Generally, a device to measure the circumference of circular objects. Specifically, a device including a pair of slidingly engaged members disposed between a pair of arms configured to be engaged with tread on a tire at about the midline of a wheel, an electrical circuit which varies in output voltage based on the distance between the pair of arms, and a processor communicatively coupled to a non-transitory computer readable medium containing a program which correlates the output voltage of the electrical circuit to a unit measure of distance between the pair of arms and calculates tire circumference.

Among other things, one or more techniques or systems for evaluating a tiered semiconductor structure, such as a stacked CMOS structure, for misalignment are provided. In an embodiment, a connectivity test is performed on vias between a first layer and a second layer to determine a via diameter and a via offset that are used to evaluate misalignment. In an embodiment, a connectivity test for vias within a first layer is performed to determine an alignment rotation based upon which vias are connected through a conductive arc within a second layer or which vias are connected to a conductive pattern out of a set of conductive patterns. In this way, the via diameter, the via offset, or the alignment rotation are used to evaluate the tiered semiconductor structure, such as during a stacked CMOS process, for misalignment.

Among other things, one or more techniques or systems for evaluating a tiered semiconductor structure, such as a stacked CMOS structure, for misalignment are provided. In an embodiment, a connectivity test is performed on vias between a first layer and a second layer to determine a via diameter and a via offset that are used to evaluate misalignment. In an embodiment, a connectivity test for vias within a first layer is performed to determine an alignment rotation based upon which vias are connected through a conductive arc within a second layer or which vias are connected to a conductive pattern out of a set of conductive patterns. In this way, the via diameter, the via offset, or the alignment rotation are used to evaluate the tiered semiconductor structure, such as during a stacked CMOS process, for misalignment.

A wire gauge measuring device comprises a main body, an arm extending from the main body such that a gap is defined between the arm and the main body, a plurality of switches, and indicator means. The gap has a plurality of differently sized gap portions arranged in decreasing size from a distal end to a proximal of the arm. Each switch is aligned with a corresponding one of the gap portions. The indicator means is adapted to provide an indication to a user based on which of the plurality of switches is depressed. The gap portion sizes are selected such that each gap portion is adapted to (1) receive a corresponding differently sized electrical wire, (2) prevent the corresponding differently sized electrical wire from moving into a smaller sized gap portion, and (3) position the differently sized electrical wire to depress the corresponding switch.

Aspects of the subject disclosure may include, for example, obtaining a first plurality of circumference measurements, each of the first plurality of circumference measurements corresponding to a first circumference around a limb of a person at a respective one of a plurality of locations of the limb, each of the first plurality of circumference measurements being obtained from a respective one of a plurality of elastic measurement elements that is positioned at a respective one of the locations; determining, based upon the first plurality of circumference measurements, a first geometric profile along a length of the limb; and outputting data representing the first geometric profile. Other embodiments are disclosed.

Aspects of the subject disclosure may include, for example, obtaining a first plurality of circumference measurements, each of the first plurality of circumference measurements corresponding to a first circumference around a limb of a person at a respective one of a plurality of locations of the limb, each of the first plurality of circumference measurements being obtained from a respective one of a plurality of elastic measurement elements that is positioned at a respective one of the locations; determining, based upon the first plurality of circumference measurements, a first geometric profile along a length of the limb; and outputting data representing the first geometric profile. Other embodiments are disclosed.

A method of measuring geometric parameters of through holes in a thin substrate includes acquiring images of select sub-volumes of the substrate using an optical system having a field of depth greater than a thickness of the substrate. The acquired images are processed to determine the desired geometric parameters.

A method of measuring geometric parameters of through holes in a thin substrate includes acquiring images of select sub-volumes of the substrate using an optical system having a field of depth greater than a thickness of the substrate. The acquired images are processed to determine the desired geometric parameters.

[Problem] There are provided a size measurement apparatus and a size measurement system that even a user who has no specialized measurement technique can easily handle. [Solution Means] A size measurement system includes a size measurement apparatus (10) configured to be attached to a body of a user to measure a size and the like of the body of the user and output sensor measurement information representing the measured size and the like, a user terminal (20) configured to be operated by the user who measures the body, and a management server (30) configured to manage size information, shape information, and the like of apparel merchandise and provide merchandise search result information that is user size information as body size information of the user based on the sensor measurement information and information concerning merchandise matching the size.

[Problem] There are provided a size measurement apparatus and a size measurement system that even a user who has no specialized measurement technique can easily handle. [Solution Means] A size measurement system includes a size measurement apparatus (10) configured to be attached to a body of a user to measure a size and the like of the body of the user and output sensor measurement information representing the measured size and the like, a user terminal (20) configured to be operated by the user who measures the body, and a management server (30) configured to manage size information, shape information, and the like of apparel merchandise and provide merchandise search result information that is user size information as body size information of the user based on the sensor measurement information and information concerning merchandise matching the size.