A thermal management system for led luminaires that, in certain embodiments, includes a heat sink, a heat-dissipating pipe, a base plate, a variable speed air-cooling element, an air-directing structure, a temperature measuring element, and a driver that includes at least one of thermal sensing response logic, light-emitting dimming control logic, fan speed control logic and air-cooling element malfunction detection logic. In some instances, the heat sink includes a plurality of fins coupled to a base plate. In some instances, one or more heat-dissipating pipes extend partially inserted along the length of the base plate and outwardly away from an end of the base plate. In some embodiments, an LED PCB assembly is coupled to the base plate. In some embodiments, fan speed variability, LED dimming, or both are engaged in combination with heat transfer and dissipation associated with the heat sink and the one or more heat-dissipating pipes.

Device for an endoscopic illumination apparatus comprising a heat pipe having a first end region and a second end region; a first heat source; a heat dissipation element for dissipating thermal energy from said first heat source; a heat sink spaced apart from the first heat source; and a clamping element, wherein the clamping element is reversibly detachably mounted on the heat dissipation element such that the first end region of the heat pipe is held between the heat dissipation element and the clamping element, wherein the heat pipe is adapted to conduct the thermal energy of the heat source to the heat sink, wherein the second end region of the heat pipe is spaced apart from the first end region, and wherein the second end region ends in the heat sink.

A cooling module for illumination device, includes: a substrate contacting a heat-generating illumination part at a lower part thereof and having an insertion groove formed on the upper surface thereof; a heat pipe which radiates the heat generated from the illumination part and includes a horizontal part inserted into the insertion groove and a vertical part vertically bent from the horizontal part and extending in a longitudinal direction; and a heat radiating plate laminated on and coupled to the vertical part of the heat pipe to promote heat radiation of the heat pipe, and including a coupling part coupled to the heat pipe, an inner fin part cut inward from the coupling part and formed to be twisted by a predetermined angle, and an outer fin part cut outward from the coupling part and formed to be twisted by a predetermined angle.

The present invention discloses a waterproof stage light with efficient heat dissipation comprising a light source component, a heat dissipating system and a waterproof main housing, wherein an opening is arranged at the rear end of the main housing, the heat dissipating system is in seal connection with the opening; one end of the heat dissipating system is positioned inside the main housing and the other end is positioned outside the main housing; and the light source component is arranged on the end of the heat dissipating system that is positioned inside the main housing. The stage light according to the present invention, which is simple in structure and convenient in use, improves the operation effect, normal service life, and reliability and stability of the stage light, and has a waterproof function, the stage light thus can be normally used outdoors with expanding application.

An outdoor area LED lighting system including: a housing containing a large array of LEDs mounted to an aluminum direct thermal path printed circuit board and a single lens. The large array of LEDs are capable of producing light rays directed through the single lens to produce a beam of light to illuminate the outdoor area. The single lens is preferably a Fresnel lens. The housing is preferably capable of being sealed in a weather-tight manner. A second housing may at least partially surround the first housing such that at least one air passage is provided between the first housing and the second housing. A heat sink including a heat block in thermal communication with a plurality of heat tubes and fin assemblies may be in partial thermal contact with the LED module and in fluid communication with the at least one air passage. At least one fan may be provided in or in fluid communication with said at least one air passage to cool the heat sink. A digital interface may connect the LED module to a host computer to monitor and track information and trending for statistical process control.

The present invention provides a finned heat-exchange system, comprising a heat dissipation chamber, a fin, an air guide element and a base, wherein the heat dissipation chamber is isolated from the outside, and both the fin and the air guide element are connected to the base; and the air guide element and the fin are in communication with the heat dissipation chamber through the base to dissipate heat from the inside of the heat dissipation chamber.

An optical projection device with metallic components for heat dissipation and for structural reinforcement includes a holder and two opposing metal components opposite to each other. The holder comprises lens receiving groove, electric component receiving groove, and connecting receiving groove leading to the exterior. The two opposing metal components comprise first and second heat dissipation parts, and a connecting part. The first heat dissipation part is formed on an exterior surface of the holder, the connecting part is received in the connecting receiving groove, and the second heat dissipation part is formed on an inner wall of the electric component receiving groove.

The present invention belongs to the technical field of high-power LED lamps, and relates to a high-power LED lamp with a heat dissipation effect, including a shell body. The shell body includes a heat sink main body and a heat sink cover board covering on a back surface of the heat sink main body. A plurality of heat pipes are embedded between the heat sink main body and the heat sink cover board, and an LED chip is placed on a front surface of the heat sink main body. The position of the heat sink main body where the LED chip is placed is the chip heat collecting area, all the heat pipes pass under the chip heat collecting area, and are in close contact with the chip heat collecting area.

A light emitting device (1) comprising a luminescent element (2) comprising a first surface (21), at least one cooling element (3) arranged at the first surface of the luminescent element, and a plurality of spacer elements (5) arranged between the cooling element (3) and the first surface (21) of the luminescent element such that the cooling element is arranged spaced apart from the first surface of the luminescent element with a distance, d. The at least one cooling element (3) comprises a compliance such as to be adapted for following warpage of the luminescent element (2) induced by any one or more of clamping forces, forces inflicted by production processes and light and/or heat propagating within the luminescent element, and a force (F) is applied to force the at least one cooling element (3) and the luminescent element (2) together in such a way that no part of the at least one cooling element and the luminescent element are in direct mutual contact.

An optical projection device with metallic components for heat dissipation and for structural reinforcement includes a holder and two opposing metal components opposite to each other. The holder comprises lens receiving groove, electric component receiving groove, and connecting receiving groove leading to the exterior. The two opposing metal components comprise first and second heat dissipation parts, and a connecting part. The first heat dissipation part is formed on an exterior surface of the holder, the connecting part is received in the connecting receiving groove, and the second heat dissipation part is formed on an inner wall of the electric component receiving groove.