The invention relates to a method to test friction resistance at inner and outer sidewalls of pipe pile through in-situ test. The method comprises embedding a strain sensor at inner or outer sidewalls of pipe pile to measure strain variation generating on pipe pile body under the action of load; carrying out static load test with the soil plug remaining in the pipe pile to obtain the strain variation ε.sub.p1j,i of the pipe pile body at the i.sup.th soil layer; taking out the soil plug remaining in the pipe pile and carrying out static load test to obtain the strain variation ε.sub.p2j,i of the pipe pile body at the i.sup.th soil layer; and obtaining the friction respectively at the outer and inner sidewalls of the pipe pile at the i.sup.th soil layer according to the measured strain variation, ε.sub.p1j,i and ε.sub.p2j,i.

Embodiments within the scope of the present disclosure are directed to external sensor kits that may be included in new injection molds or retrofitted into existing injection molds in order to approximate conditions within a mold, such as pressure or the location of a melt flow front. Such kits are designed to amplify meaningful measurements obtained by the external sensor kit so that noise measurements do not prevent the approximation of conditions within a mold. In some embodiments within the scope of the present disclosure, an external sensor kit includes a strain gauge sensor, a coupon, a support bracket, and a hammer. The strain gauge sensor is placed on a surface of the coupon and measures the strain in the coupon.

Embodiments within the scope of the present disclosure are directed to external sensor kits that may be included in new injection molds or retrofitted into existing injection molds in order to approximate conditions within a mold, such as pressure or the location of a melt flow front. Such kits are designed to amplify meaningful measurements obtained by the external sensor kit so that noise measurements do not prevent the approximation of conditions within a mold. In some embodiments within the scope of the present disclosure, an external sensor kit includes a strain gauge sensor, a coupon, a support bracket, and a hammer. The strain gauge sensor is placed on a surface of the coupon and measures the strain in the coupon.

Provided are a pressure-sensitive adhesive composition for an optical film, which has excellent optical compensation and stress relaxation properties without changing main properties such as endurance reliability and workability under a high temperature and/or high humidity condition to minimize a light leakage phenomenon caused by stress concentration of a protective film, and an optical member and a liquid crystal display device which include a pressure-sensitive adhesive layer manufactured using the same.

Provided are a pressure-sensitive adhesive composition for an optical film, which has excellent optical compensation and stress relaxation properties without changing main properties such as endurance reliability and workability under a high temperature and/or high humidity condition to minimize a light leakage phenomenon caused by stress concentration of a protective film, and an optical member and a liquid crystal display device which include a pressure-sensitive adhesive layer manufactured using the same.

A force assessment device and a method for lead extraction are provided. A force gauge is configured to measure a traction force, and a strain gauge that is configured to measure a countertraction force. An interface is communicatively coupled to the force gauge and the strain gauge, and the interface is configured to present data regarding at least one of the traction force and the countertraction force.

A strain inspection device of a printed circuit board (PCB) which is easily cracked or damaged by external pressure (force) applied to the PCB while the PCB is being assembled, and an attaching method thereof. The strain inspection device of a printed circuit board (PCB) includes a fixing member; and a damage indicator fixed to the PCB by the fixing member, having a crack guide through hole, and cracked or damaged along a corner of the crack guide through hole due to deformation of the PCB.

Method and apparatus for detecting overload distortion A method and apparatus for detecting overload distortion in lifting and the like gear is disclosed. The apparatus includes a hook with two reference points thereon defining, in the undistorted state of the hook, a reference dimension. The hook also has a standard dimension provided on the hook and conveniently accessible for reference purposes. The standard dimension is also a pair of points and one of this pair is coincident with one of the reference points thereby forming a triangle of points on the hook.

Method and apparatus for detecting overload distortion A method and apparatus for detecting overload distortion in lifting and the like gear is disclosed. The apparatus includes a hook with two reference points thereon defining, in the undistorted state of the hook, a reference dimension. The hook also has a standard dimension provided on the hook and conveniently accessible for reference purposes. The standard dimension is also a pair of points and one of this pair is coincident with one of the reference points thereby forming a triangle of points on the hook.

A method and apparatus are disclosed for determining a bending radius of a flexible pipe. The apparatus includes at least one bend sensor element comprising an elongate flexible substrate and at least one bend sensitive element on the substrate that has at least one electrical characteristic that is responsive to angular displacement of the substrate. The apparatus also comprises a flexible crush resistant elongate housing that supports and surrounds the bend sensor element.