounted on the lamp holder. The plant lamp may further include one or more heat dissipation units located on the non-light-emitting side of at least one of the one or more light-emitting units, connected to the at least one light-emitting unit, and configured for heat dissipation of the at least one light-emitting unit.

Provided is a heat radiating apparatus for radiating heat of a heat source in air. The heat radiating apparatus includes a support member in close contact with the heat source on a first principal surface side, a heat pipe supported by the support member, and a plurality of heat radiating fins in a space that faces a second principal surface to radiate the heat transferred by the heat pipe. The heat pipe has a first line part thermally joined with the support member, a second line part thermally joined with the heat radiating fins, and a connecting part. A plurality of heat radiating apparatuses can be connected such that the first principal surfaces are successive, and each of the plurality of heat radiating apparatuses has a receiving part for receiving the connecting parts of adjacent heat radiating apparatuses in the space that faces the second principal surface.

Provided is a heat radiating apparatus. The heat radiating apparatus includes a support member in close contact with the heat source, a heat pipe thermally joined with the support member, and a plurality of heat radiating fins placed in a space that faces a second principal surface. The heat pipe includes a first line part thermally joined with the support member, a second line part thermally joined with the heat radiating fins, and a connecting part which connects the first line part to the second line part. A length of the heat pipe is slightly shorter than or equal to the support member. The connecting part has a curved part thermally joined with the support member. When a plurality of heat radiating apparatuses are arranged in the direction in which the first line part extends, the heat radiating apparatuses can be connected such that the first principal surfaces are successive.

A heat sink, lighting device and method of manufacture are described. A heat sink includes at least one sheet metal having a first surface and a second surface, at least one first reference pin extending at least in part from the first surface, and at least one second reference pin extending at least in part from the second surface and located within a diameter of, and concentrically with, the at least one first reference pin. The diameter of the at least one first reference pin being larger than a diameter of the at least one second reference pin.

The semiconductor lamp (1) is equipped with a heat sink (2, 3) which has a first part (2) and a second part (3) connected to each other by way of a press fit and which together delimit a receptacle (10, 12) for a driver (5), the first part (2) having an insert region (8) for insertion into the second part (3), which insert region consists of spring elements (21) that can be pushed inwards. The invention is particularly useful for retrofit lamps, in particular incandescent or halogen retrofit lamps.

An LED lighting array for illuminating an area with the lighting array comprising a plurality of LED devices set in conical or elliptically conical reflectors, each of which is mounted upon a plate, each of which may be set at various angles to one other, and each of which is backed by a series of elements, first a copper support element, then an optional layer of graphite foam, followed by an aluminum plate, and then an arrangement of copper fins operably lined to a thermal mass mate. The copper support element includes support planes that are off-set relative to each adjacent plate and are in at least three different planes relative to each other. The backing plates may efficiently dissipate heat produced by the LEDs. The apparatus can be mounted upon a stand to illuminate an area such as a portion of a car park, building entrance or the like.

The present invention relates to the field of LED illumination, particularly to a high power LED illuminant based on heat pipe principle. The high power LED illuminant comprises a light emitting section, a liquid storing section with liquid electric-insulation-operating-medium stored therein and a heat sink. The liquid electric-insulation-operating-medium is drawn into the light emitting section by means of capillary force and then immerses the LED chips and thus directly cools down the LED chips. The electric-insulation-operating-medium takes in heat and turns into gas and then flows into the liquid storing section through capillary channels. The heat sink is used to cool down the electric-insulation-operating-medium so that it turns into liquid. When the LED chips generate heat during its operation, the electric-insulation-operating-medium flows into the heat sink after turning into gas by absorbing heat. The electric-insulation-operating-medium turns into liquid after giving out heat through the heat sink. By means of such a cycle, the heat generated by LED chips is so transferred away via the electric-insulation-operating-medium that the temperature of the LED chips is kept within the temperature range of gaseous electric-insulation-operating-medium. In this way, the lifespan of the LED chips is extended consequently and the luminous efficiency is enhanced as well.

The present invention relates to the field of LED illumination, particularly to a high power LED illuminant based on heat pipe principle. The high power LED illuminant comprises a light emitting section, a liquid storing section with liquid electric-insulation-operating-medium stored therein and a heat sink. The liquid electric-insulation-operating-medium is drawn into the light emitting section by means of capillary force and then immerses the LED chips and thus directly cools down the LED chips. The electric-insulation-operating-medium takes in heat and turns into gas and then flows into the liquid storing section through capillary channels. The heat sink is used to cool down the electric-insulation-operating-medium so that it turns into liquid. When the LED chips generate heat during its operation, the electric-insulation-operating-medium flows into the heat sink after turning into gas by absorbing heat. The electric-insulation-operating-medium turns into liquid after giving out heat through the heat sink. By means of such a cycle, the heat generated by LED chips is so transferred away via the electric-insulation-operating-medium that the temperature of the LED chips is kept within the temperature range of gaseous electric-insulation-operating-medium. In this way, the lifespan of the LED chips is extended consequently and the luminous efficiency is enhanced as well.

Disclosed is a light assembly configured to be installed in a movie projector. The light assembly includes an adaptor configured to mechanically couple with a bulb mount of the movie theatre projector. The light assembly further includes a female socket rigidly connected to the adaptor and a male socket configured to mate with the female socket. Yet further, the light assembly includes one or more cooling fans configured to generate airflow, a heat sink configured to dissipate heat, a first thermal transfer pad configured to conduct heat, a primary mounting plate, and a second thermal transfer pad. Moreover, the light assembly includes a Light Emitting Diode (LED) Array configured to generate light, wherein the LED Array is mounted on a board. Further, the light assembly includes a lens mounting plate, multiple lens mount standoffs, a lens configured to collimate light emitted from the LED Array, and a lens retainer.

According to one or more arrangements, a lighting device such as a lamp may include a cover a device body. The device body may have a projection having a support surface at one end and an attachment portion to which the cover is configured to attach. In one or more examples, while the cover is configured to attach to the attachment portion, the cover may be configured to cover the supporting surface of the projection. The cover portion may include a translucent cover portion in some configurations. Additionally or alternatively, the supporting surface of the projection portion may be disposed closer to a center of the cover portion than the attachment portion. In one example, the projection portion may be disposed closer to the cover portion center by a distance equal to a height of the projection portion.