A method for fabricating a straight fin heat sink (50) of the type having a base (52) and a plurality of fins (54) extending from the base is disclosed. Each fm (54) of the plurality of fins of the heat sink is spaced from one another a predetermined distance and lies along a plane generally parallel to planes of the other fins of the plurality of fins. The method includes: providing a die (20) configured to produce a heat sink (30) having a base (32) and a plurality of fins (34) attached to be base in a radial fashion about the base from at least one side of the base; extruding a blank of material through the die (20) to produce the heat sink (30); and compressing the plurality of fins (34) with a compression tool (40) so that the plurality of fins (54) extend from the base along planes generally parallel to each other.

A heat sink comprising a heat exchange device having a large-scale morphology over a scale range and a small-scale texture over a scale range, wherein at least one of the large-scale morphology and the small scale texture has a fractal-like self-similarity over a scale range. The large-scale morphology and small-scale texture may be defined and implemented independently, or be provided with a transitional range. The large-scale morphology may be algorithmically optimized according to a set of geometrically constraints. The small-scale texture may be optimized according to aerodynamic parameters and constraints. The heat sink may be dynamically varying, and/or operated in conjunction with a dynamically varying heat transfer medium supply.

An oil cooler is disclosed that comprises a base plate including a recessed portion defined by an interior wall and an exterior wall and including an inlet port and an outlet port. The base plate further includes a divider wall positioned in the recessed portion and extending between the exterior wall and the interior wall to separate the inlet port and the outlet port, a plurality of protrusions arranged in the recessed portion to provide a plurality of tortuous flow paths through which oil flows from the inlet port to the outlet port, and a first set of cooling fins formed on a surface of the base plate opposite the recessed portion. A cover plate is attached to the base plate so as to cover the recessed portion and thereby define a cavity to circulate the oil therethrough, the cover plate including a second set of cooling fins formed thereon.

There is provided an evaporator including: a container including a top plate, and a bottom plate configured to be heated by an electronic component; a reinforcing member having a tubular shape extending from the bottom plate to the top plate, and configured such that a coolant is introduced inside the reinforcing member; a side opening formed in a side portion of the reinforcing member, and configured to allow the coolant to flow out to the bottom plate; and a discharge port provided in the top plate outside the reinforcing member, and configured to discharge vapor from the container, the vapor being generated by the coolant contacting the bottom plate.

A roofing, cladding or siding product which is light weight, easy to install, durable, and resistant to environmental wear includes a module that can be used to form a weatherproof covering over top of a building surface. The module can also form a weatherproof covering, and be used as part of a thermal energy recovery or removal system. The module can also form part of a thermal energy recovery system that includes an array of solar cells to generate electrical energy.

A thermal energy transfer device attached to an object to dissipate thermal energy from the object is described. In one aspect, the device includes a non-metal base plate and first and second non-metal plate structures. The base plate includes at least one groove on one of its primary surfaces. An edge of the first plate structure is received in a first groove of the at least one groove of the base plate. An edge of the second plate structure is received in a second groove of the at least one groove of the base plate. At least the first groove or the second groove is a V-notch groove such that the edge of the first plate structure or the edge of the second plate structure that is received in the first groove or the second groove is interlockingly received in the V-notch groove.

A heat sink includes a base and plural thermal conductors. The base includes plural installation areas. The plural installation areas are in parallel with a first direction and separated from each other along a second direction. Each installation area includes a first lateral region, a second lateral region and a middle region. The plural thermal conductors are disposed on the corresponding installation areas. The thermal conductors on each installation area are classified into a first group and a second group. The thermal conductors of the first group are disposed on the first lateral region and in parallel with each other. The thermal conductors of the second group are disposed on the second lateral region and in parallel with each other. The thermal conductors of the first group are not in parallel with the thermal conductors of the second group.

Embodiments of a silicon-based heat dissipation device and a chip module assembly are described. An apparatus may include a silicon-based heat dissipation device, an extended device coupled to the silicon-based heat-dissipation device and heat-generating devices mounted on the silicon-based heat dissipation device. The silicon-based heat dissipation device may include a base portion having a first primary side and a second primary side opposite the first primary side. The silicon-based heat dissipation device may also include a protrusion portion on the first primary side of the base portion and protruding therefrom. The protrusion portion may include multiple fins. The base portion may include a slit opening with a first heat-generating device of the heat-generating devices on a first side of the slit opening and a second heat-generating device of the heat-generating devices on a second side of the slit opening opposite the first side of the slit opening.

A pin for a heat exchanger. The pin includes: a monolithic top section; a monolithic bottom section; and a middle section comprising a plurality of spaced apart sub-pins extending between the top section and the bottom section, wherein the plurality of sub-pins define one or more windows for allowing fluid flow through the middle section. Also disclosed is a layer of a heat exchanger including the pin, as well as a heat exchanger including the layer, and a method of making a layer for a heat exchanger.

A heat dissipation substrate for increasing solderability is provided. The heat dissipation substrate for increasing solderability includes a heat dissipation layer serving as a base layer, a plating layer formed on the heat dissipation layer, and a protective layer formed on the plating layer. The protective layer is made of one of tin and tin alloy, and the protective layer is capable of being melted in a subsequent process, such that the protective layer is a meltable protective layer.