The present techniques generally relate to a system and methods for remotely monitoring the interior of a closed electrical enclosure for localized heating (e.g., hot spots). In general, the monitoring system includes features designed to detect one or more hot spots within a dim or dark environment, determine the location of the hot spot within the enclosure, determine a temperature range of the hot spot, and/or notify (e.g., alarm or alert) an operator upon detection of the hot spot. The monitoring system may include one or more temperature sensitive elements configured to determine the heating of potential hot spots within the electrical enclosure. Further, the foregoing features may be designed to allow one or more electrical enclosures to remotely communicate with computer equipment (e.g., workstation or general purpose computers) over a wireless network.

Discussed is a battery pack diagnosis method including a battery pack manufacturing process, a battery cell charging and discharging process, a battery pack thermal image photographing process, a thermal image reading process, a battery pack magnetic field image photographing process, a magnetic field image reading process, and a wire bonding state defect determining process of finally determining a bonding state of a battery cell and a wire by combining thermal image reading result information obtained in the thermal image reading process and magnetic field image reading result information obtained in the magnetic field image reading process in order to exactly diagnose the bonding state of the battery cell and the wire connecting the battery cell in the battery pack.

A method and a device for measuring a temperature of a wire rod, a storage medium, and a computer device are disclosed. The method includes: determining an effective temperature measurement area according to the infrared thermal image and feature information of the wire rod; projecting preset light onto the wire rod geometric model, tracing a light propagation path of the preset light, and calculating an effective emissivity based on a tracing result of the light propagation path; and correcting temperature measurements in the effective temperature measurement area based on the effective emissivity to obtain a corrected temperature measurement result. The infrared thermal image is acquired, and is analyzed by image processing, thereby dynamically capturing the effective temperature measurement area. The effective emissivity between wire rods is calculated, and then the measured temperature of the wire rod is corrected, thereby improving the accuracy and stability of temperature measurement on wire rods.

A thermal monitoring system includes at least one of an infrared sensor and a plurality of infrared sensors arranged in an array. Each infrared sensor has a resolution including a plurality of pixels. A controller is configured to create a thermal image of an area to be monitored based at least in part on the plurality of pixels of each infrared sensor. A thermal monitoring assembly includes an electrical panel including a plurality of electrical components located within the electrical panel. The at least one of an infrared sensor and the plurality of infrared sensors arranged in an array, either alone or in combination with additional sensors, are located inside the electrical panel. Methods of monitoring various parameters including a temperature of the plurality of electrical components located inside the electrical panel are also provided.

A method for online monitoring of temperature in current terminal blocks based on thermal imaging are provided, including: obtaining real-time temperature distribution information of current terminals of a terminal box; using an external communication substation to upload the obtained real-time temperature distribution information to the secondary intelligent operation-and-maintenance control platform; determining whether there is an abnormality in temperature of the current terminals, if there is an abnormality, issuing an alarm message about potential danger for an open circuit of a current secondary circuit. The method provided by the present invention has a self-verification function of measurement data and can suppress the influence of ambient temperature. Through aggregation analysis of the temperatures of different current terminals of the terminal box, historical data mining of the temperature of the same current terminal is carried out to identify the hidden dangers of the open circuit of the current secondary circuit.

An infrared sensor positioned in a reflow oven includes a reflow oven and a first IR sensor turret suspended over a conveyor surface of the reflow oven, where a directional movement of the first IR sensor turret matches a directional movement of the conveyor surface. A method for managing the IR sensor turret positioned in a reflow oven includes locating, by a first IR sensor turret, a point of interest on a PCBA, where the PCBA is positioned on a conveyor in a reflow oven. The method further includes tracking, by the first IR sensor turret, the point of interest on the PCBA, where the PCBA is moving along the conveyor in the reflow oven. The method further includes capturing, by the first IR sensor turret, a first set of thermal data at the point of interest for a first subarea of the reflow oven.

Various embodiments include heat and volatile-organic-compounds detecting systems. In one example, the heat-detecting system includes at least one heat sensor mounted externally to a device, such as a local power-box (LPB). The heat sensor has an area-of-detection to detect heat emitted from at least one face of the LPB at one or more locations. The heat-detecting system also includes a high-absorptance infrared-collector (HAIC) formed within the LPB to collect excessive heat generated by a component within the LPB. The excessive heat is correlated to a pre-determined temperature level, and a temperature of the collected excessive heat is measured by the heat sensor. Each of the heat sensor and the HAIC are coupled to a control module. Other apparatuses, designs, and methods are disclosed.

According to one aspect, a method for remote monitoring of electrical equipment includes acquiring a set of data points, each data point representing a temperature associated with a piece of electrical equipment or a component thereof, assigning each data point to one or more groups of data points, and defining an alarm metric for each group. Each group's alarm metric may be defined independently of other group's metrics. The defined alarm metrics are used to determine the health of the electrical equipment. The data may be determined from virtual probes within an infrared sensor and/or received from RFID devices containing temperature sensor, which are attached to or near the equipment to be monitored, for example. The methods described herein do not require conversion of sensor data into temperature values, and thus obviate the need for expensive sensors and/or computationally demanding conversion, compensation, and calibration routines.

The present invention discloses a method for measuring an actual temperature of a flame by using all information of a radiation spectrum and a measurement system thereof. The method includes: conducting more theoretical data processing by using energy level structure correction, wherein all information of the radiation spectrum can be used; and by way of a keyboard input manner or a data transmission input manner, acquiring an energy level structure correction parameter, and finally acquiring a more accurate actual temperature value of a measured flame. The method effectively overcomes a defect that the true temperature of the flame can be obtained by only conducting radiance correction through data processing with great calculations when adpted multi-spectral temperature measurement method. In the existing multi-spectral temperature measurement method at present, only information of several monochromatic radiation capacities in the radiation spectrum can be used; and in the method, information of all the monochromatic radiation capacities, thousands of monochromatic radiation capacities in general, in the radiation spectrum can be used.

Dynamic Digital Modulation obtains thermal image data on active semiconductor devices with sufficient sensitivity to be used in situ with packaged devices. These techniques can be applied to dynamic failures, but can also produce quantitative data of actual power dissipation as the device is placed into different operational modes. The thermal image results can be analyzed to assist in thermal management and assessing reliability and failure analysis issues in semiconductor devices.