A flexible circuit board includes a flexible substrate, an electronic component and a heat spreader. The electronic component and the heat spreader are disposed on a top surface and a bottom surface of the flexible substrate, respectively. The heat spreader includes a copper layer which contains more than or equal to 50% copper grains by volume with (1,0,0) crystallographic orientation.

An additively manufactured heat exchanger configured to transfer heat between a first fluid and a second fluid includes a first channel with a first wall configured to port flow of a first fluid and a second channel with a second wall configured to port flow of a second fluid. The heat exchanger also includes a barrier channel containing unprocessed build powder provided by the additive manufacturing process and is located between the first wall and the second wall. The barrier channel is configured to prevent mixing of the first fluid and the second fluid when one of the first wall and the second wall ruptures.

A lighting system includes two or more lighting fixtures, each comprising a housing, at least one light source mechanically supported by the housing, at least one pipe thermally coupled to the housing to carry a fluid coolant, an AC power port, and at least one network communications port. The AC power ports of respective lighting fixtures are coupled together with a plurality of industrial power cables without using one or more conduits for the plurality of industrial power cables. The network communications ports of the respective lighting fixtures are coupled together with a plurality of waterproof network communications cables. In one example, a lighting system kit comprises two or more lighting fixtures having an AC power port comprising an industrial type connector. The kit further comprises multiple industrial power cables and one or more industrial drop tee cables.

The invention relates to a method for producing a cooling device (10), which has at least one hollow body (30) made of a first material having good thermal conduction and a base body made of a second material having good thermal conduction, and a pre-product for the production of a cooling device (10) and a cooling device (10) for an electrical assembly and an electrical assembly having a cooling device of this kind. The hollow body (30) is coated on the outside with a third material and is filled on the inside with the third material, which has a lower melting temperature than the first material and the second material, wherein the filling (5) completely fills the hollow body and is then cooled, wherein the filled hollow body (30) is placed in a die-casting mould, wherein the second material is introduced into the die-casting mould as die casting with a first temperature and flows around the hollow body (30) at least partially, wherein the die casting melts off the third material of the surface coating (36) and melts on the first material of the hollow body (30) so that at least in regions an integral connection is formed between the die casting of the second material, which forms the base body (20), and the first material of the hollow body (30), wherein the die casting of the second material becomes rigid and solid, wherein during the solidification phase, the die casting of the second material heats the filling (5) made of the third material in the interior of the hollow body (30) until the melting temperature is reached, and wherein the melted third material is removed from the hollow body (30) under pressure.

A radiator structure is provided. The radiator structure includes a substrate, a first metal coating layer and a second metal coating layer. The first metal coating layer and the second metal coating layer are made of materials different from one another, and are formed on the substrate by different processes. The first metal coating layer is a non-first masking area formed on the substrate by wet processing. The second metal coating layer is a non-second masking area correspondingly formed on the first metal coating layer and the substrate by sputtering. A first masking area and a second masking area are not necessarily the same.

Disclosed is a covering for an information handling system. The covering includes an aluminum alloy layer that can include at least a portion of recycled aluminum. The covering includes a copper heat pipe that can include at least a portion of recycled copper. The heat pipe and the aluminum alloy layer can be directly coupled to each other, with a heat-conductive carbonaceous material provided at the interface between the aluminum alloy layer and the heat pipe.

A thermal ground plane (TGP) is disclosed. A TGP may include a first planar substrate member comprising copper and a second planar substrate member comprising a metal, wherein the first planar substrate member and the second planar substrate member enclose a working fluid. The TGP may include a first plurality of pillars disposed on an interior surface of the first planar substrate and a mesh layer disposed on the top of the first plurality of pillars, wherein the mesh layer comprises at least one of copper, polymer encapsulated with copper, or stainless steel encapsulated with copper. The TGP may also include a second plurality of pillars disposed on an interior surface of the second planar substrate member within an area defined by the perimeter of the second planar substrate member and the second plurality of pillars extend from the second planar substrate member to the mesh layer.

A basic structural body for constructing heat dissipation device and a heat dissipation device are disclosed. The heat dissipation device includes a first basic structural body having a wick structure formed on one side surface thereof; and the first basic structural body and the wick structure are structural bodies formed layer by layer. Two pieces of first basic structural bodies can be correspondingly closed together to construct a heat dissipation device internally defining an airtight chamber. In this manner, the heat dissipation device can be designed in a more flexible manner.

An outer finned tube includes a tube body, an outer wall of the tube body is provided with outer fins spirally arranged in an extension direction of the tube body; grid fins are arranged between two adjacent spiral parts of the outer fins correspondingly; two ends of each grid fin are connected to the two adjacent spiral parts of the corresponding outer fin respectively; a gap is kept between each grid fin and the outer wall of the tube body; and the plurality of grid fins are spaced in the extension direction of the tube body. An enhancing cavity is formed in an area defined by the outer wall of the tube body, inner walls of the grid fins and the outer fins in an encircling way, which can form a larger degree of superheat, provides a nucleation point for a boiling/condensation process and improves a heat exchange performance.

A heat transfer system having a heat transfer fluid circulation loop of a first fluid is disclosed. A conduit is disposed in the fluid circulation loop with an inner surface in contact with the first fluid at a first pressure. An outer surface of the first conduit is in contact with a second fluid at a second pressure that is 69 kPa to 13771 kPa (10 psi to 2000 psi) higher than the first pressure. The conduit also includes a polyurea coating on its outer surface.