A modularized water-cooling heat sink includes a cold discharge body, a water tank and a water pump. The water pump is connected with the water tank, and connected with the cold discharge body via an external cold head. The cold discharge body is provided with a first through hole in communication with outside, and the water pump is provided with a second through hole in communication with outside. The first through hole is located on the end of the cold discharge body away from the connection with the water pump. The water tank and the cold discharge body are detachably connected. The modularized water-cooling heat sink has such a modular structure design that it is assembled as simple as an integrated water-cooling heat sink, and that the heat dissipation effect thereof is as good as a split water-cooling heat sink.

A multi-channel high-efficiency heat dissipation water-cooling radiator includes a water distribution box, a water collection box, a first radiating pipe, a second radiating pipe, a third radiating pipe, and a fourth radiating pipe. Multiple chambers are formed by arranging partitions in both the water distribution box and the water collection box, and each radiating pipe is in communication with the corresponding chambers, so that the channels in the water-cooling radiator are connected in sequence to form a circuitous configuration. This allows the water to travel a longer distance in the water-cooling radiator, so that the water-cooling radiator can effectively cool the water and dissipate heat.

A water-cooling radiator includes a first water collection box, a second water collection box and a plurality of radiating pipes. A water pump chamber is disposed in a box body, and is in cooperation with a water pump, an impeller and a water pump cover to form. a water pump structure with good airtightness, so that the water pump and the first water collection box are effectively combined. The flow speed of water in the water-cooling radiator is effectively accelerated, which improves the heat dissipation efficiency. The overall heat dissipation effect of the product is very good.

A water cooling radiator assembly includes a water cooling radiator, a water cooling block, and two water pipes. The water cooling radiator includes a main body and at least one water collection box disposed on the main body. The outer surface of the water collection box is integrally formed with a plurality of ribs extending outwardly. The ribs can effectively increase the heat dissipation area of the water collection box, thereby improving the overall heat dissipation of the water cooling radiator greatly. The product performance is better, which brings convenience to use.

The present application provides a novel water cooling radiator with a detachable water pump and a built-in fan, which enables outside air to enter a cooling housing from air inlet holes in an upper end of the cooling housing and be discharged from air outlet holes in a lower end of the cooling housing, so that the air discharged from the air outlet holes can dissipate heat from and cool down various electronic components such as MOS tubes and memory chips around the motherboard and CPU, thereby improving the heat dissipation efficiency and prolonging the service life of the motherboard. A pump is connected externally to the radiator, which makes the installation and connection more convenient and the performance better.

A water-cooling radiator structure with pump includes a pump having a water outlet and a water inlet; and a water-cooling radiator including a first chamber that has a water-receiving room and a plurality of mutually communicable water passages therein. The water-receiving room is filled with a working fluid that reaches a level. The first chamber is externally provided with an outlet and an inlet as well as a pump mounting recess for mounting the pump therein. The water outlet and the water inlet are located corresponding to the outlet and the inlet, respectively, to be communicable with the water-receiving room and located lower than or flush with the level of the working fluid in the water-receiving room. And, the pump is detachably integrated into the water-cooling radiator. With these arrangements, it is able to overcome the problem of failed operation of the pump when the water-cooling radiator is laid horizontally.

A plate heat exchanger and methods of construction and use which allow the plate assemblies used in the exchanger to be easily cleaned and maintained and which allow the plate assemblies to be individually and separately removed from the exchanger for cleaning or maintenance while the exchanger remains online and while the other plate assemblies in the plate heat exchanger continue to operate.

A heat dissipation device includes a first pipeline and a second pipeline. The first pipeline is configured to circulate a first fluid. The second pipeline is configured to circulate a second fluid. The second pipeline has a sleeve portion. The sleeve portion is sleeved with a part of the first pipeline to form a circulation tunnel therebetween. One of the sleeve portions and the part of the first pipeline has a first surface and a second surface. The first surface contacts the first fluid. The second surface contacts the second fluid. The second surface has a plurality of protruding strips.

A heat dissipation device includes a first pipeline and a second pipeline. The first pipeline is configured to circulate a first fluid. The second pipeline is configured to circulate a second fluid. The second pipeline has a sleeve section, an input portion, and an output portion. The sleeve section sleeved with a part of the first pipeline to form a circulation tunnel between the sleeve section and the part of the first pipeline. The input portion and the output portion are connected to two ends of the sleeve section respectively.

A computer equipment cooling device comprising: a temperature dependent thermal conduction member that includes a first major surface and a second major surface; a set of fins connected in thermal communication with the first major surface; and a cold plate connected in thermal communication with the second major surface.