A copper-alloy heat-dissipation structure with a milled surface includes a heat-dissipation main body. The heat-dissipation main body has a first milled surface and a second milled surface that are opposite to each other, where heat-dissipation fins are formed on the first milled surface, and the maximum height roughness Rz of the second milled surface ranges from 2.5 μm to 5.4 μm.

A solvent heater for vehicular window washing solvent wherein the solvent heater is a vehicular exhaust pipe. There is a vessel having an inlet through which a washing fluid is received from a reservoir and an outlet through which the fluid is discharged for cleaning the window. There is a heating element for heating the fluid in the vessel, which element preheats the vessel before the washing fluid is received therein, whereby at least an initial quantity of the fluid is rapidly heated and discharged from the vessel.

Various embodiments provide apparatuses, systems, and methods related to a heat sink with one or more removable inserts. Respective inserts may include one or more fins that define one or more channels for flow of cooling fluid. The fins may be formed of a composite material that is different than a material of the heat sink body. Other embodiments may be described and/or claimed.

The present invention provides a temperature control unit capable of efficiently controlling a temperature of a specific object with reduced risk of failure of electronic components due to leakage of a temperature control medium. The temperature control unit (1), which controls a temperature of a specific object, contains a temperature control medium, and a metal fiber sheet (50) that is formed with a space serving as a channel of the temperature control medium. The latent heat of evaporation of the temperature control medium is within the range of from 70 to 200 kJ/kg when the temperature control medium changes the state from a liquid state to a gaseous state. The volume expansion rate of the temperature control medium is at most 250 times when the temperature control medium changes the state from a liquid state to a gaseous state under atmospheric pressure.

A display device is capable of substantially reducing or preventing warping or deformation thereof by using a bimetallic effect. The display device includes a backlight unit including at least one light source; a light source circuit board at which the light source is disposed; a first heat dissipation plate configured to receive heat generated from the light source through the light source circuit board, and to discharge the heat; a bottom case configured to accommodate the light source, the light source circuit board, and the first heat dissipation plate; and a second heat dissipation plate configured to resist a deformation force that is applied to the first heat dissipation plate or the bottom case, the second heat dissipation plate has a thermal expansion coefficient different from a thermal expansion coefficient of the first heat dissipation plate.

The present invention provides a composite server heat sink with a metal base having a thermal conductivity of at least 200 W/mK. Plural fins extend from the metal base, each fin having an anisotropic thermal conductivity in a range of approximately 300 to 650 W/mK in a longitudinal direction of the fin and less than approximately 30 W/mK in a widthwise direction of the fin. Each fin includes graphite in an amount of approximately 45-70 wt. %, diamond in an amount of approximately 2.5 to 10 wt. % with the balance comprising a metal selected from one or more of copper and aluminum. To create the anisotropic thermal properties, the graphite is aligned along the longitudinal direction of the fin.

A lighting system includes two or more lighting fixtures, each comprising a housing, at least one light source mechanically supported by the housing, at least one pipe thermally coupled to the housing to carry a fluid coolant, an AC power port, and at least one network communications port. The AC power ports of respective lighting fixtures are coupled together with a plurality of industrial power cables without using one or more conduits for the plurality of industrial power cables. The network communications ports of the respective lighting fixtures are coupled together with a plurality of waterproof network communications cables. In one example, a lighting system kit comprises two or more lighting fixtures having an AC power port comprising an industrial type connector. The kit further comprises multiple industrial power cables and one or more industrial drop tee cables.

A cooling device for heat dissipation from an electronic component includes a heating tube having a heating tube surface, a cooling element having a first cooling element side formed with a slot recess which at least partially encloses the heating tube, and a fiber structure made of fibers and arranged on the heating tube surface in a region in which the heating tube is at least partially enclosed by the slot recess. The fibers on the heating tube surface of the heating tube in the region of the slot recess form a mechanical connection with a cooling element surface of the cooling element.

An outer finned tube includes a tube body, an outer wall of the tube body is provided with outer tins spirally arranged in an extension direction of the tube body; grid fins are arranged between two adjacent spiral parts of the outer fins correspondingly; two ends of each grid fin are connected to the two adjacent spiral parts of the corresponding outer fin respectively; a gap is kept between each grid fin and the outer wall of the tube body; and the plurality of grid fins are spaced in the extension direction of the tube body. An enhancing cavity is formed in an area defined by the outer wall of the tube body, inner walls of the grid fins and the outer tins in an encircling way, which can form a larger degree of superheat, provides a nucleation point for a boiling/condensation process and improves a heat exchange performance.

A heat dissipation connection structure of handheld device includes an outer frame main body and a two-phase flow heat exchange unit. The outer frame main body has a hollow receiving space at the center. The outer frame main body surrounds the hollow receiving space. The two-phase flow heat exchange unit is disposed in the hollow receiving space and connected with the outer frame main body by means of an injection molding structure member, whereby the outer frame main body and the two-phase flow heat exchange unit can be quickly and securely connected with each other.