Embodiments may utilize a series of exposed fins, which increase the surface area of the heat sink creating additional air flow. As hotter air rises within the system, cooler is drawn into the heatsink. The fins may be exposed on both sides of the longitudinal axis, allowing cooler air to be drawn towards the longitudinal axis above the heatsink and flow upward. This process may cool the fins. Additionally, the spacing between the fins may have to be wide enough to allow for air to freely enter the heatsink.

A heat transfer plate and/or a plate heat exchanger including the heat transfer plate includes a plate body forming a patterned section and having a first side and a second side opposite to the first side; a gasket groove formed depressed from the plate body in a direction from the first side towards the second side, and having a bottom wall, the bottom wall having a bottom wall body; and where the gasket groove includes at least a first section with a first recess formed on the bottom wall body, depressed from the bottom wall body in the direction from the first side towards the second side, and a second section with a second recess formed on the bottom wall body, depressed from the bottom wall body in the direction from the second side towards the first side, wherein the second section is adapted to accommodate a gasket.

A printed circuit heat exchanger is provided. The printed circuit heat exchanger may include: a first bonding plate configured to include two plates bonded to each other and zigzag-shaped flow channels formed adjacent to each other between the two plates such that some sections of each of the plurality of flow channels are formed to overlap with adjacent flow channels; and a second bonding plate configured to include two plates bonded to each other and zigzag-shaped flow channels formed adjacent to each other between the two plates such that some sections of each of the plurality of flow channels are formed to overlap with adjacent flow channels, wherein the first bonding plate and the second bonding plate are alternately stacked.

In one general aspect, a microchannel heat exchanger is disclosed. It includes a cover, a base, and thermally conductive sheets between the cover and the base that each define a series of side-by-side lanes aligned with a flow direction. The lanes each include aligned slots that define microchannel segments and are separated by cross ribs. The sheets are stacked between the base and cover so as to cause at least some of the ribs to be offset from each other and allow the microchannel segments in the same lane in adjacent sheets to communicate with each other along the flow direction to define a plurality of microchannels in the heat exchanger.

A water-cooled heat dissipation device and an electrical device are provided. The water-cooled heat dissipation device includes a first water-cooled plate and a sealing plate. The first water-cooled plate includes a first water-cooled substrate and multiple first heat dissipation fins arranged on the first water-cooled substrate. The sealing plate includes a sealing plate substrate and multiple second heat dissipation fins arranged on the sealing plate substrate and each arranged between two first heat dissipation fins, and the water-cooled substrate is hermetically matched with the sealing plate substrate to form a water-cooled cavity for accommodating the first heat dissipation fins and the second heat dissipation fins. In the water-cooled heat dissipation device according to the present application, the second heat dissipation fins are provided on the sealing plate substrate, so as to increase the overall heat dissipation area of the water-cooled heat dissipation device.

A heat dissipation device includes a base, fins and strip-shaped plates. The fins protrude side by side from the base, and the fins respectively include first end edges and second end edges opposite to each other. The first end edges are connected to the base. The strip-shaped plates are parallel to the base and connected to at least a part of the second end edges of the fins, and strip-shaped openings are formed between the strip-shaped plates. The base, the fins and the strip-shaped plates collectively surround chambers in a non-closed manner, and each of the strip-shaped openings is connected to the corresponding chamber. A distance between two adjacent fins of the fins is S, a width of any one of the strip-shaped openings is d, and d/S is between 0.01 and 0.4.

A cold plate includes: a metal plate on which a plurality of fins are disposed; and a resin cover which covers the plurality of fins. A roughened portion is disposed on a tip surface of at least one of the plurality of fins. The roughened portion and the resin cover are fused to each other.

A heat exchanger includes front and rear walls forming a flue gas space such that a fluid flowing through a channel formed in the front and rear walls can exchange heat with flue gas in the flue gas space, in use. An entirety of the back wall extends along a first plane, and the back wall is provided with a back fin. The front wall includes a lower portion extending upwardly along the back wall, and an upper portion extending upwardly from an upper end of the lower portion and outwardly away from the back wall to form a combustion space of a flammable gas between the upper portion and the back wall. The upper portion is provided with a front fin. The front and back fins are arranged symmetrically with respect to a virtual line along which the flammable gas is to be injected into the combustion space.

A heat dissipation device includes an aluminum base seat and any or both of at least one copper two-phase fluid component and a copper heat conduction component. The aluminum base seat has an upper face and a lower face. A connection section is formed on the lower face and a copper embedding layer is disposed on the connection section. Any or both of the copper two-phase fluid component and the copper heat conduction component are disposed on the connection section and connected with the copper embedding layer. By means of the copper embedding layer disposed on the connection section, the aluminum base seat can be directly welded and connected with the copper two-phase fluid component and/or the copper heat conduction component made of heterogeneous metal materials without chemical nickel treatment procedure.

A diffusion bonding heat exchanger includes a first heat transfer plate and a second heat transfer plate. A high-temperature flow path of the first heat transfer plate includes a connection channel portion configured such that a high-temperature fluid can flow across a plurality of channels within at least a range that overlaps a predetermined range in a stacking direction, the predetermined range being a range from a flow path inlet of the second heat transfer plate to a position downstream of the flow path inlet.