A heat dissipation device is configured for a working fluid to flow therethrough. The heat dissipation device includes a base and at least one heat dissipation fin. The base has at least one internal channel configured for the working fluid to flow therethrough. The at least one heat dissipation fin having an extension channel and an inlet and an outlet is in fluid communication with the extension channel. The at least one heat dissipation fin is inserted into one side of the base, and the extension channel is communicated with the at least one internal channel through the inlet and the outlet.

An apparatus is provided which comprises: a die comprising an integrated circuit, a first material layer comprising a first metal, the first material layer on a surface of the die, and extending at least between opposite lateral sides of the die, a second material layer comprising a second metal over the first material layer, and a third material layer comprising silver particles and having a porosity greater than that of the second material layer, the third material layer between the first material layer and the second material layer. Other embodiments are also disclosed and claimed.

A cold plate may include a plate body having a thermal conductive side; a plurality of parallel hollow fluid channels running inside the plate body; at least one fluid inlet in direct fluid communication with a first subset of the plurality of parallel hollow fluid channels; at least one fluid outlet in direct fluid communication with a second subset of the plurality of parallel hollow fluid channels; and a porous thermal conductive structure which fluidly connect the first subset of the plurality of parallel hollow fluid channels to the second subset of the plurality of parallel hollow fluid channels, and which is in thermal contact with the thermal conductive side of the plate body. The porous thermal conductive structure may include a plurality of elongate fluid contact surface regions, each may be extending continuously lengthwise along a longitudinal side of respective fluid channel to serve as a fluid interface.

A cooling apparatus for a medium voltage switchgear includes an evaporator section; a fluid conduit; and a condenser section. The evaporator section surrounds a current carrying contact and is configured such that fluid within the evaporator section can contact an outer surface of the current carrying contact. The evaporator section is fluidly connected to the fluid conduit. At least part of the evaporator section is electrically insulating and is connected to the fluid conduit. The fluid conduit is fluidly connected to the condenser section. In use, a working fluid in the evaporator section is heated to a vapor state, the vapor is transferred by the fluid conduit to the condenser section, and the vapor in the condenser section is condensed to the working fluid. The working fluid is passively returned to the evaporator section.

A heat sink for use in drawing heat away from electronic devices such as solid state drives (SSDs) includes microchannels formed along its length. The microchannels may have a triangular cross-section and may be formed by additive manufacturing. Two pairs of microchannels are provided, with coolant fluid running in a first direction through the first pair, and in a second opposite direction in the second pair to minimize thermal gradients along the length of the SSD and heat sink. The walls of the microchannel may be formed with a roughness that provides turbulent flow through the microchannels. The turbulent flow together with the large surface area of the three sides of the triangular microchannels increases the heat transfer coefficient of the microchannels, while the triangular shape and pumping fluid through a pair of microchannels reduces pressure drop along the microchannels.

A liquid-cooling heat dissipation device and a liquid-cooling heat dissipation system for improving heat transfer efficiency are disclosed. The liquid-cooling heat dissipation device includes a vapor chamber, a liquid-separating cover, and a housing. The housing has a cold liquid inlet and a hot liquid outlet. An accommodating cavity is formed between the vapor chamber and the housing. By providing the vapor chamber, the heat transfer efficiency of the liquid-cooling heat dissipation device is improved greatly to realize rapid heat dissipation.

A loop heat pipe includes: an evaporator configured to vaporize a working fluid; a condenser configured to liquefy the working fluid; a liquid pipe that connects the evaporator and the condenser to each other; and a vapor pipe that connects the evaporator and the condenser to each other. The condenser includes: a first outer metal layer; a second outer metal layer; and an inner metal layer that is provided between the first outer metal layer and the second outer metal layer, and having a flow channel through which the working fluid flows. The first outer metal layer includes: a first inner face that contacts the inner metal layer; a first outer face opposite to the first inner face in a thickness direction of the first outer metal layer; and a first recess provided in the first outer face so as not to overlap the flow channel in plan view.

A heat dissipation device including a heat dissipation fin group, a plurality of heat pipes, and a vapor chamber is provided. The heat dissipation fin group includes a plurality of fins arranged along an extension direction and is divided into a first fin group, a second fin group, and a third fin group. The third fin group is disposed between the first fin group and the second fin group. Each fin of the first fin group and the second group includes a plurality of through holes. Each fin of the third fin group includes a plurality of notches. The heat pipes are disposed through the first fin group and the second fin group by the through holes. The vapor chamber is correspondingly disposed on the third fin group and includes a plurality of grooves. The vapor chamber is in contact with the heat pipes exposed from the notches.

The monolithic redundant loop cold plate core includes a core structure and a first cooling loop formed in the core structure. The first cooling loop including: a plurality of first cooling loop passageways extending across a heat exchanger core in one or more passes. The one or more passes include at least a first pass. The monolithic redundant loop cold plate core includes a second cooling loop formed in the core structure. The second cooling loop includes: a plurality of second cooling loop passageways extending across the heat exchanger core in the one or more passes. The plurality of first cooling loop passageways are intermixed in an alternating side-by-side arrangement with the plurality of second cooling loop passageways in a single cooling plane. The monolithic redundant loop cold plate core is a single piece including a unitary structure.

A monolithic redundant loop cold plate core includes a core structure and a first cooling loop formed in the core structure. The first cooling loop including one or more first cooling loop passageways extending across a heat exchanger core in one or more passes. The one or more passes include at least a first pass. The monolithic redundant loop cold plate core includes a second cooling loop formed in the core structure. The second cooling loop including one or more second cooling loop passageways extending across the heat exchanger core in the one or more passes. The one or more first cooling loop passageways are intermixed in an alternating side-by-side arrangement with the one or more second cooling loop passageways in a single cooling plane. The monolithic redundant loop cold plate core is a single piece including a unitary structure.