A method for forming features in an exterior surface of a heat transfer tube includes forming a plurality of channels into the surface, where the channels are substantially parallel to one another and extend at a first angle to a longitudinal axis to the tube. A plurality of cuts are then made into the surface substantially parallel to one another and extend at a second angle to a longitudinal axis to the tube different from the first angle. Individual fin segments extend from the surface and are separated from one another by the channels and the cuts. The fin segments have a first channel-adjacent edge adjacent substantially parallel to the channel, a first cut-adjacent edge substantially parallel to the cut, and a corner formed by a second channel-adjacent edge and a second cut-adjacent edge. A tube formed using this method can be used as a condenser tube.

An outer finned tube includes a tube body, an outer wall of the tube body is provided with outer tins spirally arranged in an extension direction of the tube body; grid fins are arranged between two adjacent spiral parts of the outer fins correspondingly; two ends of each grid fin are connected to the two adjacent spiral parts of the corresponding outer fin respectively; a gap is kept between each grid fin and the outer wall of the tube body; and the plurality of grid fins are spaced in the extension direction of the tube body. An enhancing cavity is formed in an area defined by the outer wall of the tube body, inner walls of the grid fins and the outer tins in an encircling way, which can form a larger degree of superheat, provides a nucleation point for a boiling/condensation process and improves a heat exchange performance.

A two-phase cooling system with flow boiling, characterized in that a closed hydraulic circuit apparatus of a heat transfer refrigerating fluid is provided, including: a pump for a refrigerating fluid which, at least in some stretches of the circuit, is two-phase liquid-vapor or multi-phase; a heat sink-evaporator configured to transfer heat by conduction from a component to be cooled to the refrigerating fluid; a condenser, capable of condensing the vapor which develops on the evaporator while simultaneously dissipating the heat given by the refrigerating fluid both by conduction, convection and radiation and by condensation into the environment; a tank which also acts as an expansion vessel, or a tank and an expansion vessel which are distinct and connected to each other; and a plurality of sensors, including flow rate, pressure and temperature sensors and an electronic control system of the pump.

A device and related method that provides, but is not limited thereto, a two-phase heat transfer device with unique combination of enhanced evaporation and increased cooling capacity. An advantage associated with the device and method includes, but is not limited thereto, increased cooling capacity per unit area, controlled and optimized evaporation, 10 prevention of boiling, and prevention of drying of the evaporator. An aspect associated with an approach may include, but is not limited thereto, using a non-wetting coating or structure to keep working fluid away from the spaces between elongated members of an evaporator and using a wetting coating or structure to form thin films of working fluid around the distal region of the elongated members.

The present invention provides a heat transferring device and a method for making thereof. The heat transferring device has a thermal conducting substrate and a porous layer. The thermal conducting substrate has a plurality of protrusions and concave bottom surfaces. The concave bottom surfaces are located between the protrusions. The porous layer is embedded between the protrusions. The present invention also provides a high temperature material transferring system comprising a cylindrical container and the heat transferring device disposed on the surface of the cylindrical container.

A liquid cooled heat exchanger includes first and second heat exchange chambers that are in thermal communication. The first heat exchange chamber is downstream of the second heat exchanges chamber and receives heat from a heat generating device, such as an electronic circuit. Heat in the first heat exchange chamber can be transferred to the second heat exchange chamber to increase the temperature of a subcooled liquid working fluid in the second heat exchange chamber. This can render a pressure drop across the heat exchanger that is relatively insensitive to a fraction of liquid that is vaporized in the first heat exchange chamber.

A structure for enhancing condensation and wetting dynamics includes a substrate and a plurality of grooves formed in the substrate, forming fins. The fins having fin tops and a coating is applied over the fin tops.

Heat transfer devices and systems are provided for the rapid cooling of pulsed high-powered, high-flux devices using flash boiling. Such devices comprise at least two fluidly connected chambers and a heat exchanger in thermal communication with a heat source. A flash boiling event is actively triggered at a location close to the heat source by rapid depressurization of the chamber containing a multi-phase coolant. This boiling process allows for high heat transfer rates from the heat source into the chambers due to the latent heat of vaporization, which results in the rapid cooling of the heat source. A porous medium may also be positioned within a chamber of the device to enhance boiling nucleation and extended surface heat transfer. Methods of rapidly cooling pulsed heat sources are also provided using the devices and systems hereof.

An evaporator assembly including an inlet header, an outlet header, and an evaporator body extending from the inlet header to the outlet header. The evaporator body defining a channel fluidly connected to the outlet header. The evaporator assembly further includes a feed tube including: an adapter fluidly connected to the inlet header and a perforated tube fluidly connected to the inlet header through the adapter. The perforated tube including a first end attached to the adapter, a second end opposite the first end, and a plurality of orifices fluidly connecting the perforated tube to the channel. The perforated tube extends within the channel.

Evaporator assemblies, vapor chamber assemblies, and methods for fabricating a vapor chamber are disclosed. In one embodiment, an evaporator assembly for a vapor chamber includes an evaporator surface, an array of posts extending from the evaporator surface, and an array of vapor vents within the evaporator surface. Each vapor vent of the array of vapor vents is configured as a depression within the evaporator surface. The evaporator assembly further includes a porous layer disposed on the evaporator surface, the array of posts, and the array of vapor vents.