A lighting system includes two or more lighting fixtures, each comprising a housing, at least one light source mechanically supported by the housing, at least one pipe thermally coupled to the housing to carry a fluid coolant, an AC power port, and at least one network communications port. The AC power ports of respective lighting fixtures are coupled together with a plurality of industrial power cables without using one or more conduits for the plurality of industrial power cables. The network communications ports of the respective lighting fixtures are coupled together with a plurality of waterproof network communications cables. In one example, a lighting system kit comprises two or more lighting fixtures having an AC power port comprising an industrial type connector. The kit further comprises multiple industrial power cables and one or more industrial drop tee cables.

A heat sink plate includes a first layer made of copper (Cu) or a copper (Cu) alloy, a second layer formed on the first layer and made of molybdenum (Mo) or an alloy that includes copper (Cu) and one or more components selected from molybdenum (Mo), tungsten (W), carbon (C), chromium (Cr), titanium (Ti), and beryllium (Be), a third layer formed on the second layer and made of copper (Cu) or a copper (Cu) alloy, a fourth layer formed on the third layer and made of molybdenum (Mo) or an alloy that includes copper (Cu) and one or more components selected from molybdenum (Mo), tungsten (W), carbon (C), chromium (Cr), titanium (Ti), and beryllium (Be), and a fifth layer formed on the fourth layer and made of copper (Cu) or a copper (Cu) alloy.

A heat sink includes a bottom plate, a liquid barrier structure and a microstructure used for heat dissipation. The liquid barrier wall is arranged on the bottom plate. The liquid barrier wall is closed on the bottom plate to form a container. The microstructure for heat dissipation is arranged in the container and includes porous materials or 3D-structures with small sizes.

One example provides a cooling system, including: a first side configured to face an ambient environment; a second side configured to face an enclosure interior; a flange that surrounds the system and is configured for attachment to an opening of the enclosure; a thermostat; one or more fans; one or more compressors; and a controller configured to: utilize two or more set points and input from the thermostat to variably control the one or more fans and one or more compressors using variable direct current (VDC).

Provided is a heat sink that has a clad structure of a Cu—Mo composite material and a Cu material and has a low coefficient of thermal expansion and high thermal conductivity. The heat sink comprises a pair of Cu—Mo composite layers and a Cu layer stacked in a thickness direction so that the Cu layer is interposed between the Cu—Mo composite layers or comprises three or more Cu—Mo composite layers and two or more Cu layers alternately stacked in the thickness direction so that two of the Cu—Mo composite layers are outermost layers on both sides, wherein each of the Cu—Mo composite layers has a thickness section microstructure in which flat Mo phase is dispersed in a Cu matrix. Such a clad structure achieves high thermal conductivity together with a low coefficient of thermal expansion.

A heat sink includes a bottom plate, a liquid barrier structure and a microstructure used for heat dissipation. The liquid barrier wall is arranged on the bottom plate. The liquid barrier wall is closed on the bottom plate to form a container. The microstructure for heat dissipation is arranged in the container and includes porous materials or 3D-structures with small sizes.

A liquid cooling head manufacturing method includes the following steps. First, a liquid channel main body is provided. Then, a heat dissipation bottom plate and a heat sink are disposed in different recessed indentations in the liquid channel main body. The heat dissipation bottom plate and the heat sink are welded in the liquid channel main body and a cover plate is sealed on the liquid channel main body.

The present disclosure relates to a copper alloy tube for a heat exchanger having excellent breaking strength and a method of manufacturing the same, and more particularly, to a Cu alloy tube having excellent breaking strength and thermal conductivity and suitable for use in a heat exchanger, and a method of manufacturing the same.

According to the present disclosure, a laptop may be provided with a compartment including a moveable segment, an expandable heat exchanger with a movable section, and an expandable fan unit. The release of the movable segment of the compartment from a lower portion of the compartment produces an opening in the compartment and the movable section of the expandable heat exchanger is extended downward, and the expandable fan unit is lowered when the movable segment of the compartment is released.

A gas tube for an EGR cooler has such a structure that a metal plate having a flat plate shape is bent in a tube shape. The metal plate includes a core material, a sheath material clad on one surface of the core material or on both surfaces thereof, and an intermediate material clad between the core material and the sheath material so as to prevent magnesium from diffusing from the core material to the sheath material. The core material includes copper (Cu), silicon (Si), iron (Fe), magnesium (Mg), manganese (Mn), titanium (Ti), and aluminum (Al).