A system may include temperature sensors configured to measure temperatures of devices within an industrial automation system. The devices may be disposed within enclosures separate from one or more spaces of an ambient space of the industrial automation system. The system may include thermal image sensors configured to acquire thermal imagery data associated with the ambient space. The system may include a processor configured to receive a first set of temperature data acquired by the temperature sensors over a period of time. The processor may further generate a second set of temperature data representative of one or more predicted temperatures associated with one or more additional spaces of the ambient space. The temperature model may represent expected temperatures of the one or more spaces with respect to the temperatures within the enclosures. The processor may generate a heat map visualization including one or more thermal indicators representative of the predicted temperatures.

An information collection apparatus communicates with an external apparatus, acquires first information relating to a use environment of the apparatus and second information corresponding to a target for the inference processing, executes inference processing by applying the second information and third information set on a basis of the first information to the learned model, and sets the third information on a basis of a range of a first threshold of the first information. When the first information is within a range of a second threshold, the third information is selected on a basis of the range of the first threshold of the first information. When the first information is not within the range of the second threshold, the third information is acquired from the external apparatus via the communication unit so that the first information is within the range of the second threshold.

An infrared heating system comprises an infrared heater. The infrared heater comprises at least one heating element and an infrared emission surface configured to emit infrared radiation across a heating angle to a heating area; an infrared temperature sensor, the infrared temperature sensor having a field of view defined by a sensor angle, the field of view comprising a portion of the heating area; and a controller configured to: receive a temperature value of the field of view from the infrared temperature sensor; calculate a mean radiant temperature of the heating area based on the temperature value from the field of view; output a control signal corresponding to the mean radiant temperature; and transmit the control signal to a component of the infrared heater, wherein the infrared temperature sensor is outside of the heating area and/or is in the plane of the emission surface

According to one embodiment, a generation device acquires a plurality of images of a temperature distribution of a conveyance object. The images are generated by a thermal camera. The generation device sets a plurality of measurement areas in each of the images along a conveyance direction of the conveyance object. The generation device generates time-series data of temperature change over time for each of the plurality of measurement areas. The generation device generates a temperature profile of temperature change over time of the conveyance object by using a portion of temperatures extracted from the time-series data of the plurality of measurement areas.

A metrology system may measure thermal conductance across an interface between a first material layer bonded to a second material layer. The first material layer may include a first outward facing and the second material layer may include a second outward facing surface. The system may include a heating source which provides periodically varying heat across the first outward facing surface, and a heat sink in contact with the second outward facing surface. The system may further include a first thermal measurement device configured to measure a temperature of the first outward facing surface, and a second thermal measurement device configured to measure a temperature of the second outward facing surface. The system may generate, based on a plurality of measurements acquired over time, a thermal conductance measurement across the interface between the first material layer bonded to the second material layer.

Techniques for facilitating non-uniformity correction calibrations are provided. In one example, an infrared imaging system includes an infrared imager and a logic device. The infrared imager is configured to capture a first set of infrared images of a reference object using a first integration time. The infrared imager is further configured to capture a second set of infrared images of the reference object using a second integration time different from the first integration time. The logic device is configured to determine a dark current correction map based on the second set of infrared images. The logic device is further configured to generate a non-uniformity correction map based on the dark current correction map. Related devices and methods are also provided.

Techniques for facilitating non-uniformity correction calibrations are provided. In one example, an infrared imaging system includes an infrared imager and a logic device. The infrared imager is configured to capture a set of infrared images of a reference object. The reference object is substantially at a single temperature. The logic device is configured to initiate a run-time calibration of the infrared imager and generate a gain map based on the set of infrared images and an offset map associated with the infrared imager. Related devices and methods are also provided.