F28F21/084

Onboard electronic device
09728488 · 2017-08-08 · ·

An onboard electronic device includes: an element that generates heat; a member that is provided between the element and a coolant cooling the element, and differs in thermal expansion coefficient from the element; an element temperature sensor that detects the temperature of the element; a coolant temperature sensor that detects the temperature of the coolant; and a controller that controls operation of the element such that the temperature of the element allowed when the temperature of the coolant is a first temperature is lower than the temperature of the element allowed when the temperature of the coolant is a second temperature that is higher than the first temperature.

DEVICE AND METHOD FOR STORING THERMAL ENERGY

A device to store energy includes a phase change material (PCM), with a phase change temperature Tc, contained in a sealed container and constituting a storage core. A source to exchange heat with the PCM, at a temperature TA, to cause a phase change of the PCM. A recuperator to exchange heat with the PCM, at a temperature TB, to cause a phase change of the PCM in the opposite direction to the phase change produced by the source. A controller to control the heat flows between the PCM, the source and the recuperator. An apertured support in contact with the PCM in the sealed container and in thermal contact with the source and the recuperator.

Aluminum fin alloy and method of making the same

The present invention relates to an aluminum alloy product for use as a finstock material within brazed heat exchangers and, more particularly, to a finstock material having high strength and conductivity after brazing. The invention is an aluminum alloy finstock comprising the following composition in weight %: TABLE-US-00001 Fe  0.8-1.25; Si  0.8-1.25; Mn 0.70-1.50; Cu 0.05-0.50; Zn up to 2.5; other elements less than or equal to 0.05 each and less than or equal to 0.15 in total; and balance aluminum.
The invention also relates to a method of making the finstock material.

Aluminium composite material having an internal solder layer

The invention relates to a brazable three-layered aluminum composite material having at least three layers with at least two different aluminum alloys, whereby an inner layer of the at least three layers is an aluminum brazing layer made from an aluminum brazing alloy, the other layers are configured as covering layers and include at least one further aluminum alloy, wherein the at least one further aluminum alloy has a higher solidus temperature than the liquidus temperature of the aluminum brazing alloy. The individual covering layers have a thickness which exceeds the thickness of the aluminum brazing layer by at least a factor of 1.5, preferably by a factor of 5. The brazable aluminum composite material is simply structured, has good brazing properties for the production of butt-joint brazing connections, significantly reduces the risk of a ‘burning through’ of brazed-on components and provides sufficient mechanical properties.

Heat sink
20170280591 · 2017-09-28 ·

A heat sink that radiates heat via the metal shell of the electronic device is provided. The upper portion of the heat sink is formed by a solid aluminium block boss, and the lower portion of the heat sink is formed by an aluminium substrate, wherein at least one fin is configured on either side of the solid aluminium block boss.

Brazing pre-flux coating with improved corrosion performance

A pre-flux coating for the manufacturing of heat exchanger components of aluminum, wherein the coating comprises a combination of fluxes in the form of potassium aluminum fluoride K.sub.1-3AlF.sub.4-6, potassium trifluoro zincate, KZnF.sub.3, lithium aluminum fluoride Li.sub.3AlF.sub.6, a filler material in the form of metallic Si particles, Al—Si particles and/or potassium fluoro silicate K.sub.2SiF.sub.6, an additive in the form of aluminum oxide and at least one other oxide selected from the group consisting of zinc oxide, titanium oxide and cerium oxide forming a post braze ceramic layer, and a solvent and a binder containing at least 10% by weight of a synthetic resin which is based, as its main constituent, on a methacrylate homopolymer or a methacrylate copolymer.

HEAT DISSIPATION COMPONENT FOR SEMICONDUCTOR ELEMENT

A heat dissipation component for a semiconductor element includes: a composite part containing 50-80 vol % diamond powder with the remainder having metal including aluminum, the diamond powder having a particle diameter volume distribution first peak at 5-25 μm and a second peak at 55-195 μm. A ratio between a volume distribution area at particle diameters of 1-35 μm and a volume distribution area at particle diameters of 45-205 μm is 1:9 to 4:6; surface layers on both composite part principal surfaces, each of the surface layers containing 80 vol % or more metal including aluminum and having a film thickness of 0.03-0.2 mm; and a crystalline Ni layer and an Au layer on at least one of the surface layers, the crystalline Ni layer having a film thickness of 0.5-6.5 μm, and the Au layer having a film thickness of 0.05 μm or larger.

COMPOSITE STRUCTURE COMPRISING A RESIN LOADED WITH FLAT GRAPHENE SHEETS HAVING ENHANCED THERMAL AND ELECTRICAL CONDUCTIVITY, IN PARTICULAR FOR A SATELLITE

A composite structure comprising an organic resin and carbon fibers comprises planar structure graphene nanosheets embedded in the resin. This structure combining good properties in terms of mechanical resilience, thermal conductivity and electrical conductivity can advantageously be used for thermal dissipation devices, as solar generator substrate or else as housing of electronic components, carried on board satellites.

ALUMINUM ALLOY CLADDING MATERIAL FOR HEAT EXCHANGER

An aluminum alloy clad material includes a core material, one side being clad with cladding material 1, the other side being clad with cladding material 2, the core material including an aluminum alloy that includes 0.5 to 1.8% of Mn, and limited to 0.05% or less of Cu, with the balance being Al and unavoidable impurities, the cladding material 1 including an aluminum alloy that includes 3 to 10% of Si, and 1 to 10% of Zn, with the balance being Al and unavoidable impurities, and the cladding material 2 including an aluminum alloy that includes 3 to 13% of Si, and limited to 0.05% or less of Cu, with the balance being Al and unavoidable impurities, wherein the Si content X (%) in the cladding material 1 and the Si content Y (%) in the cladding material 2 satisfy the value (Y−X) is −1.5 to 9%.

BRAZING METHOD
20170320170 · 2017-11-09 ·

A hollow aluminum structure that will be brazed includes at least one brazing sheet having a filler metal layer clad onto a core layer. The core layer is composed of aluminum or an aluminum alloy containing less than 0.2 mass % Mg. The filler metal layer is composed of an aluminum alloy that contains Si: 4.0-13.0 mass % and Bi: 0.01-0.3 mass %, and further contains Li: 0.004-0.08 mass % and/or Be: 0.006-0.12 mass %, the filler metal layer containing less than 0.1 mass % Mg. The hollow aluminum structure is assembled such that the filler metal layer is present at locations that will form both an interior-facing brazed joint and an exterior-facing brazed joint. Then, flux is applied onto the filler metal layer at the location that will form the exterior brazed joint, and the hollow aluminum structure heated in an inert gas atmosphere to form the interior brazed joint and the exterior brazed joint.