Patent classifications
F21V29/745
LIGHTING DEVICE FOR MOUNTING TO AN OPTICAL ELEMENT AND METHOD OF MANUFACTURE
A lighting device for mounting to an optical element includes a center ring, a heat sink, at least one housing part and at least one fan. The center ring has a first side and a second side and includes a mechanical interface for mechanically coupling the center ring to the optical element. The heat sink includes a lighting module mounting part for connection with at least one relative to the center ring with the entire at least one hollow structure over the first side of the lighting module and at least one hollow structure within the heat sink. The heat sink is positioned center ring. The at least one fan includes at least one blade and a driver. At least a portion of the at least one fan is contained within the at least one housing part with the at least one blade within the at least one hollow structure.
Systems and methods for coupling a metal core PCB to a heat sink
Embodiments may utilize a series of exposed fins, which increase the surface area of the heat sink creating additional air flow. As hotter air rises within the system, cooler is drawn into the heatsink. The fins may be exposed on both sides of the longitudinal axis, allowing cooler air to be drawn towards the longitudinal axis above the heatsink and flow upward. This process may cool the fins. Additionally, the spacing between the fins may have to be wide enough to allow for air to freely enter the heatsink.
Heat sink for luminaire and luminaire arrangements having a heat sink
A heat sink for a luminaire includes a central portion having a top surface and a bottom surface. The bottom surface is adapted to receive a lighting arrangement. The heat sink further includes a plurality of arms configured to dissipate heat generated by the lighting arrangement. The plurality of arms extend radially outward from the central portion. Each one of the plurality of arms is substantially arcuate between a proximal end and a distal end.
Troffer-style fixture
An indirect troffer. Embodiments of the present invention provide a troffer-style fixture that is particularly well-suited for use with solid state light sources, such as LEDs. The troffer comprises a light engine unit that is surrounded on its perimeter by a reflective pan. A back reflector defines a reflective interior surface of the light engine. To facilitate thermal dissipation, a heat sink is disposed proximate to the back reflector. A portion of the heat sink is exposed to the ambient room environment while another portion functions as a mount surface for the light sources that faces the back reflector. One or more light sources disposed along the heat sink mount surface emit light into an interior cavity where it can be mixed and/or shaped prior to emission. In some embodiments, one or more lens plates extend from the heat sink out to the back reflector.
Systems and methods for coupling a metal core PCB to a heat sink
Embodiments may utilize a series of exposed fins, which increase the surface area of the heat sink creating additional air flow. As hotter air rises within the system, cooler is drawn into the heatsink. The fins may be exposed on both sides of the longitudinal axis, allowing cooler air to be drawn towards the longitudinal axis above the heatsink and flow upward. This process may cool the fins. Additionally, the spacing between the fins may have to be wide enough to allow for air to freely enter the heatsink.
LIGHTING MODULE
A lighting module with an efficient heatsink. The heatsink may include a base conducting portion, side fins, and a center structure. The side fins may extend away from the base portion in such a way that the distance between the fins and the center structure may vary as they may extend away from the base portion. Warm air near the base conducting portion may rise due to natural convection buoyancy, in which vertical narrowing passages may result in the passive air flow increasing in velocity as it may travel near the narrowing surface area of the heatsink improving heat transfer, and as the side fins and center structure air passages widen, the air velocity may reduce as the warm air may be distributed above heatsink.
COMPACT LUMINAIRE HEAD
Example embodiments relate to compact luminaire heads. One example luminaire head includes a thermally conductive metal body that includes a plate-like portion, a tube portion, and at least one cooling fin. The plate-like portion extends in a longitudinal direction of the metal body and having a flat first surface and a second surface opposite the first surface. The tube portion extends in the longitudinal direction at the second surface. The at least one cooling fin extends away from the second surface adjacent to the tube portion. The luminaire head also includes at least one support substrate with a plurality of light emitting elements. The at least one support substrate is arranged against the first surface. The tube portion is shaped to receive in a first open end thereof a rigid cylindrical end portion of a mounting base, such as a pole for the luminaire head.
Systems and Methods for Coupling a Metal Core PCB to a Heat Sink
Embodiments may utilize a series of exposed fins, which increase the surface area of the heat sink creating additional air flow. As hotter air rises within the system, cooler is drawn into the heatsink. The fins may be exposed on both sides of the longitudinal axis, allowing cooler air to be drawn towards the longitudinal axis above the heatsink and flow upward. This process may cool the fins. Additionally, the spacing between the fins may have to be wide enough to allow for air to freely enter the heatsink.
PHOSPHOR WHEEL
A phosphor wheel includes a substrate including a first principal surface and a second principal surface located opposite to each other, a phosphor layer on the first principal surface, and a heat dissipating member disposed so as to oppose one of the first principal surface and the second principal surface. The heat dissipating member includes a projecting portion that projects from a center portion of the heat dissipating member, and the projecting portion includes a contact surface that contacts the one of the first principle surface and the second principle surface. The heat dissipating member further includes fins formed in a peripheral region of the heat dissipating member excluding the center portion. The projecting portion secures a certain distance between the substrate and the heat dissipating member and conducts heat in the substrate to the peripheral region of the heat dissipating member.
Lighting devices that comprise one or more solid state light emitters
Light engine modules include a support member and a solid state light emitter, in which (1) the emitter is mounted on the support member, (2) a region of the support member has a surface with a curved cross-section, (3) the emitter and a compensation circuit are mounted on the support member, (4) an electrical contact element extends to at least two surfaces of the support member, and/or (5) a substantial entirety of the module is located on one side of a plane and the emitter emits light into another side of the plane. Also, a module including means for supporting a light emitter and a light emitter. Also, a lighting device including a housing member and a light emitter mounted on a removable support member. Also, a lighting device including a module mounted in a lighting device element. Also, a method including mounting a module to a lighting device element.