A display device is capable of substantially reducing or preventing warping or deformation thereof by using a bimetallic effect. The display device includes a backlight unit including at least one light source; a light source circuit board at which the light source is disposed; a first heat dissipation plate configured to receive heat generated from the light source through the light source circuit board, and to discharge the heat; a bottom case configured to accommodate the light source, the light source circuit board, and the first heat dissipation plate; and a second heat dissipation plate configured to resist a deformation force that is applied to the first heat dissipation plate or the bottom case, the second heat dissipation plate has a thermal expansion coefficient different from a thermal expansion coefficient of the first heat dissipation plate.

An additively manufactured heat exchanger configured to transfer heat between a first fluid and a second fluid includes a first channel with a first wall configured to port flow of a first fluid and a second channel with a second wall configured to port flow of a second fluid. The heat exchanger also includes a barrier channel containing unprocessed build powder provided by the additive manufacturing process and is located between the first wall and the second wall. The barrier channel is configured to prevent mixing of the first fluid and the second fluid when one of the first wall and the second wall ruptures.

An apparatus and method of forming a heat exchanger including a thermally compliant material and geometry with a core having a first set of flow passages and a second set of flow passages passing through the core. A first manifold of high temperature and strength material defines a fluid inlet for the first set of flow passages and a second manifold of high temperature and strength material defines a fluid inlet for the second set of flow passages. At least one of the first and second manifolds can include an in-situ compliant portion to provide for compliance during thermal expansion of the heat exchanger.

A display device is capable of substantially reducing or preventing warping or deformation thereof by using a bimetallic effect. The display device includes a backlight unit including at least one light source; a light source circuit board at which the light source is disposed; a first heat dissipation plate configured to receive heat generated from the light source through the light source circuit board, and to discharge the heat; a bottom case configured to accommodate the light source, the light source circuit board, and the first heat dissipation plate; and a second heat dissipation plate configured to resist a deformation force that is applied to the first heat dissipation plate or the bottom case, the second heat dissipation plate has a thermal expansion coefficient different from a thermal expansion coefficient of the first heat dissipation plate.

A heat exchanger that is fabricated with high nickel metal alloys provides enhanced corrosion resistance when in contact with fluids that are reducing and contain metal chlorides. In an embodiment, this type of heat exchanger is used in the recovery section of a solution polymerization process.

A self-healing metal structure is provided for transferring heat between an electronics component and a substrate. The self-healing metal structure includes a base metal structural component. A phase change material is provided adjacent at least a portion of the base metal structural component. A protective component at least partially encapsulates the phase change material. Upon the presence of a spatial defect in the base metal structural component, the phase change material reacts with the base structural component to form an intermetallic compound to at least partially occupy the spatial defect. The phase change material at least partially encapsulated with the protective component may be disposed within the base metal structural component as a plurality of separate capsules incorporated therein, or the phase change material at least partially surrounds the base metal structural component.

A multipart lid is provided. The multipart lid may include a formed upper lid designed for maximum heat dissipation, a coined lower lid joined to the formed upper lid, where the coined lower lid comprises a coefficient of thermal expansion (CTE) substantially equal to a CTE of a first semiconductor component. A structure is provided. The structure may include a substrate, a first semiconductor component electrically connected and mounted on the substrate, one or more discrete components electrically connected and mounted on the substrate, a substrate mounted multipart lid covering both the semiconductor component and the one or more discrete components, where the multipart lid comprises a heat dissipating upper lid and a lower lid, where a coefficient of thermal expansion (CTE) of the lower lid substantially matches a CTE of the first semiconductor component.

A reactor includes: a heat exchange body including a heat medium channel through which the heat medium flows and a reaction channel through which the reaction fluid flows; at least one structured catalyst supporting a catalyst for promoting the reaction of the reaction fluid and removably installed in the reaction channel; and a holding member including an extending part extending in a direction conforming to an extending direction of the reaction channel and capable of engaging with the at least one structured catalyst, and regulating parts provided in the extending part to regulate a movement of the at least one structured catalyst in the extending direction of the extending part, wherein the holding member is inserted and removed with respect to the reaction channel while holding the structured catalyst.

A fire tube with three hollow tube sections, two of which are parallel to each other and one of which is perpendicular to and connects the ends of the first, two tube sections. The bottom-most tube section, which contains the burner, has an inner ceramic liner that is made up of one or more separate ceramic tubular sections. An upper set of cooling fins surrounds the top part of the bottom-most tube section, and a lower set of cooling fins surrounds the bottom part of the bottom-most tube section.

A cooling device includes an aluminum heat sink and at least one nickel sheet segment. The nickel sheet segment is connected to the aluminum heat sink by a solder layer. The cooling device includes a securing surface for securing and for heat absorption. The securing surface being formed by that side of the nickel sheet segment which faces away from aluminum heat sink. The aluminum heat sink is formed from a plurality of aluminum sheets which are stacked one above another and are connected to one another. At least one aluminum sheet includes cutouts which form a cooling channel covered by at least one of the aluminum sheets. Furthermore, a method for producing a cooling device and also a power circuit comprising a heat sink as described here are presented.