A heat exchanger can include a plurality of flat tubes each having a heat exchange channel for a flow of a heat exchange medium, and a first collector pipe and a second collector pipe connected to distal sections of the plurality of flat tubes and disposed side by side. Chambers of the first collector pipe and the second collector pipe can be in communication with the heat exchange channels of the flat tubes. The flat tube includes a main body section, a distal section, and a torsion section connected therebetween. The main body section and the distal sections can be straight sections. The first collector pipe and the second collector pipe can be provided with mounting holes for the distal section being inserted into. A length direction of the mounting hole can be inclined to the axis of the first collector pipe or the axis of the second collector pipe.

A transmission-mountable transmission cooler and method of installing and manufacturing the same is provided. The transmission cooler is adapted to couple directly to the transmission via a power take-off aperture typically found on manual truck transmissions. As a result, the transmission cooler may be made from an extruded aluminum piece to which tool and die making has provides a bolt pattern that matches the bolt pattern of a standard power take-off cover of the power take-off aperture, resulting in a cost-effective method of installation and in turn manufacture.

An apparatus and method for generating a three-dimensional object. The apparatus includes a build material area, at least one agent distributor with a fluid reservoir to store fluid agent and at least one fluid ejection die to selectively eject fluid agent in the build material area. A cooling system to remove heat from the at least one fluid ejection die has a heat sink. The at least one fluid ejection die is in thermal contact with the heat sink via the fluid agent of the fluid reservoir.

A thermosyphon-type heat dissipation device includes a heat-absorbing head and a radiator. The heat-absorbing head includes a first outlet, a first inlet, an evaporation chamber and a liquid return chamber. The first outlet is connected with the evaporation chamber. The first inlet is connected with the liquid return chamber. The evaporation chamber and the liquid return chamber are in communication with each other through a gap. An inner space of the evaporation chamber is larger than an inner space of the liquid return chamber. The radiator includes a second inlet and a second outlet. The second inlet is in communication with the first outlet. The second outlet is in communication with the first inlet.

A heat sink for use in an immersion cooling system that includes a sintered powder structure enclosed in a porous enclosure. The porous enclosure has openings, e.g., formed by a mesh, with a size to help contain sintered powder particles that may be dislodged during operation of the heat sink.

The invention concerns a piece of electronic equipment comprising a card (2) provided with an electronic component (3), a radiator (5) having a bottom (6) topped by fins (7), the bottom of the radiator resting on the electronic component, and a cover (8) extending above the radiator providing an air flow around the fins of the radiator, the cover comprising a plurality of flexible blades (11), each applied to an upper edge of at least one of the fins to keep the radiator applied against the component, and the flexible blades (11) have a first end integral with the cover and a second free end applied against the upper edge of the fins. A cooling device with a radiator and a cover for holding the radiator in place.

A heat exchange assembly is disclosed. In some embodiments, the heat exchange assembly includes a plurality of profiles arranged in an parallel array, each profile including a first distal portion, a central portion and a second distal portion, with a length and a width of the central portion defining a plane, the first distal portion having a curvature departing from this plane in a first direction, and the second distal portion having a curvature departing from this plane in a second direction that is opposite the first direction. An amount of piping is thermally coupled with and disposed along the length the central portion of each profile. A bracketing system statically anchors the profiles to a surface. Fluid is circulated within the piping to facilitate heat exchange between the assembly and the surrounding environment.

An integrated liquid cooling heat dissipation device includes a liquid cooling radiator including first and second liquid boxes and a heat dissipation pipe set, a liquid cooling head and a liquid pump. The first liquid box forms an upper box body part and a lower box body part that is combined with the heat dissipation pipe set, so that the liquid collection space in the first liquid box is changed below the first liquid box, thereby reducing the height of the upper box body part. The upper box body part and the second liquid box protrude from the front and back of the heat dissipation pipe set, forming a fan installation space at the front and back of the liquid cooling radiator, so that the fan can simultaneously supply air to the heat dissipation pipe set and lower box body part to dissipate heat.

An integrated liquid cooling heat dissipation device includes a liquid cooling radiator including first and second liquid boxes and a heat dissipation pipe set, a liquid cooling head and a liquid pump. The first liquid box forms an upper box body part and a lower box body part that is combined with the heat dissipation pipe set, so that the liquid collection space in the first liquid box is changed below the first liquid box, thereby reducing the height of the upper box body part. The upper box body part and the second liquid box protrude from the front and back of the heat dissipation pipe set, forming a fan installation space at the front and back of the liquid cooling radiator, so that the fan can simultaneously supply air to the heat dissipation pipe set and lower box body part to dissipate heat.

A heating module for a substrate processing chamber includes heating lamps coupled to a reflector plate and a heat exchanger. The heat exchanger cools a gas within the heating module. A fan within the heating module circulates the gas through apertures in the reflector plate to cool the heating bulbs. The gas is cooled by the heat exchanger, and is recirculated. One or more shrouds directs the gas as the gas is being circulated.