An airtight housing, in particular electronics housing, is suitable for use in different ambient pressure conditions. The housing has housing walls of a plastics material. At least one of the housing walls has a pressure compensating device that seals a cutout in the housing wall in an airtight manner. The pressure compensating device has an elastic, flat compensating element located on top of the cutout.

A viscosity measurement system and method of fabrication thereof, the system comprising a measuring element and a housing, the measuring element comprising a base and a counterweight, forced oscillation generating means, a tube, and a rod; the base, the counterweight and the forced oscillation means being sealed in the housing; the tube extending out of the housing through an opening in a bottom wall of the housing; the forced oscillation generating means being connected to an electric board secured to a top wall of the housing opposite the bottom wall for excitation of the rod; and the rod extending within the tube and immerging of the housing for immersion, at least in part, in a fluid to be measured, wherein the counterweight is distant from the top wall and from lateral walls of the housing, and the base is supported by the bottom wall of the housing in such a way to simultaneously provide a rigid attachment on an outer circumference of the bottom wall and on a circumference of the opening in the bottom wall, and a flexible dampening attachment on a remaining interface between a bottom surface of the base of the measuring element and an upper surface of the bottom wall of the housing.

A viscosity measurement system and method of fabrication thereof, the system comprising a measuring element and a housing, the measuring element comprising a base and a counterweight, forced oscillation generating means, a tube, and a rod; the base, the counterweight and the forced oscillation means being sealed in the housing; the tube extending out of the housing through an opening in a bottom wall of the housing; the forced oscillation generating means being connected to an electric board secured to a top wall of the housing opposite the bottom wall for excitation of the rod; and the rod extending within the tube and immerging of the housing for immersion, at least in part, in a fluid to be measured, wherein the counterweight is distant from the top wall and from lateral walls of the housing, and the base is supported by the bottom wall of the housing in such a way to simultaneously provide a rigid attachment on an outer circumference of the bottom wall and on a circumference of the opening in the bottom wall, and a flexible dampening attachment on a remaining interface between a bottom surface of the base of the measuring element and an upper surface of the bottom wall of the housing.

A fluid dispensing device having a flexible fluid pouch and a dispensing assembly, the dispensing assembly having a top piece and a bottom piece, the top piece having a flexible actuator including a flexible dome and a flexible flange extension, the bottom piece having a bottom portion of a pump chamber, a pump chamber inlet, a chamber inlet valve, and a bottom portion of an outlet valve, the top piece and the bottom piece mated together to form a pump chamber and an outlet valve, the device configured to allow bidirectional fluid flow through either or both inlet and outlet valves, and to dispense a volume of fluid that is less than the volume of the pump chamber. The flexible pouch may have a single opening or two openings. In the case of a single opening, the entire dispensing assembly is in the interior of the pouch. In the case of two openings, only the flexible dome extends to the exterior of the pouch. The outlet valve is configured so that the more pressure that is applied to the flexible fluid pouch, the more tightly the outlet valve seals.

A system includes a pipeline and a valve mechanism defining an adjustable orifice. An actuator is coupled to the valve mechanism and operable adjust a size of the adjustable orifice. An upstream pressure sensor senses pressure of the fluid and an adjustment controller is communicatively coupled to the actuator and the upstream pressure sensor, wherein the adjustment controller actuates the actuator to adjust the size of the adjustable orifice based on data received from the upstream pressure sensor. A differential pressure sensor measures differential pressure across the adjustable orifice and a temperature sensor senses temperature of the fluid downstream from the adjustable orifice. A calculation controller is communicatively coupled to the adjustment controller, the differential pressure sensor, and the temperature sensor, wherein the calculation controller calculates flow rate of the fluid based on data received from the differential pressure sensor, the temperature sensor, and the adjustment controller.

A system includes a pipeline and a valve mechanism defining an adjustable orifice. An actuator is coupled to the valve mechanism and operable adjust a size of the adjustable orifice. An upstream pressure sensor senses pressure of the fluid and an adjustment controller is communicatively coupled to the actuator and the upstream pressure sensor, wherein the adjustment controller actuates the actuator to adjust the size of the adjustable orifice based on data received from the upstream pressure sensor. A differential pressure sensor measures differential pressure across the adjustable orifice and a temperature sensor senses temperature of the fluid downstream from the adjustable orifice. A calculation controller is communicatively coupled to the adjustment controller, the differential pressure sensor, and the temperature sensor, wherein the calculation controller calculates flow rate of the fluid based on data received from the differential pressure sensor, the temperature sensor, and the adjustment controller.

When an exposed part of a semiconductor chip is reduced in size, a tendency of development of a crack on the semiconductor chip is suppressed. A pressure of injection of a resin MR into a second space creates a gap on a contact part SEL where an elastic film LAF and a semiconductor chip CHP1 are in contact, and a resin MR2 different in constituent from the resin MR infiltrates into the gap. As a result, in an area of semiconductor chip CHP1 that is exposed from the resin MR, the resin MR2 is formed in an area other than a flow detecting unit FDU and an area around it. Hence, an area of semiconductor chip CHP1 that is exposed from the resins MR and MR2 can be reduced in size.

When an exposed part of a semiconductor chip is reduced in size, a tendency of development of a crack on the semiconductor chip is suppressed. A pressure of injection of a resin MR into a second space creates a gap on a contact part SEL where an elastic film LAF and a semiconductor chip CHP1 are in contact, and a resin MR2 different in constituent from the resin MR infiltrates into the gap. As a result, in an area of semiconductor chip CHP1 that is exposed from the resin MR, the resin MR2 is formed in an area other than a flow detecting unit FDU and an area around it. Hence, an area of semiconductor chip CHP1 that is exposed from the resins MR and MR2 can be reduced in size.

A flow sensor structure seals the surface of an electric control circuit and part of a semiconductor device via a manufacturing method that prevents occurrence of flash or chip crack when clamping the semiconductor device via a mold. The flow sensor structure includes a semiconductor device having an air flow sensing unit and a diaphragm, and a board or lead frame having an electric control circuit for controlling the semiconductor device, wherein a surface of the electric control circuit and part of a surface of the semiconductor device is covered with resin while having the air flow sensing unit portion exposed. The flow sensor structure may include surfaces of a resin mold, a board or a pre-mold component surrounding the semiconductor device that are continuously not in contact with three walls of the semiconductor device orthogonal to a side on which the air flow sensing unit portion is disposed.

A flow sensor structure seals the surface of an electric control circuit and part of a semiconductor device via a manufacturing method that prevents occurrence of flash or chip crack when clamping the semiconductor device via a mold. The flow sensor structure includes a semiconductor device having an air flow sensing unit and a diaphragm, and a board or lead frame having an electric control circuit for controlling the semiconductor device, wherein a surface of the electric control circuit and part of a surface of the semiconductor device is covered with resin while having the air flow sensing unit portion exposed. The flow sensor structure may include surfaces of a resin mold, a board or a pre-mold component surrounding the semiconductor device that are continuously not in contact with three walls of the semiconductor device orthogonal to a side on which the air flow sensing unit portion is disposed.