A device and method for aligning a robot coordinate system, being a coordinate system of a robot for moving an operating point three-dimensionally, and a measuring instrument coordinate system, being a coordinate system of a three-dimensional measuring instrument which is capable of executing a light sectioning method and of which a position and attitude with respect to the operating point are unchanging, characterized by including the steps of: determining a relationship between the coordinate systems; radiating sheet-like slit light from the three-dimensional measuring instrument onto a reference object in the shape of a rectangular cuboid which is fixed; finding the attitude of the three-dimensional measuring instrument relative to the reference object; and moving the three-dimensional measuring instrument such that the attitude of the three-dimensional measuring instrument falls within a predetermined standard attitude range.

A system and a method for spatial positioning of magnetometers. Said system includes: magnetometers, a magnetometer support, first positioning markers, a photogrammetry system, and a controller. The first positioning markers are a non-rotationally-symmetrical pattern. The photogrammetry system includes photographing devices configured to photograph, at at least two of a plurality of photographing sites, first image data of the first positioning markers by means of one or more photographing devices. The controller is configured to receive data of the first image photographed by the photographing devices, calculate spatial positions of the first positioning markers on the basis of pre-obtained system parameters and the first image data, and then calculate spatial positions and spatial orientations of the magnetometers.

An orientation-position determining device is provided which is used for a sensor installed in a vehicle. The orientation-position determining device includes an imaging unit and an orientation-position detector. The imaging unit works to obtain a ranging image and an ambient light image from the sensor. The ranging image represents a distance to a target lying in a light emission region to which light is emitted from the sensor. The ambient light image represents an intensity of ambient light and has a resolution higher than that of the ranging image. The orientation-position detector works to use the ranging image and the ambient light image to detect an orientation and/or a position of the sensor.

Provided are a probe for a three-dimensional coordinate measuring device that enable calculation of coordinates of a measurement point of a measurement target with high accuracy. The probe is used in the three-dimensional coordinate measuring device that calculates coordinates of a measurement point of a measurement target. In the probe, a plurality of markers whose image is captured by an imaging unit are held by a probe holding unit. A stylus, which is brought into contact with the measurement target to specify the measurement point, is attached to the probe holding unit. The stylus has a predetermined positional relationship with respect to the plurality of measurement markers. The probe holding unit is connected to a probe casing in a freely movable manner. A magnetic sensor that outputs a signal corresponding to a displacement amount of the probe holding unit with respect to the probe casing is provided inside the probe casing.

A method is useable for digitally correcting an optical image of a sample by a microscope that has a cover slip covering the sample. The method includes: determining, by the microscope, an index of refraction of an optical medium bordering the cover slip, a tilt of the cover slip, and/or a thickness of the cover slip; ascertaining an imaging error to be corrected in the form of a pupil function based on the index of refraction of the optical medium, the tilt of the cover slip, and/or the thickness of the cover slip; carrying out imaging of the sample by the microscope; and digitally correcting image data captured by the imaging of the sample based on the pupil function.

In this vehicle inspection system for inspecting the driving functionality of a vehicle that carries out automatic driving or driving assistance, when a monitor and the vehicle are being aligned on a bench testing machine, a simulator device displays an image of a straight road on the monitor, a wheel sensor (wheel position sensor) detects the steering direction of a wheel (front wheel) steered using a lane keeping function, and an image position adjustment device (monitor position adjustment device) moves the image in the opposite direction from the steering direction of the wheel until the wheel reaches a neutral state of not being steered.

In this vehicle inspection system for inspecting the driving functionality of a vehicle that carries out automatic driving or driving assistance, when a monitor and the vehicle are being aligned on a bench testing machine, a simulator device displays an image of a straight road on the monitor, a wheel sensor (wheel position sensor) detects the steering direction of a wheel (front wheel) steered using a lane keeping function, and an image position adjustment device (monitor position adjustment device) moves the image in the opposite direction from the steering direction of the wheel until the wheel reaches a neutral state of not being steered.

Methods and systems for measurement of wafer tilt and overlay are described herein. In some embodiments, the measurements are based on the value of an asymmetry response metric and known wafer statistics. Spectral measurements are performed at two different azimuth angles, preferably separated by one hundred eighty degrees. A sub-range of wavelengths is selected with significant signal sensitivity to wafer tilt or overlay. An asymmetry response metric is determined based on a difference between the spectral signals measured at the two different azimuth angles within the selected sub-range of wavelengths. The value of the asymmetry response metric is mapped to an estimated value of wafer tilt or overlay. In some other embodiments, the measurement of wafer tilt or overlay is based on a trained measurement model. Training data may be programmed or determined based on one or more asymmetry response metrics at two different azimuth angles.

Methods and systems for measurement of wafer tilt and overlay are described herein. In some embodiments, the measurements are based on the value of an asymmetry response metric and known wafer statistics. Spectral measurements are performed at two different azimuth angles, preferably separated by one hundred eighty degrees. A sub-range of wavelengths is selected with significant signal sensitivity to wafer tilt or overlay. An asymmetry response metric is determined based on a difference between the spectral signals measured at the two different azimuth angles within the selected sub-range of wavelengths. The value of the asymmetry response metric is mapped to an estimated value of wafer tilt or overlay. In some other embodiments, the measurement of wafer tilt or overlay is based on a trained measurement model. Training data may be programmed or determined based on one or more asymmetry response metrics at two different azimuth angles.

A method for detecting at least one characteristic parameter of a closure element (12) closing an opening. By means of a handling device (10), a movement is imposed on the closure element (12), wherein at least the interacting force between the closure element and the handing device during the movement is determined by means of a first sensor (20) integrated in the handling device, and position changes of the closure element during the movement sequence are detected by means of a second sensor (26).