A backing component configured to receive and attenuate transmitted acoustic signals from a transducer element in an ultrasound probe is disclosed. The backing component has a unitary structure of a first material and a second material, and a variation in packing density of the first material across at least a portion of a thickness of the backing component. Further, a method of making a backing component for a transducer element in an ultrasound probe is disclosed. The method includes performing an additive manufacturing technique using a first material and a second material to form the backing component that has a unitary structure of the first material and the second material. Performing the additive manufacturing technique involves varying a packing density of the first material across at least a portion of thickness of the backing component.

An electronic device includes an electronic component and a protective shield including a phase change material having a phase change temperature of between 20 C. and 90 C., an antivibration gel having hyperelastic and/or viscoelastic behavior at 20 C., and a separation barrier positioned so as to separate the phase change material and the antivibration gel. The antivibration gel is positioned, at least partly, in contact with the electronic component, and has a thermal conductivity of greater than 1 W/m.Math.K at 20 C.

An electronic device includes an electronic component and a protective shield including a phase change material having a phase change temperature of between 20 C. and 90 C., an antivibration gel having hyperelastic and/or viscoelastic behavior at 20 C., and a separation barrier positioned so as to separate the phase change material and the antivibration gel. The antivibration gel is positioned, at least partly, in contact with the electronic component, and has a thermal conductivity of greater than 1 W/m.Math.K at 20 C.

In the present disclosure, systems and apparatuses for stabilizing a metrology device may be provided. The metrology device may be connected with a metrology apparatus that may prevent and/or correct for unintended movement of the metrology device. The metrology apparatus may include a base plate having a top surface and a bottom surface, and the base plate may include a plurality of holes from the top surface to the bottom surface. The metrology apparatus may further include a plurality of suspension rods, and a distal end of a respective suspension rod may be positioned through a respective hole such that a first portion of the distal end is disposed on the top surface of the base plate and a second portion of the distal end is disposed on the bottom surface of the base plate. The metrology device may be connected to the bottom surface of the base plate such that at least a portion of an assembly cell is within a field of view of the metrology device.

In the present disclosure, systems and apparatuses for stabilizing a metrology device may be provided. The metrology device may be connected with a metrology apparatus that may prevent and/or correct for unintended movement of the metrology device. The metrology apparatus may include a base plate having a top surface and a bottom surface, and the base plate may include a plurality of holes from the top surface to the bottom surface. The metrology apparatus may further include a plurality of suspension rods, and a distal end of a respective suspension rod may be positioned through a respective hole such that a first portion of the distal end is disposed on the top surface of the base plate and a second portion of the distal end is disposed on the bottom surface of the base plate. The metrology device may be connected to the bottom surface of the base plate such that at least a portion of an assembly cell is within a field of view of the metrology device.

In the present disclosure, systems and apparatuses for stabilizing a metrology device may be provided. The metrology device may be connected with a metrology apparatus that may prevent and/or correct for unintended movement of the metrology device. The metrology apparatus may include a base plate having a top surface and a bottom surface, and the base plate may include a plurality of holes from the top surface to the bottom surface. The metrology apparatus may further include a plurality of suspension rods, and a distal end of a respective suspension rod may be positioned through a respective hole such that a first portion of the distal end is disposed on the top surface of the base plate and a second portion of the distal end is disposed on the bottom surface of the base plate. The metrology device may be connected to the bottom surface of the base plate such that at least a portion of an assembly cell is within a field of view of the metrology device.

In the present disclosure, systems and apparatuses for stabilizing a metrology device may be provided. The metrology device may be connected with a metrology apparatus that may prevent and/or correct for unintended movement of the metrology device. The metrology apparatus may include a base plate having a top surface and a bottom surface, and the base plate may include a plurality of holes from the top surface to the bottom surface. The metrology apparatus may further include a plurality of suspension rods, and a distal end of a respective suspension rod may be positioned through a respective hole such that a first portion of the distal end is disposed on the top surface of the base plate and a second portion of the distal end is disposed on the bottom surface of the base plate. The metrology device may be connected to the bottom surface of the base plate such that at least a portion of an assembly cell is within a field of view of the metrology device.

A shock-isolated mounting device and a method and system are provided. For example, the shock-isolated mounting device includes an enclosure configured to support the mounting device, at least one damper attached between the mounting device and the enclosure, and a thermally-conductive element disposed on a surface of the mounting device and configured to thermally couple the mounting device to the enclosure. The thermally-conductive element facilitates the dissipation of heat generated by electronic components mounted onto the shock-isolated mounting device.

A shock-isolated mounting device and a method and system are provided. For example, the shock-isolated mounting device includes an enclosure configured to support the mounting device, at least one damper attached between the mounting device and the enclosure, and a thermally-conductive element disposed on a surface of the mounting device and configured to thermally couple the mounting device to the enclosure. The thermally-conductive element facilitates the dissipation of heat generated by electronic components mounted onto the shock-isolated mounting device.

The disclosure relates to a sensor carrier as a mechanical connection of a sensor to a component of a motor vehicle. The sensor carrier has a sensor section to fix the sensor to the sensor carrier, at least one component section to fix the sensor carrier to the component, and at least one intermediate section that connects the sensor section to the at least one component section. The sensor carrier is composed, at least in the intermediate section, of an inherently rigid cellular material, the cavities of cellular material are arranged regularly, at least in some sections, specifically in such a way that, starting from a defined minimum force, the material of the sensor carrier in the intermediate section is intrinsically more deformable in at least one direction than in other directions.