The present invention relates to a wireless power transfer apparatus performing communication with a wireless power reception apparatus. The wireless power transfer apparatus includes a housing having one surface with an opening, a coil part disposed within the housing and configured to transmit a wireless power signal to the wireless power reception apparatus, a temperature sensor disposed within the housing to overlap the opening, and configured to measure temperature of an object through the opening, and a power transmission control unit configured to control the coil part based on the temperature measured by the temperature sensor.

A thermal monitoring system includes thermal monitoring devices that generate sensor data including thermal images depicting monitored elements (e.g. of an electrical switchgear system). The sensor data for all monitoring devices installed at a local deployment is collected by a gateway device, and relevant data from multiple local deployments is further aggregated by a cloud management system for further analysis. New event triggering rules determining how the thermal monitoring devices filter or record the sensor data are generated based on the aggregated data during a continuous learning process. The system detects patterns in the sensor data for the monitoring devices and/or local deployments as a whole and tracks deviations from these patterns, improving the accuracy of the event detection over time.

An electrical equipment diagnostic system can include an electrical equipment and a sensor device controlled by a user that takes a first measurement of a first parameter of the electrical equipment while the electrical equipment is operating. The system can also include a controller communicably coupled to the sensor device, where the controller includes a storage repository, where the storage repository includes at least one threshold value and at least one algorithm. The controller can receive the first measurement from the sensor device, and process the at least one first algorithm using the first measurement. The controller can also identify a problem with the electrical equipment based on results of the at least one first algorithm, and instruct the user to perform specific tasks to correct the problem with the electrical equipment.

A luminaire comprises at least one light emitting diode (LED) as a light source. Such LED comprises a limited light emitting angle for the emitted light radiation. Outside of the light emitting angle, an infrared sensor is assigned to the light source for detecting its temperature.

A thermal monitoring system includes at least one of an infrared sensor and a plurality of infrared sensors arranged in an array. Each infrared sensor has a resolution including a plurality of pixels. A controller is configured to create a thermal image of an area to be monitored based at least in part on the plurality of pixels of each infrared sensor. A thermal monitoring assembly includes an electrical panel including a plurality of electrical components located within the electrical panel. The at least one of an infrared sensor and the plurality of infrared sensors arranged in an array, either alone or in combination with additional sensors, are located inside the electrical panel. Methods of monitoring various parameters including a temperature of the plurality of electrical components located inside the electrical panel are also provided.

A device for making EMC test measurement is provided, the device comprising a measurement cell configured as a mobile box. The box comprises an opening at one side, which may be opened and closed again at least partially, where the opening is configured such that a system to be inspected can be introduced into the interior of the box through it. The interior of the box is subdivided into two areas, a measurement device can be arranged in either one of the areas, and the system to be inspected can be arranged in the other area. The subdivision of the interior of the box into two areas results from a plate, wherein the plate comprises an absorber layer, a damping layer, or a shielding layer, in order to prevent disturbances of the system to be inspected by the measurement devices.

A method for determining the temperature of a strand comprises disposing the strand along a background radiator of known temperature. Receiving the strand using a spatially resolving thermal imaging sensor in front of the background radiator while the strand is being disposed along its longitudinal axis. Forming an integral across a measuring value area, the integral configured to detect a complete strand portion located in front of the background radiator of the thermal imaging sensor. deducing the temperature of the strand by comparing the formed integral with a reference value.

An inexpensive thermopile temperature detector is particularly adapted to monitoring of electrical equipment, such as a power bus bar, within an enclosed area such as a cabinet. The detector may have a plastic housing, a thermopile sensor and a plastic Fresnel lens. Each sensor also includes a calibrated element such that, but for calibration, the same sensor may be used for various applications for different target sizes and distance or, more generally, with respect to effective target percentage of field of view.

A method and apparatus for monitoring a remote location, such as a data centre, and in particular updating a computer model representation of the remote location based on measured temperature readings. The method includes: i) identifying a measurement point in a computer model representation of the remote location; ii) selecting an infrared temperature sensor in the computer model capable of taking a temperature measurement of the measurement point; iii) determining an orientation for the infrared temperature sensor to assume to take the temperature measurement of the measurement point; iv) instructing the infrared temperature sensor at the remote location to orient itself according to the determined orientation and to take a temperature measurement; v) receiving the temperature measurement from the infrared temperature sensor at the remote location; and vi) updating the computer model representation to assign a temperature to the measurement point based on the received temperature measurement.

A semiconductor wafer held in a chamber by a susceptor is heated by irradiating the semiconductor wafer with light directed through an upper chamber window and a lower chamber window. A radiation thermometer measures the temperature of the semiconductor wafer held by the susceptor. A temperature correction part corrects temperature measurement of the semiconductor wafer with the radiation thermometer, based on the value of temperature measurement of the upper chamber window, the value of temperature measurement of the lower chamber window, and the value of temperature measurement of the susceptor. Thus, the temperature of the semiconductor wafer is accurately measured irrespective of the temperatures of in-chamber structures including the susceptor and the like.