F28F3/048

GENERAL PURPOSE ENCLOSURE
20210404748 · 2021-12-30 ·

A general purpose enclosure is provided. A general purpose enclosure for housing an internal unit and providing complete protection against an ingress of dust and water, comprising a first housing and a second housing. A plurality of cooling fins and one or more pressure ports along an exterior surface of the first housing and the second housing. One or more pressure ports comprising a pneumatic valve, pressure sensor cap and a vent membrane such that pressure venting, and pressure testing may be performed by the one or more pressure ports. A method of assembling a general purpose enclosure to an internal unit, comprising applying the first housing and the second housing to the internal unit such that the first housing and the second housing encompass the internal unit and fastening the first housing to the second house.

INTEGRATED HYBRID COMPACT FLUID HEAT EXCHANGER

An Integrated Hybrid Compact Fluid Heat Exchanger is disclosed. An example embodiment includes: a micro-channeled plate for a stream of a working fluid, the micro-channeled plate being diffusion bonded or brazed with a cover plate; and a fin assembly brazed, diffusion bonded, or welded to the micro-channeled plate. Other embodiments include a fan or blower coupled to the Integrated Hybrid Compact Fluid Heat Exchanger via air ducting or close coupling.

Microchannel heat exchangers for gas turbine intercooling and condensing

A microchannel heat exchanger (MCHX) includes an air-passage layer including a plurality of air-passage microchannels, a working fluid layer including a plurality of working fluid microchannels, and a sealing layer coupled to the working fluid layer to provide a working/sealing layer set. The working/sealing layer set includes an arrangement of raised pedestals. The raised pedestals may extend from the working fluid layer to the sealing layer and contact the sealing layer.

Modified shaped heat exchanger inlets/outlets

A modified shaped heat exchanger hot air inlet and hot air outlet comprising a first heat exchanger manifold surrounding said hot air inlet and a second heat exchanger manifold surrounding said hot air outlet; an array of shaped inlets and shaped outlets, each of said shaped inlets and shaped outlets being configured to align vertices with thermal load directions responsive to a thermal expansion mismatch between the hot air inlet and hot air outlet and respective first heat exchanger manifold and second heat exchanger manifold.

PLATE CONSTITUTING A HEAT EXCHANGER, AND HEAT EXCHANGER COMPRISING AT LEAST ONE SUCH PLATE

The invention relates to a plate (105) forming part of a heat exchanger and intended to delimit at least one channel (111) for circulation of a fluid. The plate (105) extends principally along an axis of longitudinal extent (A1). The plate (105) comprises at least one bottom (106), at least one first lateral raised edge (19a) which is inscribed within a first plane (P1) intersecting the axis of longitudinal extent (A1), and at least two openings (110) which are configured such that the fluid enters and exits the channel (111), respectively. The bottom (106) is provided with a rib (113) which extends longitudinally from the first lateral raised edge (109a). The rib (113) is positioned between the two openings (110). The rib (113) is of a sinuous configuration.

HEAT EXCHANGER PLATE WITH OPTIMISED OPENING

The invention relates to a heat exchanger (20) plate (1, 2a) intended to delimit at least one channel (30, 30a, 30b) for circulation of a fluid, the circulation plate (1) being provided with a bottom (3) and a raised rim (5, 5a-5h) that surrounds the bottom (3), the circulation plate (1) comprising at least one opening (7, 7a-7d) through which a fluid can enter the channel (30, 30a, 30b), characterized in that the opening (7, 7a-7d) is delimited by at least one at least partially rectilinear edge (9a). Application to the field of heat exchanges.

FLUID COOLING SYSTEM INCLUDING EMBEDDED CHANNELS AND COLD PLATES
20210398878 · 2021-12-23 ·

Fluid cooling systems are discussed herein. The system may include a top portion including a first surface receiving package(s) generating heat during operation, a second surface positioned opposite the first surface, and a plurality of embedded channels formed on the second surface. The system may also include a bottom portion positioned adjacent the top portion. The bottom portion may include inlet section(s) receiving a coolant and a plurality of inlet fluid conduits formed adjacent to and in fluid communication with the inlet section(s). The bottom portion may also include a plurality of outlet fluid conduits formed adjacent to the plurality of inlet fluid conduits. Each outlet fluid conduit may be in fluid communication with at least one of the inlet fluid conduits. The bottom portion may further include an outlet section(s) in fluid communication with the plurality of outlet fluid conduits and the inlet section(s).

Single-piece heat exchanger

A heat exchanger is provided with a unitary, single-piece structure that can be formed via 3D printing, for example. The heat exchanger includes a main body defining a first fluid inlet port, a first fluid outlet port, a second fluid inlet port, and a second fluid outlet port, wherein each of these fluid ports are integrally formed with the main body. A plurality of plates are stacked and integrally formed with the body. First fluid channels are defined by gaps in the material of the main body and are in fluid communication with the first fluid inlet port. Second fluid channels are defined by gaps in the material of the main body and are in fluid communication with the second fluid inlet port. The first fluid channels and the second fluid channels are interposed between the plates in alternating fashion along the stacked arrangement.

EVAPORATIVE COOLING SYSTEM
20210381773 · 2021-12-09 ·

One variation of a cooling system includes: a cooling unit including a substrate defining a thermally-conductive material and a coating defining a porous, hydrophilic material. The substrate defines: a base; a heatsink structure extending from the base; and an open network of pores extending between surfaces of the substrate. The coating extends across surfaces of the substrate and lines the open network of pores within the substrate. The heatsink structure is configured to: communicate thermal energy from a first working fluid, flowing over the heatsink structure, into the heatsink structure, to cool the first working fluid; and release thermal energy and moisture, contained in pores of the coating, into a second working fluid flowing over the heatsink structure, to cool the second working fluid and the heatsink structure.

RADIATOR
20210378144 · 2021-12-02 ·

A radiator is provided having high heat dissipation performance while being compact and lightweight. A radiator 1 is configured from a base portion 4 having a heat receiving surface 2 abutting on a heat generating element, such as a semiconductor device and an electronic component, and a heat transfer surface 3 opposed to the heat receiving surface 2 and a fin 5 extending from the heat transfer surface 3 of the base portion 4. In the radiator 1 thus configured, the fin 5 is configured from a fin base 5a extending from the heat transfer surface 3 and a plurality of heat diffusing projections 8 and 9 formed on a surface of the fin base 5a.