A phosphor wheel includes: a substrate including a first principal surface and a second principal surface; a phosphor layer; and a heat dissipating member. The heat dissipating member includes: a projecting portion projecting toward one of the principal surfaces and including a contact surface that contacts the one of the principal surfaces; and fins provided by cutting and raising regions in a peripheral region of the heat dissipating member excluding a central portion of the heat dissipating member. The regions each include a notch provided by cutting off part of a first side of the region opposite to a second side of the region continuous with a corresponding one of the fins. The projecting portion secures a certain distance between the substrate and the heat dissipating member and conducts heat in the substrate to the peripheral region of the heat dissipating member.

A phosphor wheel includes: a substrate including a first principal surface and a second principal surface; a phosphor layer; and a heat dissipating member. The heat dissipating member includes: a projecting portion projecting toward one of the principal surfaces and including a contact surface that contacts the one of the principal surfaces; fins provided by cutting and raising regions in a peripheral region of the heat dissipating member excluding a central portion of the heat dissipating member; and a bent end portion having an obtuse bending angle and provided as a result of an outer edge portion of the heat dissipating member being bent. The projecting portion secures a certain distance between the substrate and the heat dissipating member and conducts heat in the substrate to the peripheral region of the heat dissipating member.

Embodiments of the invention provide lighting systems that employ light-emitting diode (LED) chips as active lighting elements. Heat management components for the LED chips employed in the lighting sources are provided. In embodiments of the invention, LED chips are cooled by one or more heatspreaders and heat sinks attached to a substrate that houses the LED chip and/or the topside of the LED chip.

Embodiments may utilize a series of exposed fins, which increase the surface area of the heat sink creating additional air flow. As hotter air rises within the system, cooler is drawn into the heatsink. The fins may be exposed on both sides of the longitudinal axis, allowing cooler air to be drawn towards the longitudinal axis above the heatsink and flow upward. This process may cool the fins. Additionally, the spacing between the fins may have to be wide enough to allow for air to freely enter the heatsink.

Example embodiments relate to compact luminaire heads. One example luminaire head includes a thermally conductive metal body that includes a plate-like portion, a tube portion, and at least one cooling fin. The plate-like portion extends in a longitudinal direction of the metal body and having a flat first surface and a second surface opposite the first surface. The tube portion extends in the longitudinal direction at the second surface. The at least one cooling fin extends away from the second surface adjacent to the tube portion. The luminaire head also includes at least one support substrate with a plurality of light emitting elements. The at least one support substrate is arranged against the first surface. The tube portion is shaped to receive in a first open end thereof a rigid cylindrical end portion of a mounting base, such as a pole for the luminaire head.

A phosphor wheel includes a substrate including a first principal surface and a second principal surface located opposite to each other, a phosphor layer on the first principal surface, and a heat dissipating member disposed so as to oppose one of the first principal surface and the second principal surface. The heat dissipating member includes a projecting portion that projects from a center portion of the heat dissipating member, and the projecting portion includes a contact surface that contacts the one of the first principle surface and the second principle surface. The heat dissipating member further includes fins formed in a peripheral region of the heat dissipating member excluding the center portion. The projecting portion secures a certain distance between the substrate and the heat dissipating member and conducts heat in the substrate to the peripheral region of the heat dissipating member.

A light assembly includes a thermally conductive support structure, a plurality of light emitting diodes (LEDs) attached to a circuit board and thermally coupled to a heat sink and a single transparent substrate with a corresponding plurality of optical elements over the LEDs. Each of the optical elements include a first portion configured to direct light in a second direction, a second portion configured to direct light in a second lateral direction, and a third portion configured to direct light in a third direction.

A lighting apparatus includes a circuit board and light emitting diodes (LEDs) attached to the circuit board. The LEDs are arranged in an array of row and columns and are attached to the circuit board are arranged in a single plane. A support substrate supports the circuit board. Optical elements are configured to redirect light from the plurality of LEDs. Each optical element is substantially the same as all other optical elements. Each LED is associated with a single optical element and each optical element is associated with a single LED. The lighting apparatus is configured to direct light away from the circuit board so that the light is directed so as to illuminate a substantially rectangular area that is off-center relative to the light assembly. The substantially rectangular area has an edge that is at least 14 feet in length.

Light engine modules comprise a support member and a solid state light emitter, in which (1) the emitter is mounted on the support member, (2) a region of the support member has a surface with a curved cross-section, (3) the emitter and a compensation circuit are mounted on the support member, (4) an electrical contact element extends to at least two surfaces of the support member, and/or (5) a substantial entirety of the module is located on one side of a plane and the emitter emits light into another side of the plane. Also, a module comprising means for supporting a light emitter and a light emitter. Also, a lighting device comprising a housing member and a light emitter mounted on a removable support member. Also, a lighting device comprising a module mounted in a lighting device element. Also, a method comprising mounting a module to a lighting device element.

A lighting assembly includes a plurality of light emitting diodes (LEDs) and a plurality of optical elements, each proximate an associated one of the LEDs. Each optical element includes a first portion, a second portion which intersects with the first portion, a third portion extending beyond a region between the first portion and the second portion in a direction away from the associated LED, and a fourth portion positioned proximate the respective LED below the first, second and third portions. The first and second portions are shaped such that at least one surface normal to the first portion intersects with at least one surface normal to the second portion.