A thermal ground plane comprises top and bottom layers that are substantially impervious to fluid and together defining an inner space, a vapour transport mesh layer having a relatively coarse mesh structure and located within said space, and at least one liquid transport mesh layer having a relatively fine mesh structure and located between said vapour transport mesh layer and one of said top and bottom layers, the two said mesh layers being in contact with one another across substantially their entire planar extents. The top and bottom layers are sealed with a substantially fluid tight seal, and said inner space contains a liquid and is partially evacuated.

A evaporator of a loop heat pipe includes a liquid inlet side portion that extends in a widthwise direction crossing with a lengthwise direction from a liquid inlet side to a vapor outlet side, a plurality of portions that continue to the liquid inlet side portion and extend in the lengthwise direction, a plurality of vapor flow paths that are provided between the plurality of portions and extend in the lengthwise direction, and a vapor outlet side vapor flow path that extends in the widthwise direction and continues to the vapor flow paths. Each of the plurality of portions includes a first groove communicating two adjacent ones of the vapor flow paths.

A method for producing a heat pipe includes the steps: providing a pipe-shaped casing element having a length and an interior; filling a powder with particles into the casing element to form a capillary structure in the casing element; connecting the particles of the powder to one another, wherein the interior enclosed by the casing element is filled with the powder partially or in its entirety at least across a partial area of the length of the casing element, and subsequently the connection of the particles of the powder to one another and preferably also to the casing element in a layer lying against the casing element is established from the outside by inductive heat generation.

Some variations provide a leading-edge heat pipe comprising: (a) an envelope fabricated from a shell material, wherein the envelope includes at least one edge with a radius of curvature of less than 3 mm, and wherein the envelope includes, or is in thermal communication with, at least one heat-rejection surface; (b) a porous wick fabricated from a ceramic or metallic wick material, wherein the porous wick is configured within a first portion of the interior cavity, wherein at least a portion of the porous wick is adjacent to the inner surface, and wherein the porous wick has a bimodal pore distribution comprising an average capillary-pore size from 0.2 microns to 200 microns and an average high-flow pore size from 100 microns to 2 millimeters (the average high-flow pore size is greater than the average capillary-pore size); and (c) a phase-change heat-transfer material contained within the porous wick.

A heat dissipation net disposed on a base plate of a vapor chamber unit includes a base net portion and conduction units formed on the base net portion. Each conduction unit has a protruding area, a recessed area, and a curved section formed between the protruding area and the recessed area. When the heat dissipation net is disposed on the base plate, the existence of the recessed area and the curved section prevents the base net portion from being unduly pressed and stuck to the base plate to thereby improve a capillary action of the heat dissipation net. A space formed between each protruding area and the base plate facilitates the quick conduction of vaporized working fluid of the vapor chamber unit. Thus, the entire heat dissipation efficiency is increased.

The present application discloses two-phase cooling devices that may include at least three substrates: a metal with a wicking structure, an intermediate substrate and a backplane. A fluid may be contained within the wicking structure and vapor cavity for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane, wherein the fluid may be driven by capillary forces within the wicking structure. The titanium thermal ground plane may be adapted for use in a mobile device, such as a portable device or smartphone, where it may offer compelling performance advantages.

A flat-plate heat pipe and a preparation method thereof, and a heat exchanger are provided. The flat-plate heat pipe includes an upper shell (11) and a lower shell (12); the upper shell (11) and the lower shell (12) are assembled with each other to form a flat-plate shell (10) with a sealed cavity; the sealed cavity is filled with a phase change working medium; a capillary wick (20) is arranged in the flat-plate shell (10); and a surface of the capillary wick (20) has a micro-nano structure. By means of the arrangement of the above capillary wick having the micro-nano structure on the surface thereof, the flat-plate heat pipe has excellent heat conductivity and high resistance to gravity, and is flexible in use and arrangement.

A heat pipe includes an extruded profile body, with a hollow body closed at the ends, filled with a predefined volume of diphasic working fluid. A plurality of longitudinal channels are included, with each having a section delimited by a bottom formed by one tubular peripheral wall of the profiled body, and laterally by two longitudinal dividers. A circumferential transfer channel, which is arranged transversely to the local axial direction and provides mutual fluid connection between the longitudinal channels, is provided at a position along the longitudinal path and or at an end, where the longitudinal dividers are interrupted, partially or completely, in the area of the circumferential channel, with optional use of a closure ring.

A basic structural body for constructing heat dissipation device and a heat dissipation device are disclosed. The heat dissipation device includes a first basic structural body having a wick structure formed on one side surface thereof; and the first basic structural body and the wick structure are structural bodies formed layer by layer. Two pieces of first basic structural bodies can be correspondingly closed together to construct a heat dissipation device internally defining an airtight chamber. In this manner, the heat dissipation device can be designed in a more flexible manner.

The vapor chamber includes a casing, a working fluid, a microchannel, and a wick. The casing includes an upper casing sheet and a lower casing sheet that face each other and are joined together at an outer edge so as to define an internal space therebetween. The working fluid is sealed in the internal space. The microchannel is in the lower casing sheet and in communication with the internal space so as to form a flow path for the working fluid. The wick is in the internal space of the casing, and is in contact with the microchannel. An area of the wick is larger than an area of a region corresponding to the microchannel in a plan view of the vapor chamber.