Patent classifications
G01J5/0003
Stress measurement device, stress measurement system, and stress measurement method
A stress measurement device includes a first obtaining unit obtaining thermal data including information indicating a temperature of a measuring region, a second obtaining unit obtaining data related to stress occurring in one part of the measuring region, and a controller finding stress occurring in the measuring region from the thermal data and the data related to the stress. The controller finds, first waveform data respectively on the one part and a part other than the one part based on a change with time of the thermal data, and second waveform data based on a change with time of the data related to the stress. The controller finds, disturbance data through a deduction of the second waveform data from the first waveform data on the one part, and stress data indicating stress occurring in the part through a deduction the disturbance data from the first waveform data on the part.
Device and method for measuring oxide film thickness
An oxide layer thickness measurement device according to the present invention stores, for each of layer thickness measurement sub-ranges constituting a layer thickness measurement range, layer thickness conversion information representing a correlation between a layer thickness and an emitting light luminance where a ratio of a change in the emitting light luminance to a change in the layer thickness in the layer thickness measurement sub-range falls within a set extent. The device includes a plurality of emitting light luminance measurement parts for measuring emitting light luminances of a surface of a steel sheet at respective measurement wavelengths different from each other. Calculated in connection with each of the emitting light luminances of the surface of the steel sheet measured by the emitting light luminance measurement parts are the layer thickness corresponding to the measured emitting light luminance and a ratio at the layer thickness by using the layer thickness conversion information corresponding to each of the emitting light luminance measurement parts. The calculated layer thickness is extracted as a candidate value for an actual thickness layer when the calculated ratio is within the set extent assigned for the layer thickness conversion information.
THICKNESS MEASUREMENT METHOD, THICKNESS MEASUREMENT DEVICE, DEFECT DETECTION METHOD, AND DEFECT DETECTION DEVICE
A thickness measurement method includes: heating a surface of the measurement object in a dot shape by a heating device; generating a thermal image corresponding to a temperature of the surface of the measurement object by capturing an image of the heated surface of the measurement object at a predetermined time interval by an imaging device; acquiring temperature data indicating temporal changes in temperature at multiple positions on the surface of the measurement object based on the thermal image generated by the imaging device; fitting a solution function indicating a solution of a heat conduction equation corresponding to a point heat source and including a parameter related to the thickness of the measurement object to the temperature data; and calculating the thickness of the measurement object based on a value of the parameter in the fitted solution function.
CALIBRATION METHOD FOR TEMPERATURE MEASUREMENT DEVICE, CALIBRATION DEVICE FOR TEMPERATURE MEASUREMENT DEVICE, CALIBRATION METHOD FOR PHYSICAL QUANTITY MEASUREMENT DEVICE, AND CALIBRATION DEVICE FOR PHYSICAL QUANTITY MEASUREMENT DEVICE
A calibration method for a temperature measurement device, the method including: measuring dispersed spectrum information of radiation energy from a black body furnace and dark current data with a first temperature measurement device and with a second temperature measurement device that is to be swapped with the first temperature measurement device, at each of a plurality of different temperatures; generating, using information thus measured, a second temperature measurement value to be measured by a second contact thermometer included in the second temperature measurement device, and a second dispersed spectrum information corresponding to the second temperature measurement value, from a first temperature measurement value measured by a first contact thermometer included in the first temperature measurement device and a first dispersed spectrum information corresponding to the first temperature measurement value; and determining, using the information thus generated, the basis spectrum and the calibration line for the second temperature measurement device.
DEVICE AND METHOD FOR MEASURING OXIDE FILM THICKNESS
An oxide layer thickness measurement device according to the present invention stores, for each of layer thickness measurement sub-ranges constituting a layer thickness measurement range, layer thickness conversion information representing a correlation between a layer thickness and an emitting light luminance where a ratio of a change in the emitting light luminance to a change in the layer thickness in the layer thickness measurement sub-range falls within a set extent. The device includes a plurality of emitting light luminance measurement parts for measuring emitting light luminances of a surface of a steel sheet at respective measurement wavelengths different from each other. Calculated in connection with each of the emitting light luminances of the surface of the steel sheet measured by the emitting light luminance measurement parts are the layer thickness corresponding to the measured emitting light luminance and a ratio at the layer thickness by using the layer thickness conversion information corresponding to each of the emitting light luminance measurement parts. The calculated layer thickness is extracted as a candidate value for an actual thickness layer when the calculated ratio is within the set extent assigned for the layer thickness conversion information.
