Patent classifications
F42B3/13
Integrated circuit initiator device
In an aspect of the invention there is provided an integrated circuit initiator device that comprises a circuit substrate provided with an electrical insulating layer; an electrical conducting bridge circuit deposited on the insulating layer; said bridge circuit patterned as contact areas and a bridge structure connecting the contact areas, said bridge structure arranged for forming a plasma when the bridge structure is fused by a initiator circuit that contacts the contact areas; and a polymer layer that is spin-coated on the bridge structure, for forming a flyer that is propelled away from the substrate.
Integrated circuit initiator device
In an aspect of the invention there is provided an integrated circuit initiator device that comprises a circuit substrate provided with an electrical insulating layer; an electrical conducting bridge circuit deposited on the insulating layer; said bridge circuit patterned as contact areas and a bridge structure connecting the contact areas, said bridge structure arranged for forming a plasma when the bridge structure is fused by a initiator circuit that contacts the contact areas; and a polymer layer that is spin-coated on the bridge structure, for forming a flyer that is propelled away from the substrate.
Initiator assembly that is resistant to shock
An initiator assembly that includes a header body, a frame member, a plurality of terminals, an initiator chip, a plurality of contacts, and a support member. The frame member is coupled to the header body and defines an interior aperture. The terminals are received through the header body and the frame member. The initiator chip is received in the frame member and has a plurality of lands, a conductive bridge and a flyer that is disposed over the conductive bridge. Each of the contacts is soldered to an associated one of the terminals and an associated one of the lands. The support member is formed of plastic and encapsulates the frame member, the plurality of contacts, and a portion of the initiator chip. The support member forms a barrel aperture over the flyer. The input charge is formed of a secondary explosive and is disposed in-line with the barrel aperture.
Initiator assembly that is resistant to shock
An initiator assembly that includes a header body, a frame member, a plurality of terminals, an initiator chip, a plurality of contacts, and a support member. The frame member is coupled to the header body and defines an interior aperture. The terminals are received through the header body and the frame member. The initiator chip is received in the frame member and has a plurality of lands, a conductive bridge and a flyer that is disposed over the conductive bridge. Each of the contacts is soldered to an associated one of the terminals and an associated one of the lands. The support member is formed of plastic and encapsulates the frame member, the plurality of contacts, and a portion of the initiator chip. The support member forms a barrel aperture over the flyer. The input charge is formed of a secondary explosive and is disposed in-line with the barrel aperture.
Reactive semiconductor bridge with oxide overcoat
A device comprises a reactive semiconductor bridge including a conductive metal, a reactive material, and an overcoat. When a high current passes through the reactive semiconductor bridge, the conductive metal vaporizes into a high temperature plasma. The reactive material is coupled to the conductive metal such that the conductive metal experiences an exothermic reaction to the plasma. When the conductive metal turns to plasma, the overcoat material absorbs at least a part of the exothermic reaction of the reactive material and breaks into a plurality of particles that are propelled away from the bridge. A gap is disposed between the overcoat and a membrane, and an explosive material couples to the membrane. The plurality of particles crosses the gap and penetrates the membrane to ignite the explosive material in response to being propelled away from the bridge.
Reactive semiconductor bridge with oxide overcoat
A device comprises a reactive semiconductor bridge including a conductive metal, a reactive material, and an overcoat. When a high current passes through the reactive semiconductor bridge, the conductive metal vaporizes into a high temperature plasma. The reactive material is coupled to the conductive metal such that the conductive metal experiences an exothermic reaction to the plasma. When the conductive metal turns to plasma, the overcoat material absorbs at least a part of the exothermic reaction of the reactive material and breaks into a plurality of particles that are propelled away from the bridge. A gap is disposed between the overcoat and a membrane, and an explosive material couples to the membrane. The plurality of particles crosses the gap and penetrates the membrane to ignite the explosive material in response to being propelled away from the bridge.
High Voltage Explosive Assembly for Downhole Detonations
A downhole explosive detonation assembly with a high voltage electro-explosive initiator having an input high voltage power supply with a low impedance shunting fuse, a flexible electrical link and a capacitor discharge unit. The explosive detonation assembly is adapted to detonate detonating cord from the side.
High Voltage Explosive Assembly for Downhole Detonations
A downhole explosive detonation assembly with a high voltage electro-explosive initiator having an input high voltage power supply with a low impedance shunting fuse, a flexible electrical link and a capacitor discharge unit. The explosive detonation assembly is adapted to detonate detonating cord from the side.
INTEGRATED CIRCUIT INITIATOR DEVICE
In an aspect of the invention there is provided an integrated circuit initiator device that comprises a circuit substrate provided with an electrical insulating layer; an electrical conducting bridge circuit deposited on the insulating layer; said bridge circuit patterned as contact areas and a bridge structure connecting the contact areas, said bridge structure arranged for forming a plasma when the bridge structure is fused by a initiator circuit that contacts the contact areas; and a polymer layer that is spin-coated on the bridge structure, for forming a flyer that is propelled away from the substrate.
INTEGRATED CIRCUIT INITIATOR DEVICE
In an aspect of the invention there is provided an integrated circuit initiator device that comprises a circuit substrate provided with an electrical insulating layer; an electrical conducting bridge circuit deposited on the insulating layer; said bridge circuit patterned as contact areas and a bridge structure connecting the contact areas, said bridge structure arranged for forming a plasma when the bridge structure is fused by a initiator circuit that contacts the contact areas; and a polymer layer that is spin-coated on the bridge structure, for forming a flyer that is propelled away from the substrate.