Surface measuring device for measuring a surface of a workpiece has a device base body, and a measuring probe that by use of a feed apparatus is movable along a feed axis relative to a workpiece to be measured. The measuring probe has a probe base body and a probe element, connected to the probe base body, for scanning the workpiece in the direction of a measuring axis. The probe base body is connected to the measuring device base body via the feed apparatus. An oscillation damper is associated with the measuring probe, and is designed and configured for oscillation rate-dependent damping of oscillations of the probe base body of the measuring probe, and is active between the probe base body and the device base body.

Surface measuring device for measuring a surface of a workpiece has a device base body, and a measuring probe that by use of a feed apparatus is movable along a feed axis relative to a workpiece to be measured. The measuring probe has a probe base body and a probe element, connected to the probe base body, for scanning the workpiece in the direction of a measuring axis. The probe base body is connected to the measuring device base body via the feed apparatus. An oscillation damper is associated with the measuring probe, and is designed and configured for oscillation rate-dependent damping of oscillations of the probe base body of the measuring probe, and is active between the probe base body and the device base body.

A method for the nondestructive inspection of a surface structure, including: preparing the surface structure; wetting a portion of the surface structure with a liquid, the variation in the thickness of the liquid above the portion of the surface structure being at most 50% of the maximum thickness of the liquid above the surface structure, so that the liquid forms a light guide which has, and is bounded by, the inverse shape of the surface structure at a first large surface and is bounded by air at a second large surface; coupling light into the light guide so that the inverse shape of the surface structure at the first large surface is impinged by light such that light coupled into the light guide is coupled out of the light guide via the second large surface; capturing an image of the light coupled out and; evaluating the captured image.

A height measurement apparatus comprising an array of differential pressure sensors, each differential pressure sensor comprising a reference outlet and a measurement outlet, the reference outlet being a predetermined distance from a reference surface, and each differential pressure sensor further comprising an inlet configured to provide pressurized gas for the reference outlet and the measurement outlet. A flexible membrane is positioned such that a reference side of the flexible membrane is in fluid communication with the reference outlet and a measurement side of the flexible membrane is in fluid communication with the measurement outlet. The flexible membrane is configured to move when a pressure change occurs at the measurement outlet and a detector is configured to monitor the movement of the flexible membrane.

A height measurement apparatus comprising an array of differential pressure sensors, each differential pressure sensor comprising a reference outlet and a measurement outlet, the reference outlet being a predetermined distance from a reference surface, and each differential pressure sensor further comprising an inlet configured to provide pressurized gas for the reference outlet and the measurement outlet. A flexible membrane is positioned such that a reference side of the flexible membrane is in fluid communication with the reference outlet and a measurement side of the flexible membrane is in fluid communication with the measurement outlet. The flexible membrane is configured to move when a pressure change occurs at the measurement outlet and a detector is configured to monitor the movement of the flexible membrane.

Surface measuring device for measuring a surface of a workpiece has a device base body, and a measuring probe that by use of a feed apparatus is movable along a feed axis relative to a workpiece to be measured. The measuring probe has a probe base body and a probe element, connected to the probe base body, for scanning the workpiece in the direction of a measuring axis. The probe base body is connected to the measuring device base body via the feed apparatus. An oscillation damper is associated with the measuring probe, and is designed and configured for oscillation rate-dependent damping of oscillations of the probe base body of the measuring probe, and is active between the probe base body and the device base body.

Surface measuring device for measuring a surface of a workpiece has a device base body, and a measuring probe that by use of a feed apparatus is movable along a feed axis relative to a workpiece to be measured. The measuring probe has a probe base body and a probe element, connected to the probe base body, for scanning the workpiece in the direction of a measuring axis. The probe base body is connected to the measuring device base body via the feed apparatus. An oscillation damper is associated with the measuring probe, and is designed and configured for oscillation rate-dependent damping of oscillations of the probe base body of the measuring probe, and is active between the probe base body and the device base body.

A method and system for nanoscale precision programmable profiling on substrates. Profiling material is dispensed on a substrate or a superstrate. The superstrate is brought in contact with the substrate. The profiling material is then cured after bringing the superstrate in contact with the substrate. The superstrate is separated from the substrate after curing. An optical metrology of points on the substrate corresponding to the final substrate profile is then performed.

A method and system for nanoscale precision programmable profiling on substrates. Profiling material is dispensed on a substrate or a superstrate. The superstrate is brought in contact with the substrate. The profiling material is then cured after bringing the superstrate in contact with the substrate. The superstrate is separated from the substrate after curing. An optical metrology of points on the substrate corresponding to the final substrate profile is then performed.

A method and device for automatically identifying a point of interest (e.g., the deepest or highest point) on the surface of an anomaly on a viewed object using a video inspection device is disclosed. The video inspection device obtains and displays an image of the surface of the viewed object. A reference surface is determined along with a region of interest that includes a plurality of points on the surface of the anomaly. The video inspection device determines a depth or height for each of the plurality of points on the surface of the anomaly in the region of interest. The point on the surface of the anomaly (e.g., having the greatest depth or height) is identified as the point of interest. A profile of the object surface at the point of interest is then determined.