A heater includes: a substrate including a first surface and a second surface located opposite to the first surface relative to the substrate; a first heating pattern disposed on a first-surface side of the substrate; a second heating pattern disposed on the first-surface side of the substrate and located at a position different from a position of the first heating pattern; a first terminal to which electricity is to be supplied; a first power-supply pattern electrically connecting the first terminal and the first heating pattern to each other and disposed on a second-surface side of the substrate; and a first electrically-continuous portion extending through the substrate and electrically connecting the first power-supply pattern and the first heating pattern to each other.

A method of manufacturing a microchannel evaporator operating with biphasic coolant fluid is provided. The microchannel evaporator improves the effectiveness of the heat exchange between the biphasic flow of the fluid and an electronic component to be cooled down.

A liquid-cooling type double-sided cooler includes a first cooling portion and a second cooling portion. In the liquid-cooling type double-sided cooler, an end of the first cooling portion is formed with a first communication hole that is configured to penetrate a first cooling liquid path and an outside of the first cooling portion, and an end of the second cooling portion is formed with a second communication hole that is configured to penetrate a second cooling liquid path and an outside of the second cooling portion. In particular, the first cooling portion and the second cooling portion are positioned such that the first communication hole and the second communication hole face each other, and the first cooling liquid path and the second cooling liquid path are connected with each other.