OXIDE FILM THICKNESS MEASUREMENT DEVICE AND METHOD
An oxide layer thickness measurement device according to the present invention stores, for each of layer thickness measurement sub-ranges constituting a layer thickness measurement range, layer thickness conversion information representing a correlation between a layer thickness and an emissivity where a ratio of a change in the emissivity to a change in the layer thickness in the layer thickness measurement sub-range falls within a set extent. Emitting light luminances of a surface of a steel sheet are measured at respective measurement wavelengths different from each other, and a temperature of the surface of the steel sheet is measured to thereby calculate the emissivity at each of the measurement wavelengths. Calculated in connection with the emissivity calculated at each of the measurement wavelength are the layer thickness corresponding to the emissivity at the measurement wavelength, and a ratio at the layer thickness by using the layer thickness conversion information corresponding to the measurement wavelength. The calculated thickness is extracted as a candidate value for an actual layer thickness when the calculated ratio is within the preset extent assigned for the layer thickness conversion information.
Coaxial fiber optical pyrometer with laser sample heater
An optical pyrometer having a coaxial light guide delivers laser radiation through optics to heat a localized area on a sample, and simultaneously collects optical radiation from the sample to perform temperature measurement of the heated area. Inner and outer light guides can comprise the core and inner cladding, respectively, of a double-clad fiber (DCF), or can be formed using a combination of optical fibers in one or more coaxial bundles. Coaxial construction and shared optics facilitate alignment of the centers of the heated and observed areas on the sample. The heated area can be on the order of micrometers when using a single-mode optical fiber core as the inner light guide. The system can be configured to heat small samples within a vacuum system of charged-particle beam microscopes such as electron microscopes. A method for using the invention in a microscope is also provided.
A METHOD AND SYSTEM FOR DETECTION OF ELECTROMAGNETIC RADIATION
The invention relates to a device and method for imaging electromagnetic radiation from an object. The device includes entrance optics for allowing the electromagnetic radiation to enter the device, including an image plane onto which an image of the object is to be imaged. The device includes an interferometer having a measurement arm, wherein the image plane is in the measurement arm. The device includes a transformation layer, at the image plane, for transforming the electromagnetic radiation into a spatiotemporal variation of the refractive index of the transformation layer for causing spatiotemporal optical phase differences in the measurement arm of the interferometer that are processed to result in a representative image of the object.
SURFACE SENSITIZATION FOR HIGH-RESOLUTION THERMAL IMAGING
A structured product, comprising: at least two layers comprising a first layer and a second layer; wherein: the first layer comprises at least one material having a temperature-dependent (e.g., a positive temperature-dependent or a negative temperature-dependent) wavelength-integrated emissivity (ε); the second layer comprises at least one reflective material that is reflective to light in an 8-14 μm wavelength range; and the structured product has a positive temperature-dependent wavelength-integrated emissivity. The structured product is useful in a method for thermal image sensitizing, the method comprising imaging, in an infrared spectrum, the structured product.
APPARATUSES, SYSTEMS, AND METHODS FOR THERMAL IMAGING
Thermal imaging systems are provided. An example thermal imaging system includes an infrared (IR) imager that acquires IR image data of a field of view of the IR imager. The thermal imaging system further includes video analysis circuitry operably coupled to the IR imager. The video analysis circuitry receives first temperature data of a first field reference within the field of view of the IR imager, receives second temperature data of a second field reference within the field of view of the IR imager, and receives IR image data from the IR imager. The video analysis circuitry calibrates the IR imager based upon the first temperature data, the second temperature data, and the IR image data. The thermal imaging system may further include a temperature control chamber enclosing the IR imager and configured to thermally isolate the IR imager and temperature sensors thermally coupled to the IR imager.