Devices, systems, and methods for calibrating for an electron beam additive manufacturing system. The electron beam manufacturing system includes electron beam guns. A calibration system includes an optical pyrometer. The optical pyrometer captures thermal radiation emitted from raw material. An analysis component is communicatively coupled to the optical pyrometer. The analysis component is programmed to determine calibration parameters from information from the optical pyrometer and a phase transition temperature.

An infrared presence detector system includes a focal plane array and a processor coupled to the focal plane array. The array includes a first radiant energy sensor and a plurality of second radiant energy sensors, with the first and second radiant energy sensors configured to convert incident radiation into an electrical signal. The processor is coupled to the focal plane array, and is configured to control the focal plane array in a sleep mode, wherein the first radiant energy sensor is energized and the plurality of second radiant energy sensors are de-energized, and an active mode, wherein at least the plurality of second radiant energy sensors are energized when the first radiant energy sensor detects a presence.

A method for installing a replacement electrical heat sensor in a heatable aircraft window laminate structure comprising the steps of: drilling a blind hole in the edge of the window laminate; routing a channel in the edge of the window laminate from the blind hole to a terminal block of an originally installed heat sensor; inserting the replacement heat sensor into the hole; filling the hole with a material to seal the hole and the heat sensor from contamination; heating the window laminate; photographing the window laminate using an infrared camera to determine uniformity of heat distribution; placing a heated plate against the exterior surface of the window laminate directly over the position of the replacement heat sensor; measuring an electrical resistance of the replacement heat sensor to confirm proper operation of the replacement heat sensor.

A computer determines one or more temperature sensitive components from a part details in a bill of materials for soldering on a printed circuit board assembly, where the bill of materials is a record comprising part details having a reference designator. The computer determines whether temperature sensitive components exist in the bill of materials. Based on determining that at least one of the temperature sensitive components exist in the bill of materials, the computer determines temperature limits for each temperature sensitive component based on the reference designator, monitors, using the thermographic cameras the measured temperatures of the temperature sensitive components during soldering in the reflow oven. Then, based on determining that the measured temperatures of the temperature sensitive components exceeds the temperature limits, the computer determines an elapsed time outside of the temperature limit when the measured temperatures of the temperature sensitive components exceeds the temperature limits.

The present disclosure relates to systems and methods for processing infrared data. The methods may include obtaining one or more raw infrared data frames related to a target object. Each of the one or more raw infrared data frames may include raw infrared data including raw temperature information and raw grayscale information of the target object. The methods may further include generating one or more target infrared data frames corresponding to the one or more raw infrared data frames based on the raw infrared data. Each of the one or more target infrared data frames may include a frame header, an information header, and a data area. And for at least one of the one or more target infrared data frames, the data area may include substantially complete raw temperature information and substantially complete raw grayscale information.

Methods and systems for detecting container leakage using thermal imaging, for example, infrared imaging, are disclosed. A method may include a step of sensing thermal radiation emanating from a scene encompassing a liquid-holding container. For example, the container may be an intravenous fluid bag. The method may also include a step of generating a thermal image of the scene based on the sensed thermal radiation and a step of analyzing the thermal image by assessing whether the thermal image includes a thermal feature indicative of the presence of leaked liquid outside the container to determine whether a leak exists in the container. In some embodiments, the container may be enclosed in an overwrap. In such a case, the assessed thermal feature may be indicative of liquid being present in an interstitial volume defined between the container and the overwrap.

An image based correction system compensates for the image quality artifacts induced by thermal ghosting on evolving imaging member surfaces. With thermal ghosting directly tied to previous image content, a feed forward system determines thermal ghosting artifacts based on images previously rendered and generates an open loop gray-level correction to a current image that mitigates undesirable ghosting. For example, the correction system compensates for the thermal ghosting by making the current image “lighter” in areas that will be imaged onto warmer blanket regions, thereby cancelling out TRC differences between different temperature regions. A temperature sensor is used to measure the temperature of the imaging blanket due to the stresses induced by the image. This data is used to learn the parameters of the temperature model periodically during operation, and used in subsequent corrections to mitigate thermal ghosting in spite of changes in blanket properties over use and time.

Techniques for facilitating testing analytics of imaging systems and methods using molds are provided. In one example, a system includes a mold temperature controller configured to apply a thermal signature to a mold of a target. The system further includes a focal plane array configured to capture an infrared image of the mold. The system further includes an image analytics device configured to determine thermal analytics associated with the mold based on the infrared image. Related devices and methods are also provided.

Disclosed are various embodiments for image-based verification of checklist items. In one embodiment, a user request is received to record a temperature reading of a food item using a handheld temperature sensor. In response to the user request, the temperature reading is received and an image of the handheld temperature sensor is captured. The image of the handheld temperature sensor is stored in association with the temperature reading.

A method and device for detecting a body temperature, electronic apparatus and storage medium are provided, which relate to the field of infrared temperature measurement. The method includes: performing face recognition on an optical static image, to determine at least one face image in the optical static image and coordinates of the face image; performing coordinate transformation on a thermal imaging static image and/or the optical static image, to determine thermal imaging information of the face image, wherein the optical static image and the thermal imaging static image include a same image acquisition target with a same face; and determining a body temperature corresponding to the face image, according to the thermal imaging information of the face image. in the embodiment of the present application, efficiency of body temperature detection in public places can be improved and cross infection can be prevented.