A fluorescent plate including a fluorescent phase which emits fluorescence by excitation light, and a plurality of voids, wherein, in a cross section of the fluorescent plate including cross sections of the voids, voids having an equivalent circle diameter of 0.4 micrometers or greater and 50 micrometers or smaller have a standard deviation in equivalent circle diameter of 1.5 or less.

A fluorescent plate including a fluorescent phase which emits fluorescence by excitation light, and a plurality of voids, wherein, in a cross section of the fluorescent plate including cross sections of the voids, voids having an equivalent circle diameter of 0.4 micrometers or greater and 50 micrometers or smaller have a standard deviation in equivalent circle diameter of 1.5 or less.

A light-emitting device, including a shell assembly and a heat dissipation assembly. The heat dissipation assembly includes a first heat dissipation portion and a second heat dissipation portion. The first heat dissipation portion is connected with the second heat dissipation portion. The first heat dissipation portion is used to load a light source assembly, and a cavity space is formed when the second heat dissipation portion is covered by and communicated with the shell assembly. The second heat dissipation portion is provided with a first through-hole portion, and the shell assembly is provided with a second through-hole portion, the first through-hole portion and the second through-hole portion circulate a cooling medium to remove heat from the cavity space. Whether the light-emitting device is installed vertically, horizontally or at a certain inclination, a good heat dissipation effect can be achieved and the applicable scope can be greatly expanded.

An integrated ceiling device includes a housing retaining an electronic assembly, a heat sink having a central opening, a light source coupled onto the heat sink, the housing is coupled with and disposed at least partly above the heat sink, and a central vertical axis of the housing aligns or is in proximity with the central opening of the heat sink.

An integrated ceiling device includes a housing retaining an electronic assembly, a heat sink having a central opening, a light source coupled onto the heat sink, the housing is coupled with and disposed at least partly above the heat sink, and a central vertical axis of the housing aligns or is in proximity with the central opening of the heat sink.

A method and device for emitting electromagnetic radiation at high power using nonpolar or semipolar gallium containing substrates such as GaN, AlN, InN, InGaN, AlGaN, and AlInGaN, is provided. In various embodiments, the laser device includes plural laser emitters emitting green or blue laser light, integrated a substrate.

A method and device for emitting electromagnetic radiation at high power using nonpolar or semipolar gallium containing substrates such as GaN, AlN, InN, InGaN, AlGaN, and AlInGaN, is provided. In various embodiments, the laser device includes plural laser emitters emitting green or blue laser light, integrated a substrate.

A lighting apparatus is provided with a housing forming a battery housing and a light housing separated via a partitioning wall. A light module is supported by the light housing and includes a heat sink located at least partially within the light housing and at least one LED supported by the heat sink. A battery receptacle formed within the battery housing to slidingly receive a battery pack at least partially into the battery housing. An intake opening is formed within the partitioning wall and an air vent is formed in fluid communication with the light housing. In operation, an airflow passes in thermal contact with the battery pack from the battery housing into the light housing through the intake opening, and from the light housing in thermal contact with the heat sink out of the air vent.

A lighting apparatus is provided with a housing forming a battery housing and a light housing separated via a partitioning wall. A light module is supported by the light housing and includes a heat sink located at least partially within the light housing and at least one LED supported by the heat sink. A battery receptacle formed within the battery housing to slidingly receive a battery pack at least partially into the battery housing. An intake opening is formed within the partitioning wall and an air vent is formed in fluid communication with the light housing. In operation, an airflow passes in thermal contact with the battery pack from the battery housing into the light housing through the intake opening, and from the light housing in thermal contact with the heat sink out of the air vent.

A circuit board configuration adapted to carry electronic components of a power supply module is provided. The circuit board configuration comprises: a first circuit board, having a first plane configured to dispose and connect a part of the electronic components; and a second circuit board, electrically connected to the first circuit board and having a second plane configured to dispose and connect another part of the electronic components, wherein at least one of the first and the second circuit boards is disposed, perpendicular to an axial direction of the lamp tube, in an interior space formed by the lamp tube and at least one of the two end caps, so that the a direction normal to the first and the second planes is substantially parallel to the axial direction of the lamp tube.