An electronic expansion valve includes a valve component and a stator component; the valve component includes a valve body assembly, a valve core, a threaded transmission assembly and a rotor; the valve body assembly is provided with a valve port, and the valve core is driven by the threaded transmission assembly to control an opening of the valve port; a wear-resistant coating is arranged on a contact surface of at least one of components having relative movement of the electronic expansion valve, the wear-resistant coating is applied by spraying, and the wear-resistant coating has a thickness of 5 to 8 microns; and the material of the wear-resistant coating includes a molybdenum disulfide material and a polytetrafluoroethylene material.

A heat pump system provides at least six modes of heating, cooling, and/or domestic water heating operation, where domestic water heating may occur concurrently with heating or cooling a space in a structure. The heat pump system comprises a desuperheater positioned downstream of the compressor and operable as a desuperheater, a condenser or an evaporator, a source heat exchanger operable as either a condenser or an evaporator, a load heat exchanger operable as either a condenser or an evaporator, a reversing valve positioned downstream of the desuperheater heat exchanger and configured to alternately direct refrigerant flow from the desuperheater heat exchanger to one of the load heat exchanger and the source heat exchanger and to alternately return refrigerant flow from the other of the load heat exchanger and the source heat exchanger to the compressor, and an expansion valve positioned between the load heat exchanger and the source heat exchanger.

A heat pump system provides at least six modes of heating, cooling, and/or domestic water heating operation, where domestic water heating may occur concurrently with heating or cooling a space in a structure. The heat pump system comprises a desuperheater positioned downstream of the compressor and operable as a desuperheater, a condenser or an evaporator, a source heat exchanger operable as either a condenser or an evaporator, a load heat exchanger operable as either a condenser or an evaporator, a reversing valve positioned downstream of the desuperheater heat exchanger and configured to alternately direct refrigerant flow from the desuperheater heat exchanger to one of the load heat exchanger and the source heat exchanger and to alternately return refrigerant flow from the other of the load heat exchanger and the source heat exchanger to the compressor, and an expansion valve positioned between the load heat exchanger and the source heat exchanger.

A refrigerated display case having a housing defining a temperature controlled space and a refrigeration system coupled to the housing is provided. The refrigeration system is configured to be operable to affect a temperature of the temperature controlled space. The refrigeration system includes an actuator, a controller, and a sensor. The controller is configured to continuously update a stored position of the actuator based on measurement of an electric current provided to the actuator, retrieve the stored position after a power failure, and restart control based on the stored position of the actuator. The sensor is configured to communicate with the controller.

An electronic expansion valve and a manufacturing method therefor, a thermal management assembly and a cooling system are provided. The electronic expansion valve includes a valve core assembly, an electronic control part and a stator assembly. The valve core assembly includes a valve base, a valve core and a rotor assembly, wherein the valve base is provided with a valve port, and the valve core moves relative to the valve base to change the degree of opening of the valve port. The electronic control part controls the stator assembly, and the rotor assembly drives the valve core to move. The electronic expansion valve further includes a sensor, the electronic control part includes an electronic control board, and the stator assembly and the sensor are both directly electrically connected to the electronic control board. The thermal management assembly and the cooling system both include the electronic expansion valve.

An electronic expansion valve and a manufacturing method therefor, a thermal management assembly and a cooling system are provided. The electronic expansion valve includes a valve core assembly, an electronic control part and a stator assembly. The valve core assembly includes a valve base, a valve core and a rotor assembly, wherein the valve base is provided with a valve port, and the valve core moves relative to the valve base to change the degree of opening of the valve port. The electronic control part controls the stator assembly, and the rotor assembly drives the valve core to move. The electronic expansion valve further includes a sensor, the electronic control part includes an electronic control board, and the stator assembly and the sensor are both directly electrically connected to the electronic control board. The thermal management assembly and the cooling system both include the electronic expansion valve.

A heat management apparatus comprises a first heat exchange portion, a second heat exchange portion and a throttle unit, wherein the first heat exchange portion is used for exchanging heat between a refrigerant throttled by the throttle unit, and a cooling liquid; and a first wall of the first heat exchange portion and a second wall of the second heat exchange portion are arranged opposite each other, such that the structure of the heat management apparatus is relatively compact.

A heat management apparatus comprises a first heat exchange portion, a second heat exchange portion and a throttle unit, wherein the first heat exchange portion is used for exchanging heat between a refrigerant throttled by the throttle unit, and a cooling liquid; and a first wall of the first heat exchange portion and a second wall of the second heat exchange portion are arranged opposite each other, such that the structure of the heat management apparatus is relatively compact.

A device for controlling a flow rate and expanding a fluid in a fluid circuit. The device is formed with an enclosure and a valve element arranged inside the enclosure. The valve element which is arranged movably in a linear movement in the direction of a longitudinal axis relative to the enclosure has a sealing surface and a control area formed at a first end face of the valve element and arranged adjacent to the sealing surface in the axial direction. The sealing surface is formed as a lateral surface of a straight circular cylinder with a constant outer diameter. An outer diameter of a surface of the control area corresponds to the outer diameter of the sealing surface. The control area has throughflow apertures and at least one control aperture. The valve element in the control area is formed with a substantially hollow circular cylindrical-shaped wall.

A device for controlling a flow rate and expanding a fluid in a fluid circuit. The device is formed with an enclosure and a valve element arranged inside the enclosure. The valve element which is arranged movably in a linear movement in the direction of a longitudinal axis relative to the enclosure has a sealing surface and a control area formed at a first end face of the valve element and arranged adjacent to the sealing surface in the axial direction. The sealing surface is formed as a lateral surface of a straight circular cylinder with a constant outer diameter. An outer diameter of a surface of the control area corresponds to the outer diameter of the sealing surface. The control area has throughflow apertures and at least one control aperture. The valve element in the control area is formed with a substantially hollow circular cylindrical-shaped wall.