A method for operating a surface measuring apparatus for measuring a surface of a workpiece. Method includes operating surface measuring apparatus having a probe that includes a probe arm that is deflectable by an angle about a swivel axis, and that on its end facing away from the swivel axis bears a probe element. Probe is movable relative to a base body of surface measuring apparatus along a linear axis. In method, a workpiece is contacted by moving the probe along the linear axis by use of the probe element, and after workpiece is contacted, probe arm is moved by a specified travel distance along the linear axis. The resulting angular deflection of the probe arm about the swivel axis is measured, and based on the specified travel distance and measured angular deflection of the probe arm, the probe arm is classified with regard to its length.

A plate flatness measurement device, including a support frame including a center area, the center area including a through-hole in a center of the center area, and a peripheral area surrounding the center area, the peripheral area having a plate with protrusions on a bottom surface of the plate mounted to the peripheral area; and a sensor module in the support frame, the sensor module at least partially protruding above the support frame to contact the protrusions.

A position measuring method is a method of measuring, by a probe, a position of a reference surface of a workpiece that is supported by a fixing tool when the workpiece is machined. According to the position measuring method, the probe is brought into contact with the reference surface at a plurality of different positions, and a height of the reference surface is measured. Then, a position at which the height of the reference surface is largest is set as the position of the reference surface.

A method and device for evaluating inhomogeneous deformations in a first wafer bonded by molecular adhesion to a second wafer. This evaluation method includes the steps of making at least one reading of a plurality of measurement points, the reading corresponding to a surface profile of the first wafer along a predefined direction and over a predefined length, computing a second derivative from the measurement points of the surface profile and evaluating a level of inhomogeneous deformations in the first wafer according to the second derivative.

In a shape measuring apparatus for measuring the roughness and/or contour of a surface of a workpiece by sliding a sensing pin on a tip end side of an arm on the workpiece, the arm is provided with an engagement mechanism that makes a sensing pin side of the arm removable to a base end side of the arm. The engagement mechanism has two engagement surfaces which face each other and attract each other by a magnetic force. One of the engagement surfaces includes a linear first groove that is in parallel to an axis of the arm and another engagement part that is different from the first groove, and the other of the engagement surfaces includes a first fitting pin that is positioned to be fitted into the first groove and a second fitting pin that is fitted into the other engagement part.

In a shape measuring apparatus for measuring the roughness and/or contour of a surface of a workpiece by sliding a sensing pin on a tip end side of an arm on the workpiece, the arm is provided with an engagement mechanism that makes a sensing pin side of the arm removable to a base end side of the arm. The engagement mechanism has two engagement surfaces which face each other and attract each other by a magnetic force. One of the engagement surfaces includes a linear first groove that is in parallel to an axis of the arm and another engagement part that is different from the first groove, and the other of the engagement surfaces includes a first fitting pin that is positioned to be fitted into the first groove and a second fitting pin that is fitted into the other engagement part.

A method and a device that performs the method for measuring the flatness of a metal product traveling on a path, the method includes measuring a first longitudinal tension measurement value (T1) with a measuring roller, determining a model of stress over the thickness of the metal product as a function of plastic or elastoplastic deformation of the product, calculating a correction factor for the longitudinal deformation according to the stress model, calculating a corrective value (T1′, T2′) for the first longitudinal tension measurement value (T1) at at least one evaluation point (M1, M2) as a function of the longitudinal deformation correction factor (Z1), and calculating a corrected flatness measurement value (PC) at at least one of the evaluation points.

An inspection jig for a display device includes a jig body, the jig body includes a limit groove configured to limit the position of the display device to be inspected, and the jig body is provided with a soldering point testing portion, the soldering potin testing portion is provided with a plurality of testing terminal pairs; each of the testing terminal pairs comprises two testing terminals; in every two adjacent testing terminal pairs, one testing terminal of one testing terminal pair and one testing terminal of the other testing terminal pair are serially connected with an indicator lamp therebetween; along a serial connection direction of the testing terminals, a testing terminal located at two ends are electrically connected with a positive pole and a negative pole of a power source.

An inspection jig for a display device includes a jig body, the jig body includes a limit groove configured to limit the position of the display device to be inspected, and the jig body is provided with a soldering point testing portion, the soldering potin testing portion is provided with a plurality of testing terminal pairs; each of the testing terminal pairs comprises two testing terminals; in every two adjacent testing terminal pairs, one testing terminal of one testing terminal pair and one testing terminal of the other testing terminal pair are serially connected with an indicator lamp therebetween; along a serial connection direction of the testing terminals, a testing terminal located at two ends are electrically connected with a positive pole and a negative pole of a power source.

The present invention relates to a structural health monitoring system, for example a system used in the non-destructive evaluation of an aircraft structure. The present invention provides a method and apparatus for evaluating one or more anomalies within a structure using a structural health monitoring system that includes at least three transducers arranged in operative contact with the structure such that no two transducers are aligned to be parallel. A transducer excites an elastic wave that propagates through the structure, and reflections from any anomalies within the structure are collected by the three transducers. These collected signals are analyzed to identify an anomaly within the structure. Time of flight techniques are used to determine the location of the anomaly.