The present invention is a vertical drier which dries the asphalt road upper structural members like aggregate and like asphalt coating which is desired to be recycled (RAP) and which takes the humidity of said asphalt road upper structural members; and which has a vertical body having an end through which said members are discharged and having another end which is opened to an accumulation compartment; and where the hot air, heated by a heat source, is transferred inside said body. Said drier is characterized by comprising at least one drying box which has a chamber form where the poured members are accumulated in the inner part thereof and which extends orthogonally to the flow direction inside the body; in order to keep the members, which pour inside said body from an inlet part, for certain duration and in order to transfer said members from the outlet part to the accumulation compartment step by step.

The present invention is a vertical drier which dries the asphalt road upper structural members like aggregate and like asphalt coating which is desired to be recycled (RAP) and which takes the humidity of said asphalt road upper structural members; and which has a vertical body having an end through which said members are discharged and having another end which is opened to an accumulation compartment; and where the hot air, heated by a heat source, is transferred inside said body. Said drier is characterized by comprising at least one drying box which has a chamber form where the poured members are accumulated in the inner part thereof and which extends orthogonally to the flow direction inside the body; in order to keep the members, which pour inside said body from an inlet part, for certain duration and in order to transfer said members from the outlet part to the accumulation compartment step by step.

A multi-chamber dryer using adjustable conditioned air flow is disclosed. According to one embodiment, an apparatus includes a drying belt configured to receive a product to be dried on a first surface of the drying belt and a heat medium in contact with a second surface of the drying belt. The heat medium is configured to heat the product and is maintained at a pre-determined temperature. The apparatus further includes a manifold that is positioned above the drying belt, where the manifold includes one or more orifices that inject conditioned air laterally across a width of the drying belt to remove evaporated water from the product

A multi-chamber dryer using adjustable conditioned air flow is disclosed. According to one embodiment, an apparatus includes a drying belt configured to receive a product to be dried on a first surface of the drying belt and a heat medium in contact with a second surface of the drying belt. The heat medium is configured to heat the product and is maintained at a pre-determined temperature. The apparatus further includes a manifold that is positioned above the drying belt, where the manifold includes one or more orifices that inject conditioned air laterally across a width of the drying belt to remove evaporated water from the product

A spin rinse dryer for treating a substrate has an enclosure, a rotatable support for supporting the substrate, a rotatable member located within the enclosure above the rotatable support, and a drive for rotating the rotatable member. During cleaning of the wafer, liquid that splashes up from the wafer will strike the rotatable member, rather than the upper wall of the enclosure, and may form droplets on the rotatable member. After the flow of cleaning liquid has stopped, the drive can rotate the rotatable member at high speed, which tends to throw the liquid droplets off the rotatable member through centrifugal force. The liquid then runs down the walls of the enclosure, away from the wafer, so that there is a much reduced chance of contamination of the cleaned wafer. The rotatable member and support may be integrally formed and rotated together or may be separate members.

A spin rinse dryer for treating a substrate has an enclosure, a rotatable support for supporting the substrate, a rotatable member located within the enclosure above the rotatable support, and a drive for rotating the rotatable member. During cleaning of the wafer, liquid that splashes up from the wafer will strike the rotatable member, rather than the upper wall of the enclosure, and may form droplets on the rotatable member. After the flow of cleaning liquid has stopped, the drive can rotate the rotatable member at high speed, which tends to throw the liquid droplets off the rotatable member through centrifugal force. The liquid then runs down the walls of the enclosure, away from the wafer, so that there is a much reduced chance of contamination of the cleaned wafer. The rotatable member and support may be integrally formed and rotated together or may be separate members.