The present disclosure relates to a circuit breaker opening/closing assistance apparatus for correcting a thermal image of a circuit breaker on the basis of a visible image of the circuit breaker, and assisting an opening/closing operation of the relevant circuit breaker on the basis of a temperature identified through the corrected thermal image. Further, the present disclosure relates to a circuit breaker opening/closing assistance apparatus for identifying a temperature of a circuit breaker in which a failure has occurred, on the basis of a thermal image of the circuit breaker, and assisting an opening/closing operation of the relevant circuit breaker on the basis of the identified temperature.

The present invention relates to a temperature measurement device of a microcontroller of a battery management system (BMS) and a method therefor, and enables accurate temperature measurement of a microcontroller while facilitating channel utilization by connecting a temperature measurement device for a microcontroller and a temperature measurement device for an application to one channel of the microcontroller.

An edge radiation thermometer performs measurements before a semiconductor wafer is transported into a chamber. The edge radiation thermometer performs the measurements while the semiconductor wafer is supported by lift pins and while the semiconductor wafer is placed on a susceptor, after the semiconductor wafer is transported into the chamber. A controller calculates a reflectivity of the semiconductor wafer based on these measurement values. Then, the controller calculates an intensity of an ambient light receive by the edge radiation thermometer, based on the reflectivity and an intensity of synchrotron radiation radiated from a quartz window. Subsequently, the controller subtracts the intensity of the ambient light from an intensity of light received by of the edge radiation thermometer during heat treatment on the semiconductor wafer to calculate the temperature of the semiconductor wafer.

An infrared temperature sensor comprises a first communication port and a second communication port. A plurality of infrared temperature sensors can be cascaded to each other and connected to an external host controller through the second communication port. The external host controller can set up and administer the unique addresses of the plurality of the infrared temperature sensors through the second communication port, whereby to selectively perform multicasting communication or unicasting communication with the plurality of infrared temperature sensors through the first communication port. The infrared temperature sensor further comprises a second thermopile sensing element used to sense the thermal radiation of a package structure, whereby to compensate for the measurement error induced by temperature variation of the package structure. Thus, the measurement accuracy is increased.

A temperature abnormality detection device includes a plurality of infrared temperature sensors respectively capable of detecting temperature in a different detection area of an equipment, and a device body including a temperature abnormality determination unit that determines that the temperature in the detection area detected by each of the plurality of infrared temperature sensors is abnormal when the temperature in the detection area is higher than a reference temperature. The plurality of infrared temperature sensors is connected to each other by crossover wiring.

A thermal monitoring system includes thermal monitoring devices that generate sensor data including thermal images depicting monitored elements (e.g. of an electrical switchgear system). The sensor data for all monitoring devices installed at a local deployment is collected by a gateway device, and relevant data from multiple local deployments is further aggregated by a cloud management system for further analysis. New event triggering rules determining how the thermal monitoring devices filter or record the sensor data are generated based on the aggregated data during a continuous learning process. The system detects patterns in the sensor data for the monitoring devices and/or local deployments as a whole and tracks deviations from these patterns, improving the accuracy of the event detection over time.

An eye tracking device includes a substrate comprising a first substrate portion and a second substrate portion intersecting with the first substrate portion, an infrared light emitting element on the first substrate portion, and an image acquisition element on the second substrate portion. The infrared light emitting element is configured to emit infrared light to a user's eyeball. The image acquisition element and the infrared light emitting element are non-coplanar. The image acquisition element is configured to receive and sense the infrared light reflected by the eyeball for imaging.

An infrared temperature sensor comprises a first communication port and a second communication port. A plurality of infrared temperature sensors can be cascaded to each other and connected to an external host controller through the second communication port. The external host controller can set up and administer the unique addresses of the plurality of the infrared temperature sensors through the second communication port, whereby to selectively perform multicasting communication or unicasting communication with the plurality of infrared temperature sensors through the first communication port. The infrared temperature sensor further comprises a second thermopile sensing element used to sense the thermal radiation of a package structure, whereby to compensate for the measurement error induced by temperature variation of the package structure. Thus, the measurement accuracy is increased.

Systems and methods for identifying thermal run-away events in a battery pack can include using infrared sensors to measure infrared radiation emitted by and reflected by subsets of the battery cells arrayed in a battery pack. Each infrared sensor can generate temperature data based on the received infrared radiation, which includes reflected infrared radiation for several and potentially many individual battery cells aligned in rows or columns within the battery pack. Each infrared sensor can sense the beginning of a thermal run-away event by sensing when an individual battery cell in the array has a temperature exceeding a threshold, and can generate a signal indicative of a thermal run-away event based on the detected excessive temperature.

In a method of determining a critical temperature of a semiconductor package, heat is applied to at least one semiconductor package. Temperatures of the semiconductor package are measured during the heating. Heights of the semiconductor package are also measured during the heating. A temperature of the semiconductor package measured at a point at which a height from among the measured heights of the semiconductor package is sharply increased so that swelling of the semiconductor package occurs is determined as the critical temperature of the semiconductor package. Thus, the critical temperature of the semiconductor package may be accurately determined.