A heat exchange core according to one embodiment includes: a header flow path that extends in a first direction; and a plurality of branching flow paths that are connected to the header flow path and extend in a second direction intersecting with the first direction. A first angle formed by the header flow path with respect to a virtual connection plane between the header flow path and the plurality of branching flow paths is less than a second angle formed by the branching flow paths with respect to the connection plane.

A refrigerant heat exchanger including a first group of heat exchange tubes on a first side of a core defining a first zone. A second group of heat exchange tubes on a second side of the core define a second zone. An inlet tank is at the inlet end of the core. An inlet port of the inlet tank is opposite to, or generally opposite to, an interface between the first zone and the second zone. A first outlet tank is at the outlet end of the core opposite to the first zone. A first outlet port of the first outlet tank is at an outer end of the first outlet tank. A second outlet tank is at the outlet end of the core opposite to the second zone. A second outlet port of the second outlet tank is at an outer end of the second outlet tank.

A method of electroforming can be used to prepare a heat exchanger by electroforming the heat exchanger on a mandrel having a smooth and conductive surface. The mandrel is in the shape of at least part of the heat exchanger, and is removed from the electroformed heat exchanger.

Embodiments described herein relate to a heat exchanger for abating compounds produced in semiconductor processes. When hot effluent flows into the heat exchanger, a coolant can be flowed to walls of a fluid heat exchanging surface within the heat exchanger. The heat exchanging surface can include a plurality of channel regions which creates a multi stage cross flow path for the hot effluent to flow down the heat exchanger. This flow path forces the hot effluent to hit the cold walls of the fluid heat exchanging surface, significantly cooling the effluent and preventing it from flowing directly into the vacuum pumps and causing heat damage. Embodiments described herein also relate to methods of forming a heat exchanger. The heat exchanger can be created by sequentially depositing layers of thermally conductive material on surfaces using 3-D printing, creating a much smaller footprint and reducing costs.

A heat exchanger for abating compounds produced in semiconductor processes. When hot effluent flows into the heat exchanger, a coolant can be flowed to walls of a fluid heat exchanging surface within the heat exchanger. The heat exchanging surface can include a plurality of channel regions which creates a multi stage cross flow path for the hot effluent to flow down the heat exchanger. This flow path forces the hot effluent to hit the cold walls of the fluid heat exchanging surface, significantly cooling the effluent and preventing it from flowing directly into the vacuum pumps and causing heat damage. Embodiments described herein also relate to methods of forming a heat exchanger. The heat exchanger can be created by sequentially depositing layers of thermally conductive material on surfaces using 3-D printing, creating a much smaller footprint and reducing costs.

Systems are provided for a heat exchanger having a housing and core elements arranged therein in a stack. A flow path for a first fluid runs through the core elements from a housing inlet opening to a housing outlet opening. The core elements are all oriented in the same direction relative to the housing inlet opening and the housing outlet opening.

The present invention provides a heat exchanger including a lower header into which a liquid-phase refrigerant flows, a plurality of heat exchange pipes which branch off from the lower header and extend upwards, and an upper header which is configured to collect refrigerant received by the heat exchange pipes, in which a refrigerant inlet of the lower header is provided with a flow passage resistance adjusting hole having a cross-section smaller than a flow passage cross-section of a pipe passage for supplying the refrigerant.

A refrigerant distributor has a double-pipe structure including an inner pipe and an outer pipe. A plurality of outer pipes are disposed, each of the plurality of outer pipes being the outer pipe. A space is formed between adjacent ones of the plurality of outer pipes. The inner pipe is disposed to be continuous through the plurality of outer pipes. A plurality of heat-transfer tubes are arrayed in a direction in which the outer pipe extends and connected to the outer pipe. The refrigerant distributor distributes refrigerant flowing into between the inner pipe and the outer pipe to the plurality of heat-transfer tubes.

An integrated heat exchanger assembly comprises a first header tank, a second header tank, a first heat exchanger core extending between the first header tank and the second header tank, a second heat exchanger core extending between the first header tank and the second header tank, and a third heat exchanger core extending between the first header tank and the second header tank. The first heat exchanger core is in fluid communication with a liquid coolant and a refrigerant, the second heat exchanger core in fluid communication with a first portion of a flow of air and the refrigerant, and the third heat exchanger core in fluid communication with a second portion of the flow of the air and the liquid coolant.

A heat exchanger mounting assembly for use in an HVAC system includes a frame for mounting a heat exchanger operably coupled to at least two sides of a heat exchanger housing, the frame having at least two mounting rails, each mounting rail having a first mounting rail side, and second mounting rail side, a proximate end and a distal end; and at least two coil support members extending from the first mounting rail side; and at least one connection member located on the second mounting rail side; and at least one support rail configured to engage the second mounting rail side of the at least two mounting rails; and at least two cross rails operably coupled to each of the at least two coil support members; and a heat exchanger, comprising at least one coil header operably coupled to at least two coil support members.