G01C19/56

Sensor calibration and verification using induced motion

Motion can be induced at a vehicle, e.g., by actuating components of an active suspension system, and first sensor data and second sensor data representing an environment of the vehicle can be captured at a first position and a second position, respectively, resulting from the induced motion. A second sensor can determine motion information associated with the first position and the second position. Calibration information about the sensor, the first sensor data, and the motion information can be used to determine an expectation of sensor data at the second position. A calibration error can be the difference between the second sensor data and the expected sensor data.

Wearable Device for Measuring Body Kinetics

A System for Measuring Body Kinetics includes a wearable device configured to be wrapped around a joint. A microprocessor is attached to the wearable device, One or more Inertial Measurement. Units (IMUS) are connected to the microprocessor and arranged on the wearable device. The IMUS are arranged and configured to provide kinetic data concerning the joint to the microprocessor. A wireless transmission component is connected to the microprocessor. The microprocessor is configured to receive kinetic data from the IMUs, and to transmit the kinetic data by way of the wireless transmission component to a central processor or other device. An algorithm resides within the microprocessor or the central processor or other device, and is configured to determine the position of each IMU from the kinetic data. The wearable device may be constructed of fabric, strap, adhesive tape, or a combination thereof.

Wearable Device for Measuring Body Kinetics

A System for Measuring Body Kinetics includes a wearable device configured to be wrapped around a joint. A microprocessor is attached to the wearable device, One or more Inertial Measurement. Units (IMUS) are connected to the microprocessor and arranged on the wearable device. The IMUS are arranged and configured to provide kinetic data concerning the joint to the microprocessor. A wireless transmission component is connected to the microprocessor. The microprocessor is configured to receive kinetic data from the IMUs, and to transmit the kinetic data by way of the wireless transmission component to a central processor or other device. An algorithm resides within the microprocessor or the central processor or other device, and is configured to determine the position of each IMU from the kinetic data. The wearable device may be constructed of fabric, strap, adhesive tape, or a combination thereof.

INERTIAL SENSOR

A micro vibration body includes a curved surface portion, a recessed portion recessed from the curved surface portion, a bottom surface protruding portion protruding from a bottom surface of the recessed portion, and a through hole in the bottom surface protruding portion. A mounting substrate has a positioning recess, into which the bottom surface protruding portion is inserted, and electrode portions surrounding the inner frame portion. A joining member is in the positioning recess and joins the bottom surface protruding portion with the mounting substrate. The bottom surface is in contact with a region of the mounting substrate around the positioning recess. The bottom surface protruding portion has a tip end surface that is at a distance from the positioning recess. The joining member at least partially enters the through hole and is electrically connected to the conductive layer.

INERTIAL SENSOR

A micro vibration body includes a curved surface portion, a recessed portion recessed from the curved surface portion, a bottom surface protruding portion protruding from a bottom surface of the recessed portion, and a through hole in the bottom surface protruding portion. A mounting substrate has a positioning recess, into which the bottom surface protruding portion is inserted, and electrode portions surrounding the inner frame portion. A joining member is in the positioning recess and joins the bottom surface protruding portion with the mounting substrate. The bottom surface is in contact with a region of the mounting substrate around the positioning recess. The bottom surface protruding portion has a tip end surface that is at a distance from the positioning recess. The joining member at least partially enters the through hole and is electrically connected to the conductive layer.

Three-axis microelectromechanical system (MEMS) gyroscope

A three-axis microelectromechanical system (MEMS) gyroscope includes four proof masses, where the proof masses are connected by spring beams and/or rigid beams; a first proof mass is configured to move in an X-axis direction; a second proof mass is configured to rotate around an X-direction axis, a Y-direction axis, and a Z-direction axis, and when the first proof mass moves in the X-axis direction, the second proof mass is driven to rotate around the Z-direction axis; a third proof mass is configured to move in the X-axis direction and a Y-axis direction, and when the first proof mass moves in the X-axis direction, the third proof mass is driven to move in the Y-axis direction; a fourth proof mass is configured to move in the X-axis direction, and when the third proof mass moves in the X-axis direction, the fourth proof mass is driven to move in the X-axis direction.

VIBRATING-MASS SENSOR SYSTEM

One example includes a radar image interface system. The system includes an image processor configured to receive synthetic aperture radar (SAR) image data associated with a region of interest and to generate a radar image of the region of interest based on the SAR image data. The image processor can be further configured to divide the radar image into a plurality of sequential units corresponding to respective zones of the region of interest. The system also includes a display system configured to display zoomed sequential units corresponding to respective zoomed versions of the sequential units of the radar image to a user. The system further includes an input interface configured to facilitate sequentially indexing through each of the zoomed versions of the sequential units on the display system in response to an indexing input provided by the user.

VIBRATING-MASS SENSOR SYSTEM

One example includes a radar image interface system. The system includes an image processor configured to receive synthetic aperture radar (SAR) image data associated with a region of interest and to generate a radar image of the region of interest based on the SAR image data. The image processor can be further configured to divide the radar image into a plurality of sequential units corresponding to respective zones of the region of interest. The system also includes a display system configured to display zoomed sequential units corresponding to respective zoomed versions of the sequential units of the radar image to a user. The system further includes an input interface configured to facilitate sequentially indexing through each of the zoomed versions of the sequential units on the display system in response to an indexing input provided by the user.

MEMS GYROCOMPASS
20230204358 · 2023-06-29 ·

A gyrocompass device is provided for determining a heading relative to a surface of a rotating planetary body. The gyrocompass device includes one or more MEMS gyroscopes that are each fixed in an orientation on a substrate that is parallel to a first plane and that each provide three or more sense axes that lie within the first plane and are each offset from one another by an offset angle. Moreover, a heading determiner receives rotation rates from the three sense axes and determines the heading of the gyrocompass device relative to the surface of the rotating planetary body by fitting a sine or cosine function to the received rotation rates from the one or more MEMS gyroscopes.

Sensor Module
20230209716 · 2023-06-29 ·

A sensor module includes a circuit board, a sensor element having a detection axis along a planar direction of the circuit board, a sensor package accommodating the sensor element and mounted on the circuit board, a board land pattern used for mounting the sensor package disposed on the circuit board, and a package electrode disposed on a mounting surface of the sensor package facing the circuit board and joined to the board land pattern by a solder. A relationship of Xp≤X1 is satisfied, in which Xp is a width of the board land pattern in a first direction along the planar direction of the circuit board, and X1 is a width of the package electrode in the first direction.