A heat sink device including: a cover module having a liquid inlet; a central flow channel for distributing coolant fluid introduced into the liquid inlet of the cover module; a plurality of inner fins; a plurality of inner radial flow channels; wherein coolant fluid from the central flow channel flows into the inner radial flow channels; a ring segment disposed around an outer perimeter of the plurality of inner fins, wherein the ring segment is configured to at least one of, mix and distribute coolant fluid received from the inner radial flow channels; a plurality of outer fins; a plurality of outer radial flow channels; wherein coolant fluid from the ring segment flows into the outer radial flow channels; and an outer flow channel, wherein coolant fluid flowing out of the radial flow channels outlet drains into the outer flow channel.

In accordance with the principals of the present invention, a cold tube is adapted to securely surround the beverage can, the cold tube utilizing high heat capacity/thermal mass to wick heat from the beverage in the beverage can. Contained within the cold tube, a plurality of fins are provided thus acting as a heatsink. The presence of the fins act as a heatsink by increasing convective, conductive, and radiative heat dissipation if used in the absence of the cold tube and conductive heat dissipation if used with the cold tube.

Methods, systems, devices and apparatuses for a charging apparatus for a vehicle. The charging apparatus includes a first sensor configured to measure or detect a temperature of the electronic device. The charging apparatus includes at least one of a blower, a bypass valve or a vent configured to adjust the temperature of the electronic device or a surface of a charging pad. The charging apparatus includes a processor coupled to the first sensor and the at least one of the blower, the bypass valve or the vent. The processor is configured to determine that the temperature of the electronic device exceeds a first threshold temperature. The processor is configured to control the at least one of the blower, the bypass valve or the vent to increase or decrease the temperature of the electronic device or the surface of the charging pad.

A heat exchange system for heat dissipation of an electronic control assembly includes: a first heat exchange portion including a first end having a first communication port and a second end having a second communication port; a second heat exchange portion including a first end having a third communication port and a second end having a fourth communication port, and at least a part of the second heat exchange portion being configured to be in contact with the electronic control assembly; a first connection tube communicating the first communication port with the third communication port; and a second connection tube communicating the second communication port with the fourth communication port. The first and second heat exchange portions and the first and second connection tubes constitute a loop, the loop has an opening, and the opening is closed when the heat exchange system is in an operative state.

The purpose of the present invention is to provide a sandwich structure that has both excellent heat dissipation properties and excellent mechanical properties. In order to achieve this purpose, the sandwich structure of the present invention has the following structure. The sandwich structure includes a core member (I), and a fiber reinforced member (II) disposed on both sides of the core member (I), wherein the core member (I) includes a sheet-shaped heat conductive member (III) having an in-plane thermal conductivity of 300 W/m.K or more.

A liquid-cooling heat sink is disclosed which includes a substrate, a cover and a separator. The substrate includes a plate, a set of first heat sinking fins and a set of second heat sinking fins. The cover has water inlet and outlet ports. The cover and the plate together delimit a heat exchange chamber in which both the set of first heat sinking fins and the set of second heat sinking fins are confined. The separator is disposed between the set of first heat sinking fins and the set of second heat sinking fins to divide the heat exchange chamber into a water inlet compartment and a water outlet compartment. The water inlet compartment and water outlet compartment are in communication with the water inlet and outlet ports respectively. The liquid-cooling heat sink has not only enhanced overall structural strength but also improved heat exchange efficiency with a coolant fluid.

A heat dissipation net disposed on a base plate of a vapor chamber unit includes a base net portion and conduction units formed on the base net portion. Each conduction unit has a protruding area, a recessed area, and a curved section formed between the protruding area and the recessed area. When the heat dissipation net is disposed on the base plate, the existence of the recessed area and the curved section prevents the base net portion from being unduly pressed and stuck to the base plate to thereby improve a capillary action of the heat dissipation net. A space formed between each protruding area and the base plate facilitates the quick conduction of vaporized working fluid of the vapor chamber unit. Thus, the entire heat dissipation efficiency is increased.

A heat dissipating device includes a thermosyphon, a first liquid cooling tube and a first heat dissipating fin set. The thermosyphon has an evaporation portion and a condensation portion. The first liquid cooling tube is sleeved on the condensation portion. The first heat dissipating fin set is sleeved on the first liquid cooling tube.

A heat exchanger with a thermoelectric module according to the present disclosure includes: a first heat exchanger including a first heat sink provided with a first base plate and first heat dissipation pins, a first thermoelectric module located over the first heat sink and performing heat absorption and heat dissipation, a plate-shaped first cooling plate located over the first thermoelectric module and having a flow channel through which coolant flows, and a first cover covering top of the first cooling plate; and a second heat exchanger having the same structure as the first heat exchanger and located under the first heat exchanger to be symmetrical with the first heat exchanger.

The invention relates to a device (2) for transferring heat from a thermally conductive plate (3) capable of capturing the heat from a zone placed on a first side (32) of the plate, the device comprising at least one fin (35) placed on a second side (34) of the plate (30) opposite the first side (32) and having a duct (36) extending in a longitudinal direction (L) between a first end (38) connected to the plate and a second end (4) opposite the first end and which opens out, the duct (36) being connected to at least one Venturi-effect neck (42) bringing cooling air into the duct, the neck (42) being formed in the vicinity of the first end of the duct and the plate (30).