A basic structural body for constructing heat dissipation device and a heat dissipation device are disclosed. The heat dissipation device includes a first basic structural body having a wick structure formed on one side surface thereof; and the first basic structural body and the wick structure are structural bodies formed layer by layer. Two pieces of first basic structural bodies can be correspondingly closed together to construct a heat dissipation device internally defining an airtight chamber. In this manner, the heat dissipation device can be designed in a more flexible manner.

A heat exchanger has: a first manifold assembly having a stack of plates; a second manifold assembly having a stack of plates; and a plurality of tubes extending from the first manifold assembly to the second manifold assembly. The plurality of tubes is a plurality groups of tubes. For each of the groups of the tubes: the tubes of the group have first ends mounted between plates of the first manifold assembly; and the tubes of the group have second ends mounted between plates of the second manifold assembly.

Technologies provide a heat pipe having a controlled torque resistance. The techniques disclosed herein provide a heat pipe that can function as a coupling device and as a thermal interface between two moving components of a device without the need of a mechanical hinge. In some configurations, a heat pipe comprises a housing having an outer surface and having an inner surface defining a cavity. The heat pipe can also comprise one or more components for transferring heat from a first region to a second region. In addition, the heat pipe is configured to provide a predetermined torque resistance about a first axis that is perpendicular to a longitudinal axis of the heat pipe. Components, such as a heat source and a heat sink, that are attached to the heat pipe can be hingeably coupled with a predetermined torque resistance without requiring a hinge and a separate thermal interface device.

A method of constructing a plate fin heat exchanger includes joining a first side bar formed from a nickel-iron alloy to a first end of a fin element formed from a nickel-iron alloy through a first nickel-iron alloy bond, and joining a second side bar formed from a nickel-iron alloy to a second end of the fin element through a second nickel-iron alloy bond to create a first layer of the plate fin heat exchanger. The fin element defines a fluid passage.

A heat-dissipation substrate structure with high adhesive strength is provided. The heat-dissipation substrate structure includes a heat-dissipation base layer, a functional layer, and a matching layer. The functional layer is formed by sputtering, and has a single layer structure or a multi-layer structure. A thickness of each layer of the functional layer is less than 3 μm. The matching layer has a single layer structure or a multi-layer structure, and a thickness of each layer of the multi-layer structure of the matching layer is less than 1 μm. The matching layer is formed by sputtering of one or any two of titanium, titanium alloy, nickel, and nickel alloy. The functional layer and the heat-dissipation base layer are two heterogeneous metal layers, and the matching layer is located between the functional layer and the heat-dissipation base layer.

A heat exchanger system for use in a gas turbine engine has a plurality of circumferentially spaced heat exchangers. The spaced heat exchangers are formed of a nickel alloy material including more than 50-percent by volume gamma-prime intermetallic phase material. A gas turbine engine is also disclosed.

A heat exchanger for use in a gas turbine engine has a central body including an inlet manifold and at least one tube providing an outlet manifold, and a plurality of tubes communicating holes in an outer periphery of the inlet manifold to holes in an outer periphery of the outlet manifold, and passages for cooling air to pass across the tubes. A gas turbine engine is also disclosed.

A heat dissipation substrate for increasing solderability is provided. The heat dissipation substrate for increasing solderability includes a heat dissipation layer serving as a base layer, a plating layer formed on the heat dissipation layer, and a protective layer formed on the plating layer. The protective layer is made of one of tin and tin alloy, and the protective layer is capable of being melted in a subsequent process, such that the protective layer is a meltable protective layer.

The invention concerns a heat exchanger having an exchange body having first passages for the flow of a first fluid and second passages for the flow of a second fluid exchanging heat with the first fluid, a first inlet manifold for introducing the first fluid into the first passages, a first outlet manifold for discharging the first fluid from the first passages). The heat exchanger also includes an inlet filter arranged facing the inlet surface of the exchange body, and/or an outlet filter arranged facing the outlet surface of the exchange body, the inlet filter and/or the outlet filter having a sheet metallic material selected from a metal gauze, a non-woven fabric of metallic fibres, a sintered metallic powder or sintered metallic fibres.

An Integrated Hybrid Compact Fluid Heat Exchanger is disclosed. An example embodiment includes: a micro-channeled plate for a stream of a working fluid, the micro-channeled plate being diffusion bonded or brazed with a cover plate; and a fin assembly brazed, diffusion bonded, or welded to the micro-channeled plate. Other embodiments include a fan or blower coupled to the Integrated Hybrid Compact Fluid Heat Exchanger via air ducting or close coupling.