A heat dissipation unit and a heat dissipation device using same are disclosed. The heat dissipation device includes a base and one or more heat dissipation units. The base has a first side and an opposite second side; and the heat dissipation units respectively include at least one radiation fin correspondingly provided on the first side of the base. The radiation fin is formed by correspondingly closing a first plate member and a second plate member to each other, such that a plurality of independent flow channels is defined between the closed first and second plate member. And, the independent flow channels respectively have an amount of working fluid filled therein.

The invention relates to two-phase heat transfer devices based on a closed evaporation-condensation cycle wherein the circulation of a working fluid is provided by capillary forces. The pressure capillary pump (PCP) according to the invention comprises a sealed housing having an inner cavity divided with a lyophobic capillary-porous partition into an evaporator cavity and a condenser cavity. A wick is arranged in the evaporator cavity. The condenser and evaporator cavities are mutually connected with a pipeline system to form a closed loop. The housing is filled with a two-phase working fluid, wherein a porous space of the wick, the condenser cavity and the pipeline system are filled with the liquid phase, and the space between the wick and the lyophobic partition is filled with saturated vapor. The housing may be made in the form of two cylindrical shells arranged coaxially to form an annular cavity, wherein a heat-generating source is arranged along the axis of the shells. To directly convert the thermal energy into the electric one, the PCP may comprise a liquid-metal MHD generator, wherein the housing is filled with a working fluid in the form of a liquid metal. The technical result consists in an increase in pressure and more efficient conversion of the thermal energy into the mechanical energy of the liquid working fluid flow.

A loop-type heat pipe includes an evaporator, a first condenser, a second condenser, a first liquid pipe having a first flow path and configured to connect the evaporator and the first condenser, a second liquid pipe having a second flow path and configured to connect the evaporator and the second condenser, a first vapor pipe configured to connect the evaporator and the first condenser, a second vapor pipe configured to connect the evaporator and the second condenser, and a connecting portion having a first porous body and configured to connect the first liquid pipe and second liquid pipe to the evaporator. The evaporator has a third flow path connected to the first liquid pipe and the first vapor pipe, a fourth flow path connected to the second liquid pipe and the second vapor pipe, and a partitioning wall configured to partition the third flow path and the fourth flow path.

A disclosed loop heat pipe includes an evaporator configured to absorb heat from outside by a wall to evaporate a working fluid from a liquid phase to a gas phase; a condenser configured to condense a gas phase working fluid introduced from the evaporator into a liquid phase; an elastic wick configured to contact an inner wall of the evaporator by an elastic force from the elastic wick; and a wick deformation member configured to deform the elastic wick increase a contact pressure of the elastic wick against the inner wall of the evaporator.

A heat dissipation unit and a heat dissipation device using same are disclosed. The heat dissipation device includes a base and one or more heat dissipation units. The base has a first side and an opposite second side; and the heat dissipation units respectively include at least one radiation fin correspondingly provided on the first side of the base. The radiation fin is formed by correspondingly closing a first plate member and a second plate member to each other, such that a plurality of independent flow channels is defined between the closed first and second plate member. The independent flow channels communicate with each other. And, the independent flow channels respectively have an amount of working fluid filled therein.

A heat exchanger includes: a baseplate having a first side and a second side opposite the first side, the first side being coupled to a thermosiphon, one or more electronic components being mounted on the second side. The baseplate has a two-phase heat spreading structure. In an embodiment, the heat exchanger includes a thermosiphon.

A system for processing essential oils includes a mixing tank, three winterization vessels, three respective filtering vessels, a fine filtering vessel, a holding tank, an evaporator, an essential oil reservoir, a solvent reservoir, and a solvent filtering vessel. The evaporator can include a heat exchanger configured to heat a plate down which a mixture including the oils flows, to evaporate other components of the mixture. Fluids can be advanced through the system using a pressurized inert gas.

A cooling device includes a partitioning board abutting inner faces of two boards, respectively. A chamber is defined between the partitioning board and one of the two boards. Another chamber is defined between the partitioning board and another of the two boards and intercommunicates with the chamber via an intercommunication port and a backflow port of the partitioning board. A pump drives a working fluid to circulate in the two chambers. Two welding channels are formed on outer faces of the two boards and surround the two chambers, respectively. The smallest distance between a channel bottom face of each annular welding channel and the inner face of a respective board having the annular welding channel is smaller than that between the inner and outer faces of the respective board. The two boards are coupled to the partitioning board along the annular welding channels by laser welding.

A two-phase cold plate includes an outer enclosure having a fluid inlet and a fluid outlet each fluidly coupled to a fluid pathway, an inner enclosure having a vapor cavity and a vapor outlet, and one or more wicking structures disposed in the outer enclosure. The one or more wicking structures fluidly couple the fluid pathway of the outer enclosure with the vapor cavity of the inner enclosure and the one or more wicking structures comprise a plurality of nucleation sites configured to induce vaporization of a cooling fluid and facilitate vapor flow into the vapor cavity of the inner enclosure.

A pump assisted heat pipe may combine the low mass flow rate required of latent heat pipe transfer loops with a hermetically sealed pump to overcome the typical heat pipe capillary limit. This may result in a device with substantially higher heat transfer capacity over conventional pumped single-phase loops, heat pipes, loop heat pipes, and capillary pumped loops with very modest power requirements to operate. Further, one or more embodiments overcome the gravitation limitations in the conventional heat pipe configuration, e.g., when the heat addition zone is above the heat rejection zone, the capillary forces are required to transfer the liquid from the heat rejection zone to the heat addition zone against gravity